• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.653-654
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• 2006

In case of ultrashort laser ablation of metals, the transfer of energy from the electronic system causing strong absorption of laser light to the lattice needs relaxation times of the order of some picoseconds. Under the above theoretical background, nickel was ablated using femtosecond, picosecond and nanosecond laser. As a result, nickel ablation by picosecond laser and femtosecond laser, which are called ultrashort laser, has similar machinability because of relaxation time of metals, whereas nanosecond Nd:YAG laser has lower absorption, higher thermalization effect in comparison with ultrashort laser.

• Laser Solutions
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• v.14 no.4
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• pp.14-20
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• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

• Laser Solutions
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• v.13 no.4
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.97-100
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• 2006

Picosecond (ps) laser micro-machining has emerged as an attractive method of fabricating high-precision microstructures, especially in metals. In this paper, a metallic mold for diffraction gratings is fabricated with a mode-locked 12 ps $Nd:YVO_4$ laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate line patterns. In order to minimize the line width, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.745-746
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.117-118
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.701-702
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• 2009

• Advances in nano research
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• v.12 no.6
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• pp.583-592
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• 2022

In this paper, a pulsed picosecond laser dressing method for bronze-bonded diamond wheel is studied systematically and comprehensively. The picosecond laser pulse ablation experiment is carried out, and the ablation thresholds of bronze-bonded and diamond abrasive particle are measured respectively. The results indicate that the single-pulse ablation thresholds of bronze-bonded are 0.89J/cm², 0.24J/cm² during strong/weak ablation stages. And the multi-pulse ablation thresholds of diamond abrasive particle are 1.69J/cm², 0.49J/cm² during strong/weak ablation stages. Obviously, diamond grains have less thermal damage during the process of gentle ablation. The diamond grains of the grinding wheel surface are graphitized during laser dressing. The bronze-bonded is relatively smooth and organizational stability, and the diamond grits have suitable prominent height, which are beneficial to maintain the good grinding performance of dressed bronze-bonded diamond grinding wheels.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.25-26
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• 2007