• 한국추진공학회지
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• 제12권3호
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• pp.1-8
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• 2008

본 연구에서는 고출력 레이저에 의한 고에너지 물질의 점화 현상 모델을 제시하였다. 본 모델에서는 강판에 긴 조사 시간을 가진 펄스 레이저를 조사하여 발생한 어블레이션에 의한 열 확산을 고려하였고, 수 kW의 continuous 레이저를 폭약에 조사하여 폭약이 열에 의하여 점화하는 현상을 실험 결과와 비교를 통해 검증하였다. 여기서는 매우 짧은 조사 시간(femto- 혹은 pico-second)을 가진 펄스 레이저에서 나타나는 전자에 의한 효과는 무시 되었다. 본 연구에 사용된 폭약은 RDX, TATB 그리고 HMX이며, 제시한 모델은 실험 결과와 흡사한 결과를 도출하였다.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2008년 영문 학술대회
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• pp.525-530
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• 2008

We present a model for simulating high energy laser heating and ignition of confined energetic materials. The model considers effect of ablation of steel plate with long laser pulses and continuous lasers of several kilowatts and the thermal response of well-characterized high explosives for ignition. Since there is enough time for the thermal wave to propagate into the target and to create a region of hot spot in the high explosives, electron thermal diffusion of ultra-short(femto- and pico-second) lasing is ignored; instead, heat diffusion of absorbed laser energy in the solid target is modeled with thermal decomposition kinetic models of high explosives are used. Numerically simulated pulsed-laser heating of solid target and thermal explosion of cyclotrimethylenetrinitramine(RDX), triaminotrinitrobenzene(TATB), and octahydrotetranitrotetrazine(HMX) are compared to experimental results. The experimental and numerical results are in good agreement.

• 한국광학회지
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• 제26권6호
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• pp.318-321
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• 2015

We demonstrate a frequency-resolved optical grating (FROG) device for measuring the intensity and phase versus time of several-tens-of-picoseconds laser pulses, using a thick nonlinear optical crystal. The huge pulse-front tilt generated by a holographic grating increases the temporal range of the device, which can make a single-shot measurement of laser pulses less than 100 ps in duration. To verify the measurement technique, we generate double pulses using a Michelson interferometer. The measured duration of a single pulse is about 300 fs and the measured maximum delay of two pulses is 60 ps, which implies that the proposed FROG device can measure laser pulses with maximum pulse width of about 120 ps.

• 한국레이저가공학회지
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• 제14권4호
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• pp.14-20
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• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.