• 제목/요약/키워드: Photovoltaic devices

검색결과 345건 처리시간 0.024초

ITO/PET 기판 위에 성장된 산화아연 나노로드에 형성된 은 입자의 광학적 특성 및 소수성 표면 연구 (Optical and Hydrophobic Properties of Ag Deposited ZnO Nanorods on ITO/PET)

  • 고영환;김명섭;유재수
    • 한국진공학회지
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    • 제21권4호
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    • pp.205-211
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    • 2012
  • 인듐주석산화막/폴리에틸렌 테레프탈레이트(ITO/PET: indium tin oxide/polyethylene terephthalate) 유연 기판 위에 성장된 산화아연(ZnO) 나노로드(nanorods)를 이용하여 형성된 은(Ag) 입자의 광학적 특성 및 소수성 표면에 대해 조사하였다. 시료를 준비하기 위해 스퍼터링법(sputtering)으로 코팅된 산화아연 씨드층(seed layer)을 이용하여 전기화학증착법(electrochemical deposition)으로 산화아연 나노로드를 성장시킨 후, 열증발증착법(thermal evaporation)을 사용하여 은을 증착하였다. 산화아연 나노로드의 불연속적인 표면 특성 때문에 은이 증착되면서 나노크기를 갖는 입자로 형성되었다. 비교를 위해 같은 조건으로 은을 평평한 ITO/PET에 증착하여 시료를 준비하였으며, 증착되는 은의 양을 조절하기 위해 100초에서 600초까지 열증발증착시간을 변화시켰다. 은 증착시간이 증가할수록 산화아연 나노로드 표면에 형성되는 은 입자의 크기와 양이 증가하였으며, 또한 빛의 흡수율이 가시광 영역에서 크게 증가하는 것을 확인하였다. 이는 은 입자의 국소표면플라즈몬공명(localized surface plasmon resonance)에서 기인된 것으로 짐작한다. 또한 물방울 테스트실험에서 평평한 ITO/PET에 증착된 은에서의 접촉각(contact angle)보다 산화아연 나노로드에 증착된 은 입자에서의 접촉각이 크게 증가함을 보여, 개선된 소수성 표면을 가질 수 있음을 확인하였다. 이러한 광학적 특성과 소수성 표면 결과는 산화아연 나노로드의 기반의 염료감응형 태양전지 또는 자정효과(self-cleaning)를 갖는 표면구조로 유연소자에 유용하게 응용할 수 있을 것으로 기대된다.

프탈이미드 유도체를 기본으로 하는 공액고분자의 합성과 특성, 그리고 태양전지의 적용 (Synthesis and Characterization of π-Conjugated Polymer Based on Phthalimide Derivative and its Application for Polymer Solar Cells)

  • ;하예은;김주현
    • 폴리머
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    • 제37권6호
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    • pp.694-701
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    • 2013
  • 프탈이미드 유도체와 티오펜 단량체들을 이용하여 새로운 고분자인 poly((5,5-(2-butyl-5,6-bisdecyloxy-4,7-dithiophen-2-yl-isoindole-1,3-dione))-alt-(2,5-thiophene))(T-TI24T)를 Stille법을 이용하여 합성하였다. T-TI24T의 수평균 분자량은 86500 g/mol로 매우 높으며 클로로포름, 1,2-디클로로벤젠, 톨루엔과 같은 용매에 매우 잘 용해된다. 또한 $380^{\circ}C$까지 매우 우수한 열적 안정성을 갖고 있다. T-TI24T는 꽤 낮은 호모에너지 준위(-5.33 eV)를 갖고 있다. 서로 다른 T-TI24T와 (6)-1-(3-(methoxycarbonyl)-{5}-1-phenyl[5,6]-fullerene(PCBM)의 무게비를 갖는 블렌드를 광활성층으로 하는 태양전지를 제작하여 특성을 살펴본 결과 고분자와 PCBM의 비율이 1:3일 때 가장 최적화된 결과를 보였으며, 이 때 광전변환 효율과 개방전압은 각각 0.199%와 0.99였다. T-TI24T 기반 태양전지들은 비록 매우 작은 광전변환 효율을 갖지만 잘 알려진 P3HT:PC61BM으로 구성된 태양전지와 비교해 큰 매우 큰 개방전압을 갖는다(약 0.5 V).

High-k ZrO2 Enhanced Localized Surface Plasmon Resonance for Application to Thin Film Silicon Solar Cells

  • Li, Hua-Min;Zang, Gang;Yang, Cheng;Lim, Yeong-Dae;Shen, Tian-Zi;Yoo, Won-Jong;Park, Young-Jun;Lim, Jong-Min
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.276-276
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    • 2010
  • Localized surface plasmon resonance (LSPR) has been explored recently as a promising approach to increase energy conversion efficiency in photovoltaic devices, particularly for thin film hydrogenated amorphous silicon (a-Si:H) solar cells. The LSPR is frequently excited via an electromagnetic (EM) radiation in proximate metallic nanostructures and its primary con sequences are selective photon extinction and local EM enhancement which gives rise to improved photogeneration of electron-hole (e-h) pairs, and consequently increases photocurrent. In this work, high-dielectric-constant (k) $ZrO_2$ (refractive index n=2.22, dielectric constant $\varepsilon=4.93$ at the wavelength of 550 nm) is proposed as spacing layer to enhance the LSPR for application to the thin film silicon solar cells. Compared to excitation of the LSPR using $SiO_2$ (n=1.46, $\varepsilon=2.13$ at the wavelength of 546.1 nm) spacing layer with Au nanoparticles of the radius of 45nm, that using $ZrO_2$ dielectric shows the advantages of(i) ~2.5 times greater polarizability, (ii) ~3.5 times larger scattering cross-section and ~1.5 times larger absorption cross-section, (iii) 4.5% higher transmission coefficient of the same thickness and (iv) 7.8% greater transmitted electric filed intensity at the same depth. All those results are calculated by Mie theory and Fresnel equations, and simulated by finite-difference time-domain (FDTD) calculations with proper boundary conditions. Red-shifting of the LSPR wavelength using high-k $ZrO_2$ dielectric is also observed according to location of the peak and this is consistent with the other's report. Finally, our experimental results show that variation of short-circuit current density ($J_{sc}$) of the LSPR enhanced a-Si:H solar cell by using the $ZrO_2$ spacing layer is 45.4% higher than that using the $SiO_2$ spacing layer, supporting our calculation and theory.

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New Approaches for Overcoming Current Issues of Plasma Sputtering Process During Organic-electronics Device Fabrication: Plasma Damage Free and Room Temperature Process for High Quality Metal Oxide Thin Film

  • Hong, Mun-Pyo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.100-101
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    • 2012
  • The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

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코발트실리사이드를 이용한 염료감응형 태양전지 상대전극의 신뢰성 평가 (Reliability of a Cobalt Silicide on Counter Electrodes for Dye Sensitized Solar Cells)

  • 김광배;박태열;송오성
    • 한국산학기술학회논문지
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    • 제18권4호
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    • pp.1-7
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    • 2017
  • 염료감응형 태양전지 촉매층으로 CoSi의 신뢰성을 확인하기 위해 전자빔증착기를 이용하여 100 nm-Co/300 nm-Si/quartz의 적층구조를 형성하고, $700^{\circ}C$-60분의 진공열처리하여 약 350 nm-CoSi를 형성하였다. 이때 잔류 Co를 제거하기 위해 $80^{\circ}C$-30%의 황산처리를 진행하였다. 또한 비교를 위해 100 nm-Pt/glass 상대전극을 준비하였다. CoSi 상대전극이 채용된 DSSC 소자의 신뢰성을 확인하기 위해 $80^{\circ}C$ 온도조건에서 0, 168, 336, 504, 672, 840시간동안 유지하였다. 이들을 채용한 DSSC 소자의 광전기적 특성을 분석하기 위해 solar simulator와 potentiostat을 이용하였다. CoSi 상대전극의 촉매활성도, 미세구조, 그리고 조성 분석을 확인하기 위해 CV, FE-SEM, FIB-SEM, EDS를 이용하여 분석하였다. 시간에 따른 에너지변환효율 결과, Pt와 CoSi 상대전극 모두 에너지변환효율이 504시간까지는 유지되다가 672시간 경과 후 처음의 50%로 감소하는 특성을 보였다. 촉매활성도 분석 결과, 시간이 지남에 따라 Pt와 CoSi 상대전극 모두 촉매활성도가 감소하여 각각 64%, 57%의 촉매활성도를 보였다. 미세구조 분석 결과, CoSi층은 전해질에 대한 안정성은 우수하였으나, 하부 쿼츠 기판과 CoSi층의 접촉면에 스트레스가 집중되어 국부적으로 크렉이 형성되며, 궁극적으로 ${\mu}m$급의 박리현상을 확인하였다. 따라서 CoSi 상대전극은 실리사이드화 되는 과정에서 잔류응력 때문에 열화가 일어나므로 신뢰성의 확보를 위해서는 이러한 잔류응력의 대책이 필요하였다.