• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.127-127
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• 2010

Owing to many advantages on indirect intersubband absorption from the hole miniband to the electron miniband based on the type-II band alignment in InAs/GaSb strained-layer superlattice (SLS), InAs/GaSb SLS infrared photodetector (SLIP) has emerged as a promising system to realize high-detectivity quantum photodetector operating up to room temperature in the spectral range of mid-infrared (MIR) to far-infrared (FIR). In particular, n-barrier-n (n-B-n) structure designed for blocking the majority-carrier dark current makes it possible for MIR/FIR dual-band SLIP whose photoresponse (PR) band can be exclusively selected by the bias polarity. In this study, we present the MIR and FIR photoresponse (PR) mechanism identified by dual-band PR spectra and photoluminescence (PL) profiles taken from InAs/GaSb SLIP. In the MIR/FIR PR spectra measured by changing bias polarity, each spectrum individually shows a series of distinctive peaks related to the transitions from the hole subbands to the conduction one. The PR mechanism at each polarity is discussed in terms of diffusion current, and a superposition of MIR-PR in the FIR-PR spectrum is explained by tunnelling of electrons activated in MIR-SLS. The effective FIR-PR spectrum decomposed into three curves for HH1, LH1, and HH2 has revealed the edge energies of 120, 170, and 220 meV, respectively, and the temperature variation of the MIR-PR edge energies shows that the temperature behavior of the SLS systems can be approximately expressed by the Varshni empirical equation.

• 한국진공학회지
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• 제20권1호
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• pp.22-29
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• 2011

InAs/GaSb 제2형 응력초격자(SLS)를 활성층에 탑재한 [$320{\times}256$] 초점면 배열(FPA) 적외선 열영상 모듈을 제작하고 열영상을 구현하였다. p-i-n형으로 설계된 소자의 활성층(i) 구조는 300 주기의 [13/7]-ML [InAs/GaSb]-SLS로 구성되어 있고, p와 n 전극층에는 각각 60주기의 [InAs:Be/GaSb]-SLS와 115 주기의 [InAs:Si/GaSb]-SLS 구조를 채용하였다. 시험소자의 광반응(PR) 스펙트럼으로부터 피크 파장(${\lambda}_p$)과 차단 파장(${\lambda}_{co}$)은 각각 ${\sim}3.1/2.7{\mu}m$과 ${\sim}3.8{\mu}m$이고 180 K 온도까지 동작을 확인하였다. 단위 화소의 간격/메사는 $30/24{\mu}m$ 규격으로 설계되었으며, [$320{\times}256$]-FPA는 표준 광묘화법으로 제작하였다. $18/10{\mu}m$의 In-bump/UBM 공정과 flip-chip 결합 기술을 적용하여 FPA-ROIC 열영상 모듈을 완성하였으며, 중적외선용 영상구동 회로 및 S/W를 활용하여 열영상을 시연하였다.