• Applied Chemistry for Engineering
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• v.5 no.4
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• pp.662-668
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• 1994

The cinnamoyl esters of polyresorcinol-formaldehyde glycidyl ether (RGEFC) with photosensitive functional group were prepared. Photosensitivity of RGEFC were investigated by the change of solubility before and after exposure to light. Various samples coated on glass plates were exposed to light under various conditions and steeped in the same solvent as used for coating, and then the yield of residual film was calculated. The yield of the residual film which was closely related to the sensitivity of the film, was affected by the degree of polymerization of the backbone resin, sensitizers and their concentration. The sensitivity was depended upon the degree of polymerization. Most effective sensititizer for RGEFC among the sensitizers used was 2,6-dichloro-4-nitroaniline.

• Journal of Sensor Science and Technology
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• v.28 no.4
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• pp.251-255
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• 2019

We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patterns cannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS) film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer was selectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Results showed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. In addition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.

• Polymer(Korea)
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• v.38 no.5
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• pp.640-644
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• 2014

As a process of plat panel display production, slot coating is widely used for the coating of photoresist on a wide glass substrate. A uniform coating thickness is important, and the coating uniformity is divided into nozzle and machine directions. The machine and nozzle directions coating uniformities are influenced by the operation condition of coater and flow uniformity inside the die, respectively. Non-uniform coating during steady coating process occurs according to those factors, however, non-uniform coating along the machine and nozzle directions has been observed at the beginning of coating by unsteady flow. In this study, steady and unsteady state flow simulations have been performed and compared with experiment to examine the causes of non-uniform coating. Computational results exhibited that it took a time to get a uniform pressure distribution at whole inside the die, and during this period of time edge regions showed lower exit velocity compared with center region. Subsequently edge regions had thinner coated layers than center region. However edge regions showed higher exit velocity than center region after steady state, and this made edge regions had thicker coated layer than center region.

• Journal of the Korean Institute of Telematics and Electronics
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• v.19 no.5
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• pp.5-11
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• 1982

The dielectric slab waveguide is fabricated on the slide glass or oxidized silicon wafer, by spin coating polyurethane, epoxy or photoresist, and the phenomenon of dielectric waveguiding is oboerved. Using the fact that the refractive index of K.P.R. is larger than that of polyurethane, thin film prism with two layered structure is fabricated, and the refraction of light is observed.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1706-1707
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• 2011

SU-8 감광제를 이용하여 전기 수력학에 응용할 수 있는 내경 $50{\mu}m$인 평면형 노즐 구조와 외경 $100{\mu}m$, 내경 $50{\mu}m$인 돌출형 노즐 구조를 제작하고 노즐 표면에 불소계 수지를 건식 증착하여 소수 처리를 하였으며 이를 통해 전기수력학 방식의 잉크 토출을 구현하였다.

• Journal of the Korean Graphic Arts Communication Society
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• v.28 no.1
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• pp.65-75
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• 2010

Environmentally friendly, stencil and screen printing for cost-effective for maskless. In this study, UV -LED light source for the dispersion characteristics and high competence photoresist coating was prepared. Wavelength of 365nm UV-LED exposure device using the maskless lithography, 1.7kgf/$cm^2$ $2600mmH_2O$ the injection pressure and the suction pressure by using a dry photoconductor symptoms were dry emulsion on the market as a result, curing properties and adhesion, hardness, solvent resistance and excellent reproduction of fine patterns and ecological stencil technology was available and could be confirmed as a possibility.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

• Journal of the Optical Society of Korea
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• v.19 no.4
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• pp.376-381
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• 2015

Transmission characteristics of long-period fiber gratings (LPFGs) fabricated by periodically etching a conventional single-mode fiber (SMF) are investigated. After coating the SMF with photoresist, the cladding of the SMF is symmetrically and periodically removed by using a wet etching technique resulting in the formation of the LPFG. Tensile strain reinforces the coupling strength between the core and the cladding mode based on the photoelastic effect. The extinction ratio of the SMF-based LPFG at a wavelength of 1550.8 nm is measured to be -15.1 dB when the applied strain is $600{\mu}{\varepsilon}$. The ascent of ambient index shifts the resonant wavelength to shorter wavelength because of the increase of the effective refractive index of the cladding mode. The extinction ratio is diminished by increase in the ambient index because of the induction of the optical attenuation of the cladding mode. The transmission characteristics of the proposed LPFG with variations in torsion are also measured. The photoelastic effect based on torsion changes the extinction ratio and the resonant wavelength of the proposed SMF-based LPFG. The polarization-dependent loss of the LPFG is also increased by torsion because of the torsion-induced birefringence. The polarization-dependent loss of the LPFG at torsion of 8.5 rad/m is measured to be 3.9 dB.

• Journal of Biosystems Engineering
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• v.33 no.4
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• pp.282-287
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• 2008

Love wave is one of the shear horizontal waves and it can propagate between two layers in liquid without energy loss. The SAW (surface acoustic wave) sensor using Love wave is very useful for real time measurement of the viscosity of liquid with high sensitivity. In this study, the 77 MHz and 155 MHz Love wave SAW sensors were fabricated and use to measure the viscosity of low viscous liquid. To generate the surface acoustic wave, the inter-digital transducers were fabricated on the quartz crystal wafer. In order to obtain the optimal thickness of the coating film (novolac photoresist) generating the Love wave on the surface of SAW device, theoretical calculation was performed. The performances of fabricated Love wave SAW sensors were tested. As test liquid, pure water and glycerol solutions having different concentrations were used. Since the determination coefficients of the regression equations for measuring the viscosity of liquid are greater than 0.98, the developed Love wave SAW sensors in this study will be very useful for precise measurement of viscosity of liquid.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.834-836
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• 2008

We demonstrated micro-scale conducting polymer patterning based on a selective surface treatment. A substrate with a patterned photoresist was immersed into OTS (Octadecyltrichlosilnae) solution. The protected substrate areas were hydrophilic after removing the PR resist, where a conducting polymer solution was coated selectively by spin-coating method.