• 한방안이비인후피부과학회지
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• 제22권2호
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• pp.210-222
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• 2009

Objectives : This study is to investigate the effect of the sasang constitutional prescription with peeling and MTS on Acne patients. Methods : We treated 81 acne patients with sasang constitutional prescription with peeling and MTS. After treatments we compared the before and after photos, and estimated by Korean Acne Grading System. Results & Conclusions : 1. Patients were comprised of 59 females and 22 males. And there were 30 adolescent and 51 postadolescent acne patients. Out of 81 acne patients, there were many 41 postadolescent female acne patients. 2. Sasang constitutional distribution was comprised of 74 Soyangin, 5 Soeumin and 2 Taeeumin 3. Yangkyuksanhwa-tang(48.1%) and Yangdokbackho-tang(40.7%) were used much in 81 acne patients. 4. Before the treatment, 92.3% of Yangkyuksanhwa-tang group and 63.6% of Yangdokbackho-tang group had mild acne symptom and acne grade mean of Yangdokbackho-tang group was higher than another groups. 5. Peeling times mean of 81 acne patients was 2.54 times and MTS times mean was 4.57 times. Acne grade was improved when peeling times were higher. 6. Before the treatment, 81 acne patients were comprised of 81.5% mild symptom and 18.5% severe symptom patients and acne grade mean was 2.75. After the treatment. there were only mild symptom patients and acne grade mean was 1.04.

• Journal of Biosystems Engineering
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• 제31권2호
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• pp.121-127
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• 2006

An Altari radish pre-processing system, which feasible to process automatically such operations as leaf and root tail cutting and root peeling, for kimchi production was accomplished based on the foregone serial studies. In this study, the performances of the developed prototype machine, considered as a commercializing level, were analyzed and evaluated. The prototype machine attached Tiny PLC automatic control system was performed the sequent function as the rate of successful peeling was more than 98% for the Altari radish less than 70 mm diameter of a radish. The operating efficiency of this was 9 see/each, 128 kg/h, and it means as much as $5{\sim}6$ times that of a woman labor's. The sanitation and taste of the mechanized-processed Altari radish kimchi was almost same as that of the handmade. And they were suitable for manufactory of kimchi as the both short term ripening and storing kimchi. Developed machinery with one peeling device and two peeling devices that compared with hand processing, it was analyzed that the break-even yearly working days were 28 days and 19 days, and the break-even yearly processing amount were 28,700 kg, 32,400 kg, respectively.

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 1997년도 하계 학술대회 논문집
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• pp.150-156
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• 1997

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 2005년도 동계 학술대회 논문집
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• pp.216-219
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• 2005

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 1999년도 하계 학술대회 논문집
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• pp.214-220
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• 1999

일반적으로 농산물의 박피작업의 목표는 박피된 농산물이 좋은 품질과 최소의 손실율로서 최대의 박피효율을 가지는 것이다. 밤의 화염박피 경우에는 제 1보 화염박피 특성에서 알 수 있듯이 박피율이 증가하면 화염박피 밤의 품질과 생율로 유통시에는 손실율과 밀접한 관계를 가지는 열침투 깊이도 증가한다. 이러한 열침투 깊이는 화염박피 밤의 사용용도에 따라 다르게 나타난다. 화염박피 밤을 생율로 유통시에는 열침투 부분을 제거해야 하므로 열침투 깊이가 적을수록 손실율이 적게 나타난다. 그러므로 생율로 유통시에는 손실율을 고려하여 열침투 깊이를 선정해야한다. 가공제품의 원료로 사용할 때에는 가공특성에 따라 열침투 깊이를 선정해야 한다. 쨈 등의 원료로 이용시에는 열침투 깊이가 커져도 사용 가능할 것이며, 박피밤 상태에서 당침투가 필요한 마론그랏세 등의 가공제품에서는 열침투 깊이를 제한할 필요가 있다. (중략)

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 1999년도 하계 학술대회 논문집
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• pp.205-213
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• 1999

밤의 세계 생산량은 1970 년대 연평균 약 45만 톤에서 1980 년대에 50만 톤으로 증가하였으며, 1990 년대에는 약 45만 톤을 유지하고 있다. 주요 생산국으로는 우리나라를 비롯해 중국, 터키, 이탈리아 등이며, 생산된 물량이 세계 전체 생산량의 약 75%를 차지하고 있다. 1995 년도 기준으로 국가별 생산현황은 중국이 24%, 터키 17%, 이탈리아 16%, 일본이 7%를 차지하고 있으며, 우리나라는 세계 제 2위의 생산국으로 93,655 톤을 생산하여 세계 생산량의 20%를 차지하고 있다. 밤은 국내에서 단일 농산물로서는 수출이 가장 많은 작물로서 1971 연도이래 꾸준히 증가하여 1996 년도에는 29,450톤을 수출하여 수출액이 1억1천2백만불을 달성하는 높은 실적을 나타냈다. (중략)

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 2005년도 동계 학술대회 논문집
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• pp.240-244
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• 2005

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 2005년도 동계 학술대회 논문집
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• pp.236-239
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• 2005

• 한국정밀공학회지
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• 제16권7호
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• pp.210-218
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• 1999

Sheet deposition type rapid prototyping system have many advantages : high build speed, low operating cost, large part size, no phase change, no need for support generation, and forth. However, those sheet deposition type rapid prototyping system require an additional post processing to remove excessive material attached to the part. This post processing is time consuming and labor intensive. Moreover, it is difficult for those system to fabricate parts with hollow cores and internal cavities. A new sheet deposition type rapid prototyping system that minimizes the post processing is proposed. The proposed system automatically removes excessive material in a peeling-off process between two cutting processes. In this way, the proposed system can reduce the post-processing time and cost as well as the limitation of the feasible geometric shapes in the conventional sheet deposition system.

• 융복합기술연구소 논문집
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• 제5권1호
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• pp.13-17
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• 2015

In wafer level molding progress, the thermal releasing failure phenomenon is shown up as the important problem. This phenomenon can cause the problem including the warpage, crack of the molded wafer. The thermal releasing failure is due to the insufficiency of adhesion strength degradation of the molding tape. To solve this problem, we studied experimental method increasing the release property of the molding tape through the plasma surface treatment on the wafer substrate. In this research, the vacuum plasma treatment system is used for release property improvement of the molding tape and controls the operating condition of the hydrophilic($O_2$, 100kW, 10min) and hydrophobic($C_2F_6$, 200kW, 10min). In order to perform the peeling test for measuring the releasing force precisely, we remodel the micro scale material property evaluation system developed by Korea institute of industrial technology. In case of hydrophilic surface treatment on the wafer substrate, we can figure out the releasing property of molding tape increase. In order to grasp the effect that it reaches to the release property increase when repeating the hydrophilic treatment, we make an experiment with twice treatment and get the result to increase about 12%. We find out the hydrophilic surface treatment method using plasma can improve releasing property of molding tape in the wafer level molding process.