• Composites Research
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• v.22 no.4
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• pp.13-19
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• 2009

Adhesive joints are widely used for structural joining applications in various fields and environmental conditions. Polyurethane adhesive is using for LNG carrier with cryogenic temperature condition. Even if similar polyurethane adhesive is used for different substrate, it shows different adhesion properties. Specially, variation of adhesion properties depending on the resin system or fiber is very important factor for selection of adhesive on industrial application. In present study, we got different peel strength according to the different test temperature when different polyurethane adhesive was used for same fiber reinforced composite. The main cause was investigated using by SEM and it was proven that the different adhesion property between glass fiber on composite surface and polyurethane adhesives at cryogenic temperature.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.5
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• pp.445-450
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• 2011

We studied the adhesion characteristics of polymer films (PC, PET, EVA) treated by atmospheric pressure plasma. The process parameters were the frequency, gas flow, and treatment time; we studied the effects of these parameters on the adhesion characteristics of the polymer materials. We used de-ionized water and diiodomethane as the polar and nonpolar solvents, respectively, for measuring the contact angles, and subsequently calculated the surface free energy of each polymer film. The adhesion characteristics were studied by carrying out a $180^{\circ}$ peel-off test. The polymer films treated with plasma developed a hydrophilic surface, which led to increased surface free energy and improved adhesion properties. From the results for contact angle, surface free energy, and adhesion strength, we obtained the optimal plasma-treatment conditions.

• Journal of Adhesion and Interface
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• v.16 no.4
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• pp.156-161
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• 2015

In this study, waterborne polyurethane acrylate were synthesized with polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylol propionic acid (DMPA), acrylate monomer to improve the properties and peel strength. In addition, the properties of the synthesized waterborne polyurethane acylate was evaluated through FT-IR, particle size analysis, UTM, peel strength. As the acrylic acid content increased, particle size increased. In the results of mechanical properties, when the acrylic acid contents increased, tensile strength was increased but elongation was decreased. All peel strength was improved as the acrylic acid contents of WPUA and acrylate ratio of PU/acrylate increased. Optimum peel strength obtained when acrylic acid was 0.5 wt%.

• Korean Journal of Metals and Materials
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• v.47 no.10
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• pp.675-680
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• 2009

Effects of $85^{\circ}C/85%$ Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a $180^{\circ}$ peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from $37.4{\pm}5.6g/mm$ to $22.0{\pm}2.7g/mm$ for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.

• Journal of the Korean Applied Science and Technology
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• v.18 no.4
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• pp.316-324
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• 2001

To prepare an acrylic type pressure-sensitive adhesive, quarternary polymers were synthesized from butyl acrylate (BA), 2-ethyl hexyl acrylate (2-EHA), methyl methacrylate (MMA), and 2-hydroxy ethyl methacrylate (2-HEMA). The quarternary polymers were identified by FT-IR and Molecular weight was measured by Gel Pearmeation Chromatography. Also, viscosity, solid content and peel strength were examined. The peel strength was 160 $g_{f}/25$ mm when the volume ratio of feed monomer to solvent was 1.3:1, and the ratio was relevant to commercial usage. The pot life of adhesive was 30 sec at the 50 m/min of heat treatment rate at, and it indicated that the minimum drying time was 30 sec. In weathering resistance test, peel strength of $160{\sim}180$ $g_{f}/25$ mm after 1000 h, with no residual remains on the adhesive surface.

• Textile Coloration and Finishing
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• v.17 no.6 s.85
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• pp.36-41
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• 2005

The effects of low temperature plasma treatment on the properties of three types of foams, polyurethane(PU), injection phylon(IP), and phylon(PH) that used for footwear mid-sole were examined. The change of surface properties of foams were characterized by electron scanning microscope, contact angle measurement, and universal testing machine. Adhesion was tested by T-peel tests of plasma treated foams/polyurethane adhesive joints. The contact angle of three types of foams were decreased dramatically with the plasma treatment time, specifically noticeable in the case of phylon(Ph). It has shown the relationship with the contact angle of phylon(PH) and the distance between electrode and samples. The peel strength of foams were increased with the increase of plasma treatment time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.5
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• pp.450-456
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• 2005

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and Surface Roughness Tester. Adhesion was obtained from T-peel tests of semiconductive layer haying different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the creation of O-H and C=O. It is observed that adhesion performance was determined by surface energy and roughness level of silicone surface. It is found that at dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Journal of Surface Science and Engineering
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• v.29 no.3
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.2
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• pp.153-157
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• 2006

In this work, the effects of plasma treatment on surface properties of semiconductive silicone rubber were investigated in terms of X-ray photoelectron spectroscopy (XPS) and contact angles, The adhesion characteristics of semiconductive-insulating interface layer of silicone rubber were studied by measuring the T-peel strengths, The results of the chemical analysis showed that C-H bonds were broken due to plasma discharge and Silica-like bonds(SiOx, x=3${\~}$4) increased, It is thought that semiconductive silicone rubber surfaces treated with plasma discharge led to an increase in oxygen-containing functional groups, resulting in improving the degree of adhesion of the semiconductive-insulating interface layer of silicone rubber. However, the oxygen plama for 20 minute produces a damaged oxidized semiconductive silicone rubber layer, which acts as a weak layer producing a decrease in T-peel strength, These results are probably due to the modifications of surface functional groups or polar component of surface free energy of the semiconductive silicone rubber.