• Title/Summary/Keyword: Peel Strength

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Thickness Effects of Coupling Agent on Residual Bending Stress in $Polyimide/SiO_2$ Joints ($Polyimide/SiO_2$ 접합체에서 잔류굽힘응력에 미치는 Coupling Agent 두께의 영향)

  • Kong, Do-Il;Park, Chan-Eon;Hong, Seung-Taek;Yang, Hoon-Chul;Kim, Ki-Tae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.23 no.7 s.166
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    • pp.1085-1093
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    • 1999
  • Thickness effects of coupling agent on residual bending stress were investigated in $Polyimide/SiO_2$ joints during thermal cycling. Thickness and peel strength of $\gamma$-APS coupling agent were measured and correlated with solution concentration and residual bending stress. The variation of residual bending stress with temperature was also measured for various thicknesses of the coupling agent. Finite element results were compared with experimental data for residual bending stress in $Polyimide/SiO_2$ joints.

Development of Mash-Seam Welding Process by Flat Electrode Continuous Welding (평판전극 연속타점에 의한 매쉬심 용접기법 개발)

  • 조상명;조호재
    • Journal of Welding and Joining
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    • v.21 no.5
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    • pp.513-517
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    • 2003
  • Resistance welding processes are widely used in automotive applications. In particular, Mash-Seam resistance welding is typically used in Tailored Blank process. If spot welds are changed to a continuous weld, it's easy to reduce noise and to be more stable in cars. A arc welding, laser welding, seam welding using wheel electrode are available to make continuous welds on a car body, but they demand operator with advanced skills and expensive cost to develop. Therefore, flat electrode continuous mash-seam resistance welding process has been used to improve the weak points in currently available system in lap seam welding. This developed process has much more strength and air tightability, and also has much better plastic workability than laser welding. Moreover, commercial RSW machine can be readily used in this welding process.

Evaluation of Resistance Spot Welding Weldability of Aluminum Alloy 5000 Series (SPOT 용접을 이용한 알루미늄계 합금의 용접성 평가)

  • 고준빈;염동빈;최병길;이성구;김엄기
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.3
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    • pp.8-13
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    • 2002
  • In order to obtain the basic informations for the development of high strength and high weldability aluminum alloy sheets, the experimental study was carried out to evaluate resistance spot welding characteristics and welding parameters (welding current, welding time, electrode force) far the aluminum alloy sheets. The mechanical properties of spot weld of aluminum alloy were evaluated by tensile shear test and by peel test at room temperature and also the welding possible zone was established through variation of current electrode force and welding time.

Surface-Properties of Poly(Ethylene Terephthalate) Fabric by In-line Atmospheric Plasma Treatments (연속 대기압 플라즈마를 처리한 폴리에스테르 섬유의 표면 특성)

  • Kwon, Il-Jun;Park, Sung-Min;Koo, Kang;Song, Byung-Kab;Kim, Jong-Won
    • Textile Coloration and Finishing
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    • v.19 no.4
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    • pp.38-46
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    • 2007
  • Surface properties of the plasma treated fabric were changed while maintaining its bulk properties. Surface of plasma treated fabric take charge of enhanced adhesion by surface etching, surface activity. The water repellency coating Poly(Ethylene Terephthalate) fabric was treated with atmospheric pressure plasma using various parameters such as Argon gas, treatment time, processing power. Morphological changes by atmospheric pressure plasma treatment were observed using field emmission scanning electron microscopy(FE-SEM) and the zeta-potential measurement, contact angle measurement equipment. At the atmospheric pressure plasma treatment time of 150 sec, the power of 800W, the best wettability and peel strength were obtained. And we confirmed the possibility of industrial application by using atmospheric plasma system.

Adhesion and Electrical Performance by Plasma Treatment of Semiconductive Silicone Rubber (반도전성 실리콘 고무의 플라즈마 표면처리에 따른 접착특성과 절연성능)

  • Hwang, Sun-Mook;Lee, Ki-Taek;Hong, Joo-Il;Huh, Chang-Su
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.5
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    • pp.450-456
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    • 2005
  • In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and Surface Roughness Tester. Adhesion was obtained from T-peel tests of semiconductive layer haying different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the creation of O-H and C=O. It is observed that adhesion performance was determined by surface energy and roughness level of silicone surface. It is found that at dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

A review on electrically debonding Adhesives (전기해체 접착제)

  • Jeong, Jongkoo
    • Journal of Adhesion and Interface
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    • v.19 no.2
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    • pp.84-94
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    • 2018
  • Electrically debonding adhesives[EDA], one of the controlled delamination materials[CDM] is reviewed. CDM can be defined as the ability to separate adhesive bonded assemblies without causing damage to the substrates. Its application includes electronics, medical surgery, dentistry, building and general manufacturing where the opportunity to separate assemblies is important. There are several important mechanisms of EDAs; faradaic reaction, phase separation and anode detachment, cathodic debonding, gas emission mechanism, and mechanical stresses. These mechanisms are reviewed with various research results. Since the mechanism behind the electrochemical debonding of adhesives is not well understood, this review aims to help the research scientists in the industries. Finally, new applications of EDA are introduced as new business opportunity.

The Effect of Thermal Treatments on the Peel Adhesion Strength of Pt/Ti Thin Film for a Bottom Electrode of Ferroelectric Materials (강유전체의 하부전극용 Pt/Ti 박막의 필 접착력에 미치는 열처리의 영향)

  • Lee, Tae-Gon;Kim, Yeong-Ho;Choe, Deok-Gyun;Gwon, O-Gyeong
    • Korean Journal of Materials Research
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    • v.6 no.6
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    • pp.610-617
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    • 1996
  • 강유전체 재료의 하부전극으로 사용되고 있는 Pt/Ti 박막의 접착력에 대한 열처리 분위기의 영향을 연구하였다. 시편의 접착력은 90$^{\circ}$ 필 테스트 방법을 사용하여 정량적으로 측정하였다. 열처리 후 사용된 분이기에 관계없이 모두 접착력이 감소하였는데 특히 산소분위기에서 열처리 한 시편의 접착력이 매우 크게 감소하였다. AES depth profile과 단면 TEM을 이용하여 계면반응을 관찰한 결과 산소열처리시에는 Ti가 외부에서 확산해 온 산소와 반응하여 rutile TiO2상이 형성됨을 알 수 있었다. 그러므로 산소열처리 후에 일어나는 접착력의 급격한 감소 원인은 열처리시 취약한 TiO2상이 형성되며 이로 인해 Ti 접착층이 고갈되기 때문임을 알 수 있었다.

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Studies on the Utilization of Korean Citrus Peel Waste -II. Contents of Pectin, Hesperidin and Naringin- (한국산(韓國産) 감귤과피(柑橘果皮)의 효율적(效率的) 이용(利用)에 관(關)한 연구(硏究) -II. 펙틴, 헤스페리딘, 나린진의 함량(含量)에 관(關)하여-)

  • Chang, Ho-Nam;Nam, Kyung-Eun;Hur, Jong-Wha
    • Korean Journal of Food Science and Technology
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    • v.9 no.4
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    • pp.251-254
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    • 1977
  • Pectin, hesperidin and naringin were extracted from hot air-dried peel ($60^{\circ}C$, 1 hr and air velocity 160 fpm) of citrus produced in Korea in order to see the amount of each component contained in the peel. Pectin was extracted by three different methods and the quality and contents of the pectins were determined respectively. 1. The pectin yield by the total pectic substance method was the highest (26.0% for unshiu (U) and 28.5% for natsudaidai (N) expectedly and the soluble pectic substance method the least (13.5%(U) and 15.6% (N)) The yield by method III (extraction by water at pH 1.5 followed by isopropanol precipitation) was intermediate (18.1% (U) and 20.8%(N)). Anhydrouronic acid (AUA) content was the highest (92.0% (U) and 90.3%(N)) in those by method III. The AUA contents of the other pectins were 80.0% for soluble pectin (for both U and N), 71.6% for the commercial pectin (Sunkist Groups Inc., U.S.A.), 58.0%(N) and 63.4%(U) for total pectic substance. 2. The methoxyl content of total pectic substance was the lowest (4.81%(U) and 4.88%(N)). However, there was no significant difference in methoxyl content among the rest which were found to have low levels(5.27-7.20%). 3. The pectin by method III gave the highest jelly strength. The commercial pectin, soluble pectice substance and total pectic substance were next in order. 4. The hesperidin content of unshiu was 5.07% (dry basis) and the naringin content of natsudaidai 3.03% (dry basis).

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Relationship between maximum bite force and facial skeletal pattern (최대 교합력과 안면 골격 형태에 관한 연구)

  • Choi, Won-Cheul;Kim, Tae-Woo
    • The korean journal of orthodontics
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    • v.33 no.6 s.101
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    • pp.437-451
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    • 2003
  • The purpose of this study was to measure maximum bite force and to investigate its relationship with anteroposterior, vertical, and transverse facial skeletal measurements. From among the dental students at the College of Dentistry, forty subjects (26 male and 14 female) were selected. With two sets of strain gauge, maximum bite force at the right and left first molars and anterior teeth was measured in the morning and afternoon. After taking lateral and posteroanterior cephalograms, fifty and nineteen variables were evaluated, respectively Paired t-tests and an independent t-test were done and correlation coefficients were obtained. 1. The maximum bite force at the first molars was $68.0\pm13.9kg$. in males and $55.6\pm10.5kg$ in females (p<0.05) while the force at the anterior teeth was $8.4\pm4.9kg\;and\;1.1\pm3.4kg$ respectively (p<0.05). 2. Some tendency for a greater value of maximum bite force at the preferred side was observed but not statistically significant (p>0.05). 3. Significant difference was observed between the strong bite force group and the weak bite force group in some cephalometric and other measurements (p<0.05). N-S-Ar, S-Ar-Go, FH-Hl, IMPA and MMO showed a significant difference in posterior maximum bite force (P). N-S-Ar and FH-H1 also showed a significant difference in anterior maximum bite force (A). 4. Several cephalometric variables showed some correlation with maximum bite force (p<0.05). N-S-Ar, S-Ar-Go, UGA, FH-H6, FH-H1, body weight and MMO were significantly correlated with posterior maximum bite force (P). Go-Me, P-1 and IMPA were significantly correlated with anterior maximum bite force (A).

Synthesis and Adhesion Properties of UV Curable Acrylic PSAs for Semiconductor Manufacturing Process (반도체 제조 공정용 UV 경화형 아크릴 점착제의 합성과 점착 특성)

  • Lee, Seon Ho;Lee, Sang Keon;Hwang, Taek Sung
    • Applied Chemistry for Engineering
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    • v.24 no.2
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    • pp.148-154
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    • 2013
  • UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.