• 한국표면공학회지
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• 제39권6호
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• pp.255-262
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• 2006

Pd-Cu alloy membrane for hydrogen separation was fabricated by sputtering and Cu reflow process. At first, the Pd and Cu was continuously deposited by sputtering method on oxidized Si support, the Cu reflow process was followed. Microstructure of the surface and permeability of the membrane was investigated depending on various reflow temperature, time, Pd/cu composition and supports. With respect to our result, Pd-Cu thin film (90 wt.% Pd/10 wt.% Cu) deposited by sputtering process with thickness of $2{\mu}m$ was heat-treated for Cu reflow The voids of the membrane surface were completely filled and the dense crystal surface was formed by Cu reflow behavior at $700^{\circ}C$ for 1 hour. Cu reflow process, which is adopted for our work, could be applied to fabrication of dense Pd-alloy membrane for hydrogen separation regardless of supports. Ceramic or metal support could be easily used for the membrane fabricated by reflow process. The Cu reflow process must result in void-free surface and dense crystalline of Pd-alloy membrane, which is responsible for improved selectivity oi the membrane.

• Journal of Magnetics
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• 제8권4호
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• pp.146-148
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• 2003

Multilayered films of Co/Pd have been studied as a candidate material for a high density perpendicular recording medium due to higher anisotropy energy. However, high exchange coupling among grains results in large transition noise. To reduce the exchange coupling and grain size, addition of 3rd elements and physical separation of grains have been attempted. In the present paper, effects of sputtering pressure, Co sublayer thickness and Pd underlayer thickness on magnetic properties and microstructures were studied. It was found that by increasing sputtering pressure from 5 mTorr to 25 mTorr, Ms decreased to one half and coercivity increased more than 5000 Oe. The increase of the coercivity is associated with physical separation of grains by high pressure sputtering. Ms per volume of Co for Co/Pd multilayered film deposited at 25 mTorr shows continuous decrease with increasing Co sublayer thickness. This was related to void formation and intermixing of Co/Pd interface. Also, effect of Pd underlayer thickness on magnetic properties will be discussed.

• 한국자기학회지
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• 제6권4호
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• pp.235-241
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• 1996

수직자기 기록매체를 위해 스퍼터링법으로 Co/Pd 및 Co/Pt 다층막을 형성하였으며 Pd 및 Pt 바닥층의 증착 압력이 다층막의 자화거동 및 보자력에 미치는 영향에 대해 연구하였다. Co/Pd 다층막의 경우 보자력이 바닥층의 증착 압력에 매우 민감하여 바닥층 증착압력만을 조절함으로써 보자력을 크게 증가시킬 수 있었으나 Co/Pt 경우 바닥층의 증착압력 조절에 의한 보자력 증대효과는 미미하였다. 바닥층의 종류 및 증착압력에 따른 다층막의 보자력 변화를 바닥층의 표면 거칠기 및 다층막 증착착시의 계면상태 변화의 측면에서 설명할 수 있었으며 이는 바닥층의 증착압력의 증가에 따른 다층막의 수직이방성 에너지 감소 및 자화반전 기구의 변화와도 연관시킬 수 있었다. 다층막의 Kerr 회전각은 바닥층의 종류 및 증착압력에는 거의 의존하지 않는 것으로 나타났다.

• 한국표면공학회지
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• 제46권6호
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• pp.248-257
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• 2013

It is generally recognized that thin Pd-Cu alloy films fabricated by sputtering show a wide range of microstructures and properties, both of which are highly dependent on the sputtering conditions. In view of this, the present study aims to investigate the relationship between the performance of hydrogen separation membranes and the microstructure of Pd alloy films depending on sputtering deposition conditions such as substrate temperature, working pressure, and DC power. We fabricated thin and dense Pd-Cu alloy membranes by the micro-polishing of porous Ni support, an advanced Pd-Cu sputtered multi-deposition under the conditions of high substrate temperature / low working pressure / high DC power, and a followed by Cu-reflow heat-treatment. The result of a hydrogen permeation test indicated that the selectivity for $H_2/N_2$ was infinite because of the void-free and dense surface of the Pd alloy membranes, and the hydrogen permeability was 10.5 $ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ for a 6 ${\mu}m$ membrane thickness.

• 한국전기전자재료학회논문지
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• 제35권5호
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• pp.488-493
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• 2022

Generally, diamond-like carbon films (a-C:H, DLC) have been shown to have a low coefficient of friction, a high hardness and a low wear rate. Pd-doped C thin film was fabricated using a dual magnetron sputtering with two targets of graphite and palladium. Graphite target RF power was fixed and palladium target RF power was varied. The structural, physical, and surface properties of the deposited thin film were investigated, and the correlation among these properties was examined. The doping ratio of Pd increased as the RF power increased, and the surface roughness of the thin film decreased somewhat as the RF power increased. In addition, the hardness value of the thin film increased, and the adhesive strength was improved. It was confirmed that the value of the contact angle indicating the surface energy increases as the RF power increases. It was concluded that the increase in RF power contributed to the improvement of the physical properties of Pd-doped C thin film.

• 한국자기학회지
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• 제2권2호
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• pp.119-124
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• 1992

조성변조 Co/Pd 초격자 박막 제조시 스퍼터링 Ar기압이 박막의 미세조직에 미치는 방향과 이로 인한 자기 및 자기광학적 특성에 미치는 영향을 조사하였다. 초격자 박막은 dc-magnetron 스퍼터링 방법으로 각 sublayer의 두께가 $2\;\AA-Co/9\;\AA-Pd$일때, 스퍼터링 Ar가스압력을 2에서 30 mTorr 까지 변화시키면서 제조하였다. Ar기압이 10 mTorr 이상에서 초 격자 박막은 주상구조(columnar structure)를 형성시키면서 성장됨이 관측되었다. Ar기압의 증가에 따라 포화자화값, 자기이방성에너지 및 Kerr 회전각등은 감소하고 보자력은 증가함을 보였다. 이러한 자기 및 자기광학적 특성의 변화는 Ar압력에 따른 초격자 박막의 미세구조 변화에 기인되는 현상으로 설명될 수 있다.

• 한국전기전자재료학회논문지
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• 제15권9호
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• pp.812-817
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• 2002

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.259-259
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• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

• 한국자기학회지
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• 제4권3호
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• pp.256-262
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• 1994

코발트 단위층의 두께가 $2{\AA}$ 및 $4{\AA}$인 두 경우에 대해 막의 총두께가 약 $200{\AA}$인 Co/Pd 다층막을 제조하였으며 이 때 스퍼터링 압력이 자화반전 및 수직자기이방성에 미치는 영향에 대해 연구 하였다. 수직자기이방성 에너저지가 최대치를 보이는 압력이 존재하였으며 $2{\AA}$ 코발트층의 경우 $4{\AA}$ 경우 보다 낮은 압력에서 최대치가 나타났다. 자화시 자구벽 이동은 압력이 높을수록 어려워졌으며 높은 압력에서 는 자구벽 이동으로부터 자기모멘트 회전으로 자화반전기구가 바뀌었다. 또한 코발트층의 두께가 $2{\AA}$인 경우가 $4{\AA}$인 경우보다 수직자기이방성 에너지가 큰 것으로 나타났다.

• 한국세라믹학회지
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• 제30권9호
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• pp.701-708
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• 1993

Pd-doped SnO2 thin films for hydrogen gas sensing were fabricated by reactive fo magnetron sputtering and were studied on effects of film thickness and Pd doping content. Pd doping caused the optimum sensor operation temperature to reduce down to ~25$0^{\circ}C$ and also enhanced gas sensitivity, compared with undoped SnO2 film. Gas sensitivity depended on the film thickness. The sensitivity increased with decreasing the film thickness, showing maximum sensitivities at the thickness of 730$\AA$ and 300~400$\AA$ for the undoped SnO2 and the Pd-doped SnO2 film, respectively. Further decrease of the film thickness beyond these thickness ranges, however, resulted in the reduction of sensitivity again.