• 한국재료학회지
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• 제33권12호
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• pp.537-549
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• 2023

The sintering shrinkage behaviors of low temperature cofired ceramics (LTCC) and resistors were compared using commercial LTCC and thick-film resistor pastes, and factors influencing the camber of cofired resistor/LTCC bi-layers were also investigated. The onset of sintering shrinkage of the resistor occurred earlier than that of LTCC in all resistors, but the end of sintering shrinkage of the resistor occurred earlier or later than that of LTCC depending on the composition of the resistor. The sintering shrinkage end temperature and the sintering shrinkage temperature interval of the resistor increased as the RuO₂/glass volume ratio of the resistor increased. The camber of cofired resistor/LTCC bi-layers was obtained using three different methods, all of which showed nearly identical trends. The camber of cofired resistor/LTCC bi-layers was not affected by either the difference in linear shrinkage strain after sintering between LTCC and resistors or the similarity of sintering shrinkage temperature ranges of LTCC and resistors. However, it was strongly affected by the RuO₂/glass volume ratio of the resistor. The content of Ag and Pd had no effect on the sintering shrinkage end temperature or sintering shrinkage temperature interval of the resistor, or on the camber of cofired resistor/LTCC bi-layers.

• 센서학회지
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• 제6권5호
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• pp.369-375
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• 1997

$SnO_{2}$에 $V_{2}O_{5}/ThO_{2}/Pd$를 도핑하여 제조된 센서는 약 $500^{\circ}C$의 높은 센서 온도에서 CO에 대해 우수한 선택도와 안전성 및 빠른 응답특성을 보였다. 특히, $V_{2}O_{5}$를 약 3.0 wt.% 첨가하여 선택도에 있어서 CO 감도에 대해 $NO_{x}$, $C_{3}H_{8}$, $CH_{4}$ 및 $SO_{2}$같은 많은 간섭가스들의 영향이 적음을 알았다. 센서 제조는 $V_{2}O_{5}$(3.0 wt.%), $ThO_{2}$(1.5wt.%), Pd(1.0 wt.%)의 촉매물질과 함께 기존에 잘 알려진 후막기술을 이용하였다. 일반적으로 연소배가스처럼 $NO_{x}$와 CO가 혼합되어 있는 복합가스의 경우, $SnO_{2}$계 반도체 센서로는 CO만의 검지는 $NO_{x}$ 간섭 때문에 대단히 어렵다. 본 센서는 공연비제어를 요하는 자동차나 보일러 시스템의 연소배가스의 측정과 감시에 사용할 수 있을 것이다.

• 한국군사과학기술학회지
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• 제7권2호
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• pp.81-87
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• 2004

Semiconductor thick film gas sensors based on tin oxide are fabricated and their gas response characteristics are examined for four simulant gases of chemical warfare agent (CWA)s. The sensing materials are prepared in three different sets. 1) The Pt or Pd $(1,\;2,\;3\;wt.\%)$ as catalyst is impregnated in the base material of $SnO_2$ by impregnation method.2) $Al_2O_3\;(0,\;4,\;12,\;20\;wt.\%),\;In_2O_3\;(1,\;2,\;3\;wt.\%),\;WO_3\;(1,\;2,\;3\;wt.\%),\;TiO_2\;(3,\;5,\;10\;wt.\%)$ or $SiO_2\;(3,\;5,\;10\;wt.\%)$ is added to $SnO_2$ by physical ball milling process. 3) ZnO $(1,\;2,\;3,\;4,\;5\;wt.\%)$ or $ZrO_2\;(1,\;3,\;5\;wt.\%)$ is added to $SnO_2$ by co-precipitation method. Surface morphology, particle size, and specific surface area of fabricated sensing films are performed by the SEM, XRD and BET respectively. Response characteristics are examined for simulant gases with temperature in the range 200 to $400^{\circ}C$, with different gas concentrations. These sensors have high sensitivities more than $50\%$ at 500ppb concentration for test gases and also have shown good repetition tests. Four sensing materials are selected with good sensitivity and stability and are fabricated as a sensor array A sensor array Identities among the four simulant gases through the principal component analysis (PCA). High sensitivity is acquired by using the semiconductor thick film gas sensors and four CWA gases are classified by using a sensor array through PCA.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.635-638
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• 2001

This paper presents the dynamic characteristics of r rotor-bearing system supported by an actively controlled hydrodynamic journal bearing. The proportional, derivative and integral controls are adopted for the control algorithm to control the hydrodynamic journal bearing with an axially groove. Also, the cavitation algorithm implementing the Jakobsson-Floberg-olsson boundery condition is adopted to predict cavitation regions in the fluid film more accurately than conventional analysis, which uses the Reynolds condition. The speed at onset of instability of a rotor-bearing system is increased by both proportional and derivative control of the bearing. The integral control has no effect on stability characteristics of hydrodynamic journal bearing. The PD-control is more effective than proportional or derivative control. Results show the active control of bearing can be adopted for the stability improvement of a rotor-bearing system.

• 한국의학물리학회:학술대회논문집
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• 한국의학물리학회 2002년도 Proceedings
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• pp.141-143
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• 2002

In 1995, the American Association of Physicists in Medicine (AAPM) Task Group 43 published a report dealing with the dosimetry of interstitial brachytherapy sources, generally known as the TG-43 report. Compared to previously adopted formalisms, a formalism proposed in this report provides a more accurate and systematic brachytherapy dose calculation method, especially for Ir-192 and other low energy gamma sources such as 1-125 and Pd-l03. In this lecture, an overview of the TG-43 formalism will be presented, along with the lecturer's experience in determining the TG-43 parameters by the Monte Carlo method and experimental methods such as TLD and radiochromic film.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 추계학술대회 논문집
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• pp.206-209
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• 1994

This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.5-9
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• 1996

As optical massmemories, (Se, S)-based chalcogenide amorphous films are used for a holographic supermicrofiche by using the refractive-index change. In 1000$\AA$thick-As$_{40}$ Ge$_{10}$Se$_{100-x}$S$_{x}$(x=0.25, 35at.%), the amount of refractive index change $\Delta$n reaches 0.01~0.53 at 6328, 7800$\AA$ by exposing for 15minutes plue-pass filtered mercury lamp(~4300$\AA$) and annealing 20$0^{\circ}C$. And in initially annealed As$_{40}$ Ge$_{10}$Se$_{15}$ S$_{35}$, photodarkening(PD) and thermalbleaching(TB) was founded.ded.B) was founded.d.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1477-1479
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• 2000

The annealing treatments on rf magnetron sputtered PZT($Pb_{1.05}(Zr_{0.52},Ti_{0.48})O_3$) thin films(4000${\AA}$) have been investigated for a structure of PZT/Pt/Ti/ITO coated glass. Crystallization properties of PZT films were strongly dependent on RTA(Rapid Thermal Annealing) annealing temperature and time. We were able to obtain a perovskite structure of PZT at 650$^{\circ}C$ and 10min. P-E curves of Pd/PZT/Pt capacitor demonstrate typical hysteresis loops. The measured values of $P_r$, $E_c$ were 15.8[${\mu}C/cm^2$], 95[kV/cm] respectively. Polarization value decrease about 10% after $10^9$ cycles.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.806-808
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• 2004

본 연구에서는 MEMS 공정에 의해 제작된 실리콘 멤브레인 위에 스크린 프린팅법을 이용하여 압전 후막을 제작, 그 특성을 관찰하였다. 실리콘 웨이퍼의 후면을 각각 다른 4가지의 크기로 식각하여 멤브레인을 제작하였다. 제작된 멤브레인 위에 하부전극 Ag-Pd를 스크린 프린팅법으로 형성하고, 그 위에 압전 후막을 스크린 프린팅하여 열처리 하였다. 제작된 압전 후막위에 MFM(Metal-Ferroelectric-Metal)구조의 액츄에이터를 제작하기위해 상부전극으로 Pt를 스퍼터링으로 증착하였다. 제작된 마이크로 액츄에이터는 SEM(Scanning Electron Microscope)으로 구조분석하고, RT66A와 MTI2000으로 동작특성을 해석 하였다.