• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.34-37
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• 2010

0.25 mm thickness super thin surface mounted device LED Lamp is developed with PCB type lead frame in which BT (Bismaleimide Triazine) resin is used. BT resin is removed by a laser beam in order to reduce the thermal resistance below $1\;^{\circ}C/W$ and transfer molding is used with silicone. Compared to conventional 0.4 mm thickness LED lamp, the developed LED lamp can be derived in high current and the luminance of the LED lamp is increased up to 240 mA.

• Journal of Microbiology
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• v.38 no.3
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• pp.183-186
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• 2000

Several types of bioluminescent reporter strains have been developed for the detection and monitoring of pollutant aromatics contaminating the environment. In this study, a bioluminescent reporter strain, E. coli SHP3, was constructed by fusing the luc gene of firefly luciferase with the promoter of pcbC responsible for the meta-cleavage of aromatic hydrocarbons. the bioluminescence expressed by the luc gene in the reporter was well triggered by the promoter when it was exposed to 2,3-dihydroxybiphenyI (2,3-DHBP) at 0.5 to 1 mM concentrations. The bioluminescent response was more extensive when the reporter strain was exposed to 5 mM catechol and 2 mM 4-chlorocatechol. These different types of bioluminescent responses by E. coli SHP3 appeared to be characterized by the nature of the aromatics to stress. Since E. coli SHP3 responded to 2,3-DHBP quite sensitively, this reporter strain could be applied for detecting some catecholic pollutants.

• Journal of Korean Society for Atmospheric Environment
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• v.17 no.5
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• pp.415-424
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• 2001

The concentrations of PCBs (polychlorinated biphenyls) in air and plants (MOrus allba, Allum turberosum) were measured every other week at Hankyong University located in Ansung, Kyoung-ki province, Korea from July to November in 1999. Total concentrations of PCBs in air ranged from 19.8 to 71.9 pg/ $m^3$. It was observed in air that the concentrations of tai-chlorinated biphenyls(CBs) were higher than those of other PCB homologs probably due to their higher vapor pressure. Total concentrations of PCBs in plants ranged from 24.5 to 1,287 pg/g dry weight for Morus allba and 26.5 to 337 pg/g dry weight for Allum turberosum. A positive linear correlation was observed between log plant-air partition coefficients ( $m^3$air/g plant dry weight-defined here as the scavenging coefficient[S.C]) and log octanol-air partition coefficients ( $K_{oa}$ ) for each plant. In this study, slope of log S.C and log $K_{oa}$ for Morus allba, Allum turberosum were 1.07 ($R^2$= 0.83, p<0.01), 0.84 ($R^2$=0.53, p<0.05), respectively. This means that these plants may approach to equilibrium for air-plant partitioning.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.77-77
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• 2010

본 연구에서는 Sn-3.0Ag-0.5Cu (SAC305) 무연솔더의 최적 인쇄성을 위한 PCB 및 마스크설계, 스크린프린팅 공정변수의 최적값을 실험계획법을 통해 평가하였다. 사용된 칩은 가로 0.4mm 세로 0.2mm의 0402 MLCC칩이며, 사용된 시험보드는 OSP 표면처리된 PCB이었다. 인쇄성을 판단하기 위한 공정인자는 금속마스크 두께, 마스크홀 크기, 패드크기 및 모양, 인쇄각도, 인쇄속도, 판분리속도이었다. ANOVA분석을 통해 주인자를 파악하였으며, 인쇄성에 영향을 미치는 주인자는 마스크두께와 인쇄각도임이 확인되었다. 그 후 중심 합성법을 이용하여 인쇄성 최적 조건을 확인하였다. 결과로 나타난 등고선/표면도를 통해, 마스크두께가 작을 때에는 인쇄각도가 작아야 높은 인쇄성을 갖으며, 또한 마스크 두께가 클 경우에는 인쇄각도가 커야 높은 인쇄성을 가짐을 알 수 있었다. 추가실험을 통해서 인쇄성 표면도의 정확도를 확인하였으며, 실험값은 표면도에서 표시된 인쇄성값과 비슷함을 알 수 있었다. 또한, 인쇄성이 낮은 영역과 높은 영역에서 접합강도값을 측정하였으며, 인쇄성이 좋은 영역에서 접합강도도 높음을 알 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.10a
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• pp.276-280
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• 2001

In the development of Chip Mounter(C/M), much interests have risen regarding how to decrease the operation time of mounting the different chips on the printed circuit board(PCB). The existing method to determine the time sequence of teaching C/M was to follow the procedure which was made by the operater. IN this study, a new but effective algorithm has been developed and employed in SCM-130 Chip Mounter and its online programming had reduced the mounting time significantly and provided the basis for the future online CAD/CAM system.

• Journal of the Korea Society for Simulation
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• v.1 no.1
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• pp.17-24
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• 1992

The capacity of the drilling process in Multi-Layer PCB fabrication can be affected by various process parameters determining material flows in the unit operations. The ratio of mass-lamination to pin lamination and the number of stacks as the most critical paramaters, among them, were chosen on the basis of exhaustive field evaluation to study their effects on the capacity of the process. The best alternative condition for maximum capacity of the process was selected by simulation of process.

• Analytical Science and Technology
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• v.12 no.1
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• pp.68-74
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• 1999

The Concentrations of PCDDs/PCDFs and their precusors(chlorophenols, chlorobenzenes, PCB) were analyzed from the dioxin control device such as EP and SCR to know the emission patterns of these compounds and find the dioxin index compounds. The dioxin concentration increased 7 times in outlet part than inlet part of EP and the concentration of CBs, CPs and PCBs also were increased through this control device. These phenomia may be related to the operating temperature of Electroprecipitator(EP), which the operating temperature is near the $300^{\circ}C$, the method of the decreasing the operating temperature need to consider to prevent the formation of these compounds. In the selected catalytic reactor with wet scrubber(SCR+WS), these compounds were removed after passing the device over 90% for CPs, 30~40% for CBs and 60% for PCBs. But, the systematic study have to perform to reduce the formation of PCDDs/PCDFs and precusors.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.35-39
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• 2011

Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.

• Korean Journal of Environmental Biology
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• v.34 no.3
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• pp.212-215
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• 2016

We developed a new ecotoxicological test method using native test species, eggs of Ephemera orientalis, and five kinds of industrial wastewater were tested to validate the test method. The water samples were collected in Jun 2006 from the following industries: pesticide, metal plating, PCB, leather1, and leather2. Wastewater and effluent were diluted by distilled water, respectively, to prepare various concentrations, 100, 50, 25, 12.5, 6.3, 3.1, and 0%. For the egg bioassay, 20 freshly laid eggs (<24 h old) were exposed to test solutions in a Petri dish ($52{\times}12mm$) at $20^{\circ}C$ with photoperiod of 16 h light and 8 h dark for 14 days. The median egg hatching concentrations (EHC50) were estimated using Probit analysis. All EHC50s of wastewater were less than 3.1%, which meant very high ecotoxicity except for the wastewater of PCB industry having 6.1% of EHC50. Among the effluents, the least toxic effluent was from pesticide industry having 58% of EHC50, while the effluent of leather2 was the most toxic having 7.3% of EHC50.

• Clean Technology
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• v.18 no.3
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• pp.287-294
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• 2012

In this study, performances of two cleaning methods were analyzed and a cleaning system was designed to develop a cleaning process of electronic components to remanufacture old laser copy machine. First, plasma cleaning as a dry cleaning method was executed to test cleaning ability. In cleaning of printed circuit board (PCB) by plasma, some damages were found near the metal parts, and considering the productivity, this method was not adequate for the cleaning of electronic components. With 4 different cleaning agents, ultrasonic cleaning tests were executed to select an optimal cleaning agent, aqueous agents showed superior cleaning performance compared to semi-aqueous and non-aqueous agents. Cleaning with aqueous cleaning agent A and 28 kHz ultrasonic frequency can be completed in 30 sec to 1 min. Finally, an ultrasonic cleaning system was constructed based on the pre-test results. Optimal cleaning conditions of 40 kHz and $50^{\circ}C$ were found in the field test. The productivity and economic efficiency in remanufacturing of laser copy machine are expected to increase by adapting developed ultrasonic cleaning system.