• 한국산학기술학회논문지
• /
• 제19권4호
• /
• pp.132-137
• /
• 2018

2015년 화학물질관리법 시행 이후 화학 사고 발생 수는 감소 추세에 있으나, 최근 인쇄회로기판(PCB) 제조시설에서 유사한 유형의 사고가 반복적으로 발생함에 따라 실험을 통해 사고 원인을 조사 분석하였다. 해당 사고는 인쇄회로기판 제조공정 내 에칭용액으로 사용한 유해화학물질인 염산과 과산화수소가 월류하여 발생한 사고로 작업자 부주의와 시설 관리 미흡이 주된 사고 원인으로 조사되었다. 사고 원인을 규명하기 위해 실시한 $Cl^-$의 함량 분석 결과 과산화수소 시료에서 66.85 ppm로 측정되어 사고 물질인 염산과 과산화수소의 혼합경로를 확인할 수 있었으며, 반응실험을 통해 반응열이 $50.5^{\circ}C$까지 발생함에 따라 PVC 저장탱크의 변형과 유독가스인 염소가스 발생을 확인하였다. 본 연구를 통해 인쇄회로기판 제조시설의 에칭공정에서의 과충전, 역류방지, 누출감지장치와 혼합방지를 위한 저장탱크 분리 설계 등 시설 안전 관리 방안과 해당 장치의 장외영향평가 검토 필요성을 제시하고자 하였다. 또한 동일 유형의 사고 재발 방지를 위하여 주기적인 시설 안전점검과 작업자의 안전교육 강화의 필요성에 대하여 논의하였다.

• 마이크로전자및패키징학회지
• /
• 제21권4호
• /
• pp.97-103
• /
• 2014

다양한 무연솔더합금 가운데 Sn-58Bi solder는 저융점이며 상대적으로 높은 인장강도를 갖고 있지만 취성적이라는 단점을 갖고 있다. 이러한 Sn-58Bi 솔더의 기계적 강도를 보완하기 위해 epoxy를 함유한 Sn-58Bi 솔더가 연구되어져왔다. 본 연구는 Sn-58Bi 솔더와 Sn-58Bi 에폭시 복합솔더를 이용하여 PCB 기판에 접합한 후, 시효처리에 따른 솔더/기판 계면 미세구조와 기계적 특성변화를 연구하였다. OSP 표면처리된 PCB 기판에 솔더볼을 형성 한 후 85, 95, 105, $115^{\circ}C$에서 100~1000 시간동안 시효처리하였으며, 기계적 특성평가로 저속전단시험을 진행하였다. 시효 처리 시간 및 온도의 증가에 따라 Cu6Sn5 금속간화합물층은 성장하였으며 Sn-58Bi 솔더 금속간화합물층이 Sn-58Bi 에폭시 복합솔더보다 두꺼웠다. 전단시험 결과, Sn-58Bi 에폭시 복합솔더가 Sn-58Bi 솔더보다 약 2배 높은 전단강도 값을 나타냈으며 시효시간이 증가할수록 전단강도 값은 감소하였다.

• 한국기계가공학회지
• /
• 제14권2호
• /
• pp.51-58
• /
• 2015

In this study, we developed an automated non-contact thickness measurement machine that continuously and precisely measures the thickness and warp of a PCB product using a laser sensor. The system contains a measurement part to measure the thickness in real time automatically according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The measurement machine was utilized to evaluate the performance at each step to minimize measurement error. At the zero setting for the initial setup, the standard deviation of the 216 samples was determined to be $5.52{\mu}m$. A measurement error of 0.5mm and 1.0mm as a standard sample in the measurement accuracy assessment was found to be 2.48% and 2.28%, respectively. In the factory acceptance test, the standard deviation of 1.461mm PCB was measured as $28.99{\mu}m$, with a $C_{pk}$ of 1.2. The automatic thickness measurement machine developed in this study can contribute to productivity and quality improvement in the mass production process.

• 한국정밀공학회지
• /
• 제23권4호
• /
• pp.29-36
• /
• 2006

Micro drilling by high-speed air bearing spindle is very useful manufacturing technology in electronic industry For the design of high speed air bearing spindle, there are considered stability of air bearing spindle, allowable load of air bearing, run out and tooling system design for micro drill's attach and remove. According to suggested details, we designed and manufactured high-speed air bearing spindle and carried out performance estimation such as run out, temperature change in running air bearing spindle, stiffness, chucking torque. Results are follows; Run out was measured under $5{\mu}m$ at air bearing spindle revolution $20,000\sim125,000rpm$. High speed air bearing spindle's temperature rose about $20^{\circ}C$ after 5 minutes from running and then was fixed. Allowable thrust load of spindle was 17kgf. Chucking torque of collet was 15kgfcm.

• 전기학회논문지
• /
• 제63권12호
• /
• pp.1716-1721
• /
• 2014

In this paper, a study on automation method for the circuit/EM (Electro-Magnetic) simulation is carried out to analyze effectively the SI/PI (Signal Integrity/Power Integrity) issues which occur on circuits and/or PCBs (Printed Circuit Boards). For the automation of the circuit/EM simulation, algorithms performing each process of the SI/PI analysis automatically (such as ports setup, circuit definition and SI/PI evaluation) are developed; thereby automation system for the SI/PI analysis is constructed with the algorithms. The automation of the circuit/EM simulation is accomplished in the environment of the C/S (Client/Server) architecture in order to reduce resources such as high cost computers demanded for the SI/PI analysis. The automation method for the SI/PI analyses proposed in this paper reduces effort, time, and cost spent on the environment setup for simulation and the SI/PI analysis process. In addition, the proposed method includes automation of the documenting process, which organizes, records and displays the SI/PI analysis results automatically for users.

• Journal of Welding and Joining
• /
• 제29권5호
• /
• pp.95-98
• /
• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• 한국전기전자재료학회논문지
• /
• 제13권11호
• /
• pp.969-975
• /
• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$.4$H_2O$), as a metallo-organic precursor, using a focused CW Ar$^{+}$ laser beam (λ=514nm) on PCB boards and glass substrates. The linewidth and thickness of the lines wee investigated as a functin of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameters using probe station and semiconductor analyzer. We compared resistivities of the patterned copper lines with these of the Cu bulk. Resistivities decreased due to changes in morphology and porosity of the deposit, which were about 3.8 $\mu$$\Omega$cm and 12$\mu$$\Omega$cm on PCB and glass substrates after annealing at 30$0^{\circ}C$ for 5 minutes.s.

• 한국미생물·생명공학회지
• /
• 제24권3호
• /
• pp.282-289
• /
• 1996

2,3-DHBP dioxygenase was purified from E. coli CK1092 carrying the pcbC gene, which was cloned from 4-chlorobiphenyl-degrading Pseudomonas sp. P20. Purification of this enzyme was done by acetone precipitation, DEAE- Sephadex A-25 ion exchange chromatography, and preparative gel electrophoresis. The molecular weight of subunit was 34 kDa determined by SDS-PAGE, and that of native enzyme was about 270 kDa. It suggests that this enzyme consist of eight identical subunits. This enzyme was specifically active against only 2,3-DHBP as a substrate with 18 $\mu$M of Km value, but not catechol, 3-methylcatechol, 4-methylcatechol and 4-chlorocatechol. The optimal pH and temperature of 2,3-DHBP dioxygenase were pH 8.0 and 40-60$\circ$C. The enzyme was inhibited by Cu$^{2+}$, Fe$^{2+}$ and Fe$^{3+}$ ions, and was inactivated by H$_{2}$0$_{2}$2 and EDTA. The lower concentrations of some organic solvents such as acetone and ethanol don't stabilize the activity of 2,3-DHBP dioxygenase. The enzyme was completely inactivated by adding the reagents such as N-bromosuccinimide, iodine and p- diazobenzene sulfonic acid.

• 한국산학기술학회논문지
• /
• 제8권2호
• /
• pp.245-249
• /
• 2007

본 논문은 핵발전소의 초음파 비파괴 평가를 수행하기 위하여 핵발전소 설비의 초음파 비파괴 평가시 발생될 수 있는 스펙클 잡음을 억제하고 디컨벌루션 기법을 이용하여 결함의 정확한 위치 및 크기를 추정할 수 있는 영상 처리 기법을 제안하였다. 제안된 방법은 실제 핵발전소의 증기발생기 파이프라인으로 만들어진 시편을 이용하여 영상의 선명도를 확인 할 수 있었다.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2001년도 춘계학술발표회 초록집
• /
• pp.3-3
• /
• 2001

Recently TiN, TiAlN, CrN hardcoatings have adapted many industrial application such as die, mold and cutting tools because of good wear resistant and thermal stability. However, in terms of high speed process, general hard coatings have been limited by oxidation and thermal hardness drop. Especially in the case of PCB drill, high speed cutting and without lubricant process condition have not adapted these coatings until now. Therefore more recently, superhard nanocomposite coating which have superhard and good thermal stability have developed. In previous works, WC-TiAlN new nanocomposite film was investigated by cathodic arc ion plating system. Control of AI concentration, WC-TiAlN multi layer composite coating with controlled microstructure was carried out and provides additional enhancement of mechanical properties as well as oxidation resistance at elevated temperature. It is noted that microhardness ofWC-TiA1N multi layer composite coating increased up to 50 Gpa and got thermal stability about $900^{\circ}C$. In this study WC-TiAlN nanocomposite coating was deposited on PCB drill for enhancement of life time. The parameter was A1 concentration and plasma cleaning time for edge sharpness maintaining. The characteristic of WC-TiAlN film formation and wear behaviors are discussed with data from AlES, XRD, EDS and SEM analysis. Through field test, enhancement of life time for PCB drill was measured.