• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.216-217
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• 2005

In this paper, in order to develop Pb-free piezoelectric ceramics, $(Li_{0.05}Na_{0.57}K_{0.38})NbO_3$ ceramic was fabricated with the variation of $Bi_2O_3$ addition. Piezoelectric properties of the ceramic were varied with the amount of $Bi_2O_3$ addition and showed the maximum kp value at.0.2 wt% $Bi_2O_3$ addition. Qm of $Bi_2O_3$ added ceramics showed lower values than the non-added ceramics, however, the kp was increased by the addition of $Bi_2O_3$ up to 0.2 wt%. At the sintering temperature of 1110$^{\circ}C$ and the calcination temperature of 850$^{\circ}C$, the optimal values of density=4.52g/$cm^3$, kp=0.47, $\varepsilon_r$=400 were obtained.

• Nuclear industry
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• v.21 no.3 s.217
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• pp.57-67
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• 2001

• Journal of the Korean institute of surface engineering
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• v.35 no.1
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.217-221
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• 1997

We have investigated the ferroelectric properties of multi-layered SrBi$_2$Ta$_2$$O_{9}$Pb(Zr,Ti)O$_3$, SBT/PZT, thin film capacitors. Specimens were prepared onto Pt-coated Si wafer by sol-gel method. Ferroelectric properties of these finns could be obtained only for thin SBT layers below 50nm in thickness. The values of dielectric constant and remnant polarization depend mainly on the thickness of SBT layer, which arises from the paraelectric interface layer between SBT and PZT due to the thermal diffusion of Pb. The value of remnant poarization of PZT/SBT is greater than that of SBT, and the plarization fatigue behaviors of PZT/SBT/Pt capacitors are somewhat improved as compared with those of PZT/Pt.t.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1095-1098
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• 2004

In this study, $Bi_2O_3-B_2O_3-ZnO$ glass system, which was expected to have similar properties with PbO containing glass system, was selected as a PbO replaceable potential composition because the atomic weight and ionic radius of Bi is similar to those of Pb. Glasses with different modifier/former ratio were prepared by melting the raw ingredient mixtures in $Bi_2O_3-B_2O_3-ZnO$ system, and the thermal and electrical properties of the sintered samples were examined. The glass transition temperatures and the dielectric constant of the glass pellets were between 350 $^{\circ}C{\sim}$500 $^{\circ}C$ and 15-35, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1990.10a
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• pp.68-70
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• 1990

(1-X)(Sr$\_$7/9/Pb$\_$2/9/)$\_$(1-y)/(Ca$\_$1/5/Mg$\_$4/5/)$\_$y/TiO$_3$+X(BiO$_2$O$_3$$.$3TiO$_2$) (y=0.145, 0$\leq$X$\leq$0.08) ceramics were fabricated by the mixed oxide method. The sintering temperature and time were 1180∼1230[$^{\circ}C$], 2[hr], respectly. The grain size were grown with increasing the contents of Bi$_2$O$_3$$.$3TiO$_2$, but decreased more and less in the specimens which had more than 0.04[mol].

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.163-169
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• 2019

Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.105-108
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• 2003

Long length of Bi-2223 superconducting wires were fabricated by stacking, drawing process with different precursor owders and different heat-treatment histories. The precursor powders were 2 kinds of Pb content. And a part of the tapes were experienced pre-annealing process which caused tetragonal structure of Bi-2212 phase to orthorhombic structure of it was during drawing process. We confirmed the transformation of Bi-2212 phase from tetragonal structure to orthorhombic structure and reduction of second phases. We designed and made a continuous Ic measurement system for Bi-2223/Ag HTS tape. We could achieve best Ic of 65 A at the Bi-2223/Ag tape using low Pb content of precursor powder and experienced pre-annealing process.

• Journal of the Korean Ceramic Society
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• v.37 no.12
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• pp.1212-1220
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• 2000

Bi-2223 초전도체계에서 석출물을 flux-pinning center로 이용할 수 있는지 가능성을 타진하기 위하여 $Bi_{1.8}$P $b_{0.4}$S $r_{2}$C $a_{2.2}$C $u_3$ $O_{8}$ 조성을 가진 Bi-2223/Ag 선재를 반응온도, 산소분압, 시간 등을 변화시키면서 열처리를 행하였다. 열처리 후 석출물들은 XRD, SEM, TEM, EDS로 분석하였다. Bi-2223 모상내의 (Ca, Sr)$_2$(Pb,Bi) $O_4$, B $i_{0.5}$ P $b_3$S $r_2$C $a_2$Cu $O_{12+}$$\delta$/ (3221)와 같은 2차상들의 크기와 분포는 2223 입자들의 연결성을 파괴하지 않고 열처리 조건에 의해서 조절할 수 있었다. 서냉 열처리가 된 시편은 임계전류밀도( $J_{c}$)값이 증가하였는데, 이는 2223 입자내 나노미터 크기로 형성된 석출물들이 flux-pinning sites로 작용한 것으로 추정된다.다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.2
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• pp.352-354
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• 2010

The effects of Au addition on the structure and the superconducting properties of Bi system bulk have been investigated. Au exists in the metalic form in above materials. It does not affect the formation and structure of the BiSrCaCuO(2223) phase. The superconducting transition temperature Tc does not change for $Bi_{1.7}Pb_{0.3}Sr_2Ca_2Cu_3O$ composite However Au doping can make the grains smaller. Metallic Au can make gathers on the grains boundary and lead to the increment of critical transport current density. The current density of $Bi_{1.7}Pb_{0.3}Sr_2Ca_2Cu_3Au_{0.5}O$ was 1000A/$cm^2$ at liquid nitrogen temperature.