• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.4
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• pp.378-387
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• 1994

To improve the properties of $PbTiO_3$ thin films successfully grown by thermal diffusion of 3 component layers of $Ti0_2/Pb/TiO_2(900{\AA}/900{\AA}/900{\AA})$ in preceding research, 3, 5, 7, 9, and 11 multilayer structures $(TiO_2/Pb/.../Tio_2)$ with thinner component layer of $200~300 {\AA}$ thick were deposited on Si substrate by RF sputtering, which were followed by RTA to form $PbTiO_3$ thin films. As a result, $PbTiO_3$ single phase was formed above $500^{\circ}C$. When the thickness of component layer reduced and the number of component layers increased, suppression of Pb-silicate and voids formation resulted in relatively sharp interfaces and the film composition became more homogeneous. Relative dielectric constants in MIM structure were independent of the annealing condition, but they increased with increasing thickness of the $PbTiO_3$ thin films. The maximum breakdown field in MIS structure reached 150kV/cm.

• Journal of the Korean GEO-environmental Society
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• v.15 no.8
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• pp.39-44
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• 2014

Effects of operating parameters on the breakthrough properties of Pb(II) by $Mn_3O_4$ coated activated carbon prepared by supercritical technique were investigated through fixed-bed column experiments. The mass transfer zone and equilibrium adsorption capacity were enhanced about 2.8 times for Pb(II) by $Mn_3O_4$ coating onto activated carbon. Increase of bed height enhanced the residence time of Pb(II) in adsorption zone, giving the higher breakthrough time, mass transfer zone and equilibrium adsorption capacity. Increase of flow rate reduced the residence time and diffusion of Pb(II) in adsorption zone, therefore decreased the equilibrium adsorption capacity. The higher inlet concentration of Pb(II) decreased the breakthrough time and mass transfer zone through the promotion of Pb(II) transfer onto adsorbent.

• Journal of Welding and Joining
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• v.18 no.3
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• Journal of Korea Foundry Society
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• v.10 no.5
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• pp.435-443
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• 1990

By using the centrifugal atomization, which is one of the rapid solidification processes, Al-5,10wt%Pb alloys which are monotectic alloys were melted at 150K over two liquid phase line in the phase diagram. The melted alloy was poured on the rotating disk, being made into atomized powders, and then the solidified microstructure and morphology of the powder were investigated. This study converted the produced powders into strips by strained powder rolling. According to sintering temperature, the microstructure and hardness were investigated. The solidified structure of the powders were almost cellular dendritic structure. Pb particles ($2.0-3.0{\mu}m$) were fairl distributed in the Al matrix. Powder shapes were irregular. Rolling property and the compacting was good, respectively, because of increasing mechanical interlocking and surface area in the small size powders. With increasing temperature, the boundarys of powders were in porous form due to the diffusion. Pb particles which were surrounding the pores were inverse-segregated at the surface of the powders. With increasing of sintering temperature, the hardness of the powders and the strips decreased. In particular rolling-strip, the hardness abruptly decreased due to the release of work-hardening.

• Korean Journal of Materials Research
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• v.17 no.8
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• The Korean Journal of Ceramics
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• v.6 no.1
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• pp.64-67
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• 2000

Reactively sputtered $Pb(Zr,Ti)O_3$(PZT) films on $IrO_2$and Ir were evaluated with particular consideration on interface properties. The $IrO_2$and Ir were previously annealed at $650^{\circ}C$ in $O_2$or $N_2$atmosphere, respectively. There was no appreciable roughening in the interface of the $PZT/IrO_2$respective to that of the PZT/Ir; the rms roughness of $IrO_2$and Ir was about 3nm and 10nm, respectively. The ferroelectric properties of the $PZT/IrO_2$were found to be better than that of the PZT/Ir; however, the leakage current of the $PZT/IrO_2$was slightly larger than that of the PZT/Ir. The $PZT/IrO_2$thin films did not exhibit any fatigue up to $10^{11}$ cycles; the $P^*\;_r-P^r$ value decreased only from 16.6 to 14$\mu$C/$\textrm{cm}^2$ until $10^{12}$ polarization reversals. On the other hand, although thin $IrO_2$layer was formed between PZT and Ir, the PZT/Ir thin films began to undergo fatigue after $10^9$ polarization reversals.

• Journal of the Korean Vacuum Society
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• v.7 no.1
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• pp.17-23
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• 1998

$Pb(Fe_{0.5}Nb_{0.5}O_3(PFN)$ thin films were prepared by rf magnetron co-sputtering method on $SiO_2/Si$, ITO/glass, and $Pt/Ti/SiO_2/Si$ substrates and post-annealed at the $N_2$ atmosphere by RTA(rapid thermal annerling). The degree of crystallinity of PFN films was identified on various substrates. Electrical properties of PFN films was characterized for $Pt/PFN/Pt/Ti/SiO_2/Si$ structure. The composition of PFN films was estimated by EPMA (electron probe micro analysis). PFN films would be crystallized better to perovskite phase on ITO/glass substrate than $SiO_2/Si$ substrate. This may be induced by the deformation of Pb deficient pyrochlore phase due to Pb diffusion into $SiO_2/Si$ substrate. PFN films on $Pt/Ti/SiO_2/Si$ substrate. PFN films with 5-10% Pb excess were crystallized to perovskite phase from $500^{\circ}C$ temperature. In summary, we show that Pb composition and annealing temperature were critically influenced on crystallinity to perovskite phase. When PFN film with 17% Pb excess was annealed at $600^{\circ}C$ at the $N_2$ atmosphere for 300kV/cm and 88. Its remnant polarization coercive field $2.0 MC/cm^2$ and 144kV/cm, respectively.

• Journal of Surface Science and Engineering
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• v.52 no.2
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• pp.90-95
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• 2019

Methylammonium lead bromide ($MAPbBr_3$) has attracted a lot of attention due to their excellent optoelectronic properties such as the compositional flexibility relevant to photoluminescence (PL) and UV-Vis absorbance spectrum, high diffusion length, and photoluminescence quantum yield (PLQY). Despite such advantages of organic-inorganic perovskite materials, more systematic study on manipulation of their optoelectronic properties in homo- or heterovalent metal ions doped halide perovskite nanocrystals is lacking. In this study, we systematically investigated the optical properties of colloidal $CH_3NH_3Pb_{1-x}Sn_xCl_{2x}Br_{3-2x}$ particles by addition of $SnCl_2$ into the typical methylammonium lead tribromide ($CH_3NH_3PbBr_3$) precursor solution. We found that only 1% addition of $SnCl_2$ shows a significant blue-shift from 540 nm to 420 nm in UV-Vis absorbance spectrum due to the strong quantum confinement effect. Furthermore, continuous blue-shift in photoluminescence spectra was observed as the amount of Cl increases. These experimental results provide new insights into the replacement of Pb within $MAPbBr_3$, required for the broadening of their application.

• Economic and Environmental Geology
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• v.55 no.4
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• pp.367-376
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• 2022

One of biopolymer, β-glucan (BG) chains were crosslinked by citric acid under the heating condition for the adsorption of Pb and Cu ions in the aqueous solution. The variation of functional groups on BG itself and crosslinked β-glucan (CBG) with their surface adsorption characteristics were investigated by FTIR and SEM-EDX. Adsorption kinetic results showed that adsorption of Pb and Cu onto the CBG followed the pseudo-second-order kinetic model and intra-particle diffusion model. The Langmuir adsorption model was depicted better adsorption characteristics than the Freundlich model. The adsorption capacities of Pb and Cu onto the CBG estimated by the Langmuir model were 59.70 and 23.44 mg/g, respectively. This study suggested that CBG may act as an eco-friendly adsorbent for the adsorption of Pb and Cu in the aqueous solution.

• Journal of the Korean Ceramic Society
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• v.35 no.9
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• pp.895-898
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• 1998