• 제목/요약/키워드: Pattern Density

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3D 프린팅을 이용한 P LA+ 소재의 채움 패턴 및 밀도 변화에 따른 인장강도 연구 (A Study on Tensile Strength Dependent on Variation of Infill Pattern and Density of PLA+ Material Using 3D Printing)

  • 나두현;김현준
    • 소성∙가공
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    • 제31권5호
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    • pp.281-289
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    • 2022
  • Presently, 3D printers manufactured by material extrusion are economical and easy to use, so they are being used in various fields. However, this study conducted a tensile test on the infill pattern and density of the PLA+ material, due to the limitations of long printing time as well as low mechanical strength. The infill area for the infill density change was measured, using a vision-measuring machine for four infill patterns (concentric, zigzag, honeycomb, and cross) in which the nozzle path was the same for each layer. The tensile strength/weight[MPa/g] and tensile strength/printing time[MPa/min] of the tensile specimens were analyzed. In this study, efficient infill density and patterns are suggested, for cost reduction and productivity improvement. Consequently, it was confirmed that the infill area and infill percentage of the four patterns, were not constant according to the infill pattern. And the tensile strength of the infill density 40% of the honeycomb pattern and infill density 20% of the cross pattern, tended to highly consider the weight and printing time. Honeycomb and cross patterns could reduce the weight of the tensile specimen by 19.11%, 28.07%, as well as the printing time by 29.56%, 52.25%. Tensile strength was high in the order of concentric, zigzag, honeycomb, and cross patterns, considering the weight and printing time.

간단한 지수함수를 패턴 밀도 함수로 이용한 LGP 패턴 설계 (LGP Pattern Design by Using a Pattern Density Function with Simple Exponential Function)

  • 김영철;김대욱;오태식;이용민;안승준;김호섭
    • 한국광학회지
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    • 제21권3호
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    • pp.97-102
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    • 2010
  • 전산모사를 통하여 LGP 출력 분포를 조절할 수 있는 패턴 밀도 함수를 찾고 그 효과를 조사하였다. 패턴 밀도 함수, 즉 패턴 간격은 [Pexp(-y/70)+Qexp(+y/25)]R로 조사되었다. 이 함수를 이용하여 패턴의 간격을 조절하는 방식으로 반구형 패턴이 장착된 도광판을 설계하여 도광판 출력 분포를 분석한 결과 출력 분포가 등간격 패턴에 의한 출력 분포에 비하여 확연히 개선되는 것을 확인하였다. 또한 이 함수를 피라미드 패턴에 적용하여 도광판의 출력을 조사하였는데, 반구형 패턴의 경우와 마찬가지로 출력 분포가 개선되는 것을 확인하였다.

치밀형 유방에서 유방특이감마영상검사의 유용성 평가 (A Study on Comparative Analysis of Mammography and Tc-99m MIBI Scintimammography for Dense Breast)

  • 정은미;김호성
    • 핵의학기술
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    • 제16권1호
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    • pp.76-79
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    • 2012
  • Purpose: This study was to evaluate usefulness of $^{99m}Tc$-MIBI scintimammography for dense breast by comparing concordance in test results between Tc-99m MIBI scintimammography and mammography whose effect was proved the most as an imaging tool depending on breast density and at the same time by examining limitation on evaluation depending on density of breast tissue. [Materials and Methods] In the period from December 2010 to July 2011, this study targeted 150 patients who took both of $^{99m}Tc$-MIBI scintimammography and mammography conducted by using breast gamma camera in this hospital. Breast density was classified to the four levels of pattern 1~4 based on the results of mammography. $^{99m}Tc$-MIBI scintimammography was conducted with the LCC, the RCC, the LMLO, and the RML one minute after intravenous injection of 99mTc-MIBI 7400 MBq (20 mCi) while analysis was made for concordance in test results of $^{99m}Tc$-MIBI scintimammography and mammography. [Results] Among the 150 patients, pattern 1 was found in 3 patients, pattern 2 in 44 patients, pattern 3 in 61 patients, and pattern 4 in 37 patients. There were 5 patients who showed the case where it was impossible to determine density of breast tissue due to foreign body inserted to breast. The concordance ratio of the results between $^{99m}Tc$-MIBI scintimammography and mammography was 95.5% for pattern 2, 95.1% for pattern 3 and 94.6% for pattern 4. This demonstrated that the concordance rate decreased according to the increase in breast density. [Conclusion] When there was limitation on evaluation of breast specific gamma imaging test results due to increased intake in breast tissue or surgical site, the concordance rate was 6.8% for pattern 2, 16.3% for pattern 3 and 18.9% for pattern 4. This demonstrated that the degree of limitation on evaluation of breast specific gamma imaging test results increased according to the increase in breast density.

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패턴에 따른 층간절연막 CMP의 모델리에 관한 연구 (The Study on Pattern Dependent Modeling of ILD CMP)

  • 홍기식;정해도
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.1121-1124
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    • 2001
  • In this study, we verify th effects of pattern density on interlayer dielectric chemical mechanical polishing process based on the analysis of Preston's equation and confirm this analysis by several experiments. Appropriate modeling equation, transformed form Preston's equations used in glass polishing, will be suggested and described the effects of this modeling during pattern wafer ILD CMP. Results indicate that the modeling is well agreed to middle density structure of the die in pattern wafer, but has some error in low and high density structure of the die. Actually, the die used in Fab, was designed to have a appropriate density, therefore this modeling will be suitable for estimating the results of ILD CMP.

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STI-CMP공정에서 표면특성에 미치는 패턴구조 및 슬러리 종류의 효과 (Effect of pattern spacing and slurry types on the surface characteristics in 571-CMP process)

  • 이훈;임대순;이상익
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 제35회 춘계학술대회
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    • pp.272-278
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    • 2002
  • Recently, STI(Shallow Trench Isolation) process has attracted attention for high density of semiconductor device as a essential isolation technology. In this paper, the effect of pattern density, trench width and selectivity of slurry on dishing in STI CMP process was investigated by using specially designed isolation pattern. As trench width increased, the dishing tends to increase. At $20{\mu}m$ pattern size, the dishing was decreased with increasing pattern density Low selectivity slurry shows less dishing at over $160{\mu}m$ trench width, whereas high selectivity slurry shows less dishing at below $160{\mu}m$ trench width.

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패턴 밀도를 고려한 Chemical Mechanical Polishing에 관한 연구 (A Study on Chemical Mechanical Polishing using Pattern Density based Modeling)

  • 이재경;문원하;황호정
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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    • pp.221-224
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    • 2002
  • Recently, simulation of Chemical Mechanical Polis hing is becoming more important because Process parameters on the material removal rate are complicated. And pattern-depent effects are a key concern in CMP processes. In this paper, we have been studied the changes of pattern density vs. oxide thickness with Stine's simulation model. We also have estimated the effective density using optimal window size with density mask, and have made a study of the change of oxide thickness as a function of polishing time.

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소실모형구조법에 의한 탄소강주강 제조시의 Carbon Pick-up 현상 (Carbon Pick-up Phenomena in Plain Carbon Steel by Evaporative Pattern Casting Process)

  • 박익민;박희상;이동렬;이경환;이진형
    • 한국주조공학회지
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    • 제23권2호
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    • pp.86-93
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    • 2003
  • It has been a major concern in the foundry that steel castings manufactured by the evaporative pattern casting process encounter the carbon pick-up problem. A carbon rich layer at the evaporative pattern cast surface is a result of interactions between the gaseous products from foamed polystyrene and the molten metal. The carburized layer with a high hardness makes it difficult to machine the casting. In this study, the influence of the density of EPS pattern and coatings on carbon pick-up phenomena of S25C and S45C commercial carbon cast steel were investigated. As the density of EPS pattern is increased, the carbon concentration of decomposed pattern is increased and the thickness of carburized layer at the surface of steel castings is increased. Also as the density of coatings is increased, the permeability of coatings is decreased and the thickness of carburized layer at the surface of steel castings is increased. S25C steel which has lower original carbon content compared to S45C steel exhibited severe carburization.

패턴 웨이퍼의 화학기계적 연마시 패턴 밀도의 영향과 모델링에 관한 연구 (A Study on the Effect of Pattern Density and it`s Modeling for ILD CMP)

  • 홍기식;김형재;정해도
    • 한국정밀공학회지
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    • 제19권1호
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    • pp.196-203
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    • 2002
  • Generally, non-uniformity and removal rate are important factors on measurements of both wafer and die scale. In this study, we verify the effects of the pressure and relative velocity on the results of the chemical mechanical polishing and the effect of pattern density on inter layer dielectric chemical mechanical polishing of patterned wafer. We suggest an appropriate modeling equation, transformed from Preston\`s equations which was used in glass polishing, and simulate the removal rate of patterned wafer in chemical mechanical polishing. Results indicate that the pressure and relative velocity are dominant factors for the chemical mechanical polishing and pattern density effects on removal rate of pattern wafers in die scale. The modeling is well agreed to middle and low density structures of the die. Actually, the die used in Fab. was designed to have an appropriate density, therefore the modeling will be suitable for estimating the results of ILD CMP.

레이저 가공된 내부 및 표면패턴을 가지는 도광판 성능 분석 (Performance analysis of light guide panel implemented with laser-processed inner and surface patterns)

  • 최영희;신용진;최은서
    • 한국레이저가공학회지
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    • 제11권1호
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    • pp.1-6
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    • 2008
  • We proposed new light guide panel (LGP) fabrication method exploiting laser-processed inner scatterers and surface pattern. The proposed method has achieved LGP performance improvement in both brightness and uniformity. The inner scatterers and surface pattern of grid type were fabricated with a 2nd harmonic Nd:YAG pulse laser engraving system and a $CO_2$ laser scanning system, respectively. In the implementation of LGP, inner scatterers was arranged in accordance with linear or curved pattern with changing density and surface pattern was engraved on the surface of an inner-scatterers embedded LGP. The increase of scatterers' density and the use of surface patterns in both linear and curved pattern provided high luminance and uniformity enhancement. While thecurved pattern incorporated with increased scatterers' density and surface patterns yielded brightness improvement with preserving good uniformity, the linear pattern showed highly localized brightness near the light entrance of the LGP. We can also observe that the uniformity was mainly determined by pattern of inner scatterers, and the brightness was improved by the higher density and the utilization of surface patterns. From the results, the use of laser-processed inner and surface patterns can be a potential alternative for efficient and simple LGP fabrication method.

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HSS을 적용한 STI CMP 공정에서 EPD 특성 (A study of EPD for Shallow Trench Isolation CMP by HSS Application)

  • 김상용;김용식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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    • pp.35-38
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    • 2000
  • In this study, the rise throughput and the stability in fabrication of device can be obtained by applying of CMP process to STI structure in 0.l8um semiconductor device. Through reverse moat pattern process, reduced moat density at high moat density, STI CMP process with low selectivity could be to fit polish uniformity between low moat density and high moat density. Because this reason, in-situ motor current end point detection method is not fit to the current EPD technology with the reverse moat pattern. But we use HSS without reverse moat pattern on STI CMP and take end point current sensing signal.[1] To analyze sensing signal and test extracted signal, we can to adjust wafer difference within $110{\AA}$.

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