한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2001년도 춘계학술대회 논문집
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- Pages.1121-1124
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- 2001
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- 2005-8446(pISSN)
패턴에 따른 층간절연막 CMP의 모델리에 관한 연구
The Study on Pattern Dependent Modeling of ILD CMP
초록
In this study, we verify th effects of pattern density on interlayer dielectric chemical mechanical polishing process based on the analysis of Preston's equation and confirm this analysis by several experiments. Appropriate modeling equation, transformed form Preston's equations used in glass polishing, will be suggested and described the effects of this modeling during pattern wafer ILD CMP. Results indicate that the modeling is well agreed to middle density structure of the die in pattern wafer, but has some error in low and high density structure of the die. Actually, the die used in Fab, was designed to have a appropriate density, therefore this modeling will be suitable for estimating the results of ILD CMP.
키워드