• Journal of the Korean Chemical Society
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• v.53 no.4
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• pp.466-470
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• 2009

• Journal of Power System Engineering
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• v.20 no.3
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• pp.17-21
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• 2016

The corrosion behavior of aluminum alloys in the $H_2SO_4$ solution was investigated based on potentiodynamic techniques. Electrochemical properties, such as corrosion potential($E_c$), passive potential($E_p$), corrosion current density($I_c$), corrosion rate(mpy), of Al-Mg-Si, Al-Cu-Si and Al-Si alloys were characterized at room temperature. Passive aluminum oxide film, which including $Al_2(SO_4)_3$ and $3Al_2O_34SO_38H_2O$, were uniformly formed on the surface via the reaction of Al with $SO{_3}^{2-}$ or $SO{_4}^{2-}$ ions in the $H_2SO_4$ solution and the dependence of the corrosion behavior on the alloying element was discussed. The selective leaching of alloy element increased with increasing Cu content in the aluminum alloys.

• Journal of the Korean Chemical Society
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• v.60 no.3
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• pp.169-176
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• 2016

In a borate buffer solution, the growth kinetics and the electronic properties of passive film on aluminum were investigated, using the potentiodynamic method, chronoamperometry, and multi-frequency electrochemical impedance spectroscopy. The corrosion of aluminum was heavily influenced by the degree of oxygen concentration because of the increasing reduction current. The oxide film formed during the passivation process of aluminum has showed the electronic properties of n-type semiconductor, which follow from the Mott-Schottky equation. It was found out that the passive film (Al(OH)₃) of Al formed in the low electrode potential changes to Al₂O₃ while the electrode potential increases. The growth kinetics data as measured by chronoamperometry suggests a mechanism in which the growth of the film of Al₂O₃ is determined by field-assisted transport of ions through the film.

• Journal of the Korean Chemical Society
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• v.54 no.4
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• pp.380-386
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• 2010

We have investigated the growth kinetics of Al oxide film by anodization in sulfuric acid solution and the electronic properties of this film using electrochemical impedance spectroscopy. Al oxide film consisted $Al_2O_3$ was grown based on the point defect model and shown the eclctronic properties of n-type semiconductor.

• Corrosion Science and Technology
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• v.12 no.1
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• pp.40-49
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• 2013

Effects of magnesium and pH on corrosion of aluminum galvanically coupled to iron have studied by using potentio- dynamic and static tests for polarization curves, Mott-Schottky test for analysis of semiconductor property, and GD-AES and XPS for film analysis. Pitting potential was sensitive to magnesium as an alloying element but not to pH, while passive current was sensitive to pH but not to magnesium. It was explained with, instead of point defect model (PDM), surface charge model describing that the ingression of chloride depends on the state of surface charge and passive film at film/solution interface is affected by pH. In addition, galvanic current of aluminum electrically coupled to iron was not affected by magnesium in pH 8.4, 0.2M citrate solution but was increased by magnesium at the solution of pH 9.1. The galvanic current at pH 9.1 increased with time at the initial stage and after the exposure of about 200 minute, decreased and stabilized. The behavior of the galvanic current was related with the concentration of magnesium at the surface. It agreed with the depletion of magnesium at the oxide surface by using glow discharge atomic emission spectroscopy (GD-AES). In addition, pitting potential of pure aluminum was reduced in neutral pH solution where chloride ion maybe are competitively adsorbed on pure aluminum. It was confirmed by the exponential decrease of pitting potential with log of [$Cl^-$] around 0.025 M of [$Cl^-$] and linear decrease of the pitting potential. From the above results, unlike magnesium, alloying elements with higher electron negativity, lowering isoelectric point (ISE), are recommended to be added to improve pitting corrosion resistance of aluminum and its alloys in neutral solutions as well as their galvanic corrosion resistance in weakly basic solutions.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.276-277
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• 2006

In order to accelerate the sintering of Al-Bronze powder covered with passive oxide film, we focused on the way to add Al-Ca fluoride consisting of $AlF_3$ and $CaF_2$, examined the effect of the $CaF_2$ mixing rate in Al-Ca fluoride, the amount of the added Al-Ca fluoride and the sintering temperature on sintering properties of Al-Bronze powder and considered the mechanism of the sintering acceleration. Al-Bronze powder was sintered most effectively by adding Al-Ca fluoride with the $CaF_2$ mixing rate of 20mass%. If the amount of added fluoride was over 0.05mass% and the sintering temperature was over 1123K, the sintering acceleration of the Al-Bronze powder appears. Regarding the mechanism of the sintering acceleration, it was presumed that $Al_2O_3$ film on the surface of the Al-Bronze particles was removed in the process of the formation of gaseous AlOF by the reaction with $AlF_3$, and the reaction was accelerated further by the presence of the liquid phase which is formed in Al-Ca fluoride.