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http://dx.doi.org/10.5012/jkcs.2016.60.3.169

Atmospheric Effects on Growth Kinetics and Electronic Properties of Passive Film of Aluminum in Borate Buffer Solution  

Kim, Younkyoo (Department of Chemistry, College of Natural Science, Hankuk University of Foreign Studies)
Publication Information
Journal of the Korean Chemical Society / v.60, no.3, 2016 , pp. 169-176 More about this Journal
Abstract
In a borate buffer solution, the growth kinetics and the electronic properties of passive film on aluminum were investigated, using the potentiodynamic method, chronoamperometry, and multi-frequency electrochemical impedance spectroscopy. The corrosion of aluminum was heavily influenced by the degree of oxygen concentration because of the increasing reduction current. The oxide film formed during the passivation process of aluminum has showed the electronic properties of n-type semiconductor, which follow from the Mott-Schottky equation. It was found out that the passive film (Al(OH)3) of Al formed in the low electrode potential changes to Al2O3 while the electrode potential increases. The growth kinetics data as measured by chronoamperometry suggests a mechanism in which the growth of the film of Al2O3 is determined by field-assisted transport of ions through the film.
Keywords
Aluminum; Oxidation-film; Logarithmic rate law; Mott-Schottky; n-type semiconductor;
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1 Pourbaix, M. Atlas of Electrochemical Equilibria; J. A. Franklin, Ed.; Nat. Assoc. Corr. Eng.: Houston, 1974; p168-176.
2 Bockris, J.O’M.; Khan, S. U. M. Surface Electrochemistry, A Molecular level Approach; Plenum: New York, 1993; p 771.
3 Vargel, C.; Jacques, M.; Schmidt, M. P. “Corrosion of Aluminium”, Elsevier, 2004, Science-Direct Online Ed. 2007, 113.
4 El-Shfei, A. A.; Abd El-Maksoud, S. A.; Fouda, A. S. Corros. Sci., 2004, 46, 579.   DOI
5 Barik, R. C.; Wharton, J. A.; Wood, R. J. K.; Stokes, K. R.; Jones, R. L. Surf. Coat. Tech., 2005, 199, 158.   DOI
6 Sherif, E. M.; Park, S.-M. Electrochim. Acta, 2006, 51, 1313.   DOI
7 Lee, W.; Pyun, S. Electrochim. Acta, 2000, 45, 1901.   DOI
8 Osman, M. M. Mater. Chem. and Phys., 2001, 71, 12.   DOI
9 Zhu, D.; van Ooij, W. J. Corros. Sci., 2003, 45, 2177.   DOI
10 Abdel-Garber, A. M.; Abd-El-Nabey, B. A.; Sidahmed, I. M.; El-Zayady, A. M.; Saadawy, M. Mater. Chem. and Phys., 2006, 98, 291.   DOI
11 Rozenfeld, I. L. "Corrosion Inhibitors" (Translated by Ron and Hilary Hardin), McGraw-Hill, New York, 1981.
12 Lunder, O.; Walmsley, J. C.; Mack, P.; Nisancioglu, K. Corros. Sci., 2005, 47, 1604.   DOI
13 Bethencourt, M.; Botana, F. J.; Calvino, J. J.; Marcos, M. J.; Rodriguez-Chacon, M. A. Corros. Sci., 1998, 40, 1803.   DOI
14 Bethencourt, M.; Botana, F. J.; Cano, M. J.; Marcos, M. J. Appl. Surf. Sci., 2002, 189. 162.   DOI
15 Bethencourt, M.; Botana, F. J.; Cano, M. J.; Marcos, M. J. Appl. Surf. Sci., 2004, 238. 278.   DOI
16 Kim, J.; Pyun, S. Electrochim. Acta, 1995, 40, 1863.   DOI
17 Barbucci, A.; Bruzzone, G.; Delucchi, M.; Panniza, M.; Cerisola, G. Intermetallic, 2000, 8, 305.   DOI
18 Szklarska-Smialowska, Z. Corros. Sci., 2002, 44, 1143.   DOI
19 McCafferty, E. Corros. Sci., 2003, 45, 301.   DOI
20 Chon, J.-K.; Kim, Y. J. Kor. Chem. Soc., 2009, 53(4), 466.   DOI
21 Chon, J.-K.; Kim, Y. J. Kor. Chem. Soc., 2010, 54(4), 380.   DOI
22 Chen, D.; Howe, K. J.; Dallman, J.; Letellier, B. C. Corros. Sci., 2008, 50, 1046.   DOI
23 Chon, J.-K.; Paik, W. J. Kor. Chem. Soc., 1974, 18, 391.
24 Martin, F. J.; Cheek, G. T.; O’Grady, W. E.; Natishan, P. M. Corros. Sci., 2005, 47, 3187.   DOI
25 Peskov, Y. V. Electric double layer on semiconductor electrode, In Comprehensive Treatise of Electrochemistry; Bockris, J.O'M., Conway, B. E., Yeager, E., Eds.; Plenum Press: New York, 1980; Vol. 1, Chapt. 6.
26 Bott, A. W. Current Separations, 1998, 17, 87.
27 Sikora, E.; Macdonald, D. D. Electrochim., Acta, 2002, 48, 69.   DOI
28 Boinet, M.; Maximovitch, S.; Dalard, F.; Bouvier, O. J. Mat. Sci., 2003, 38, 4041.   DOI
29 Bondarenko, A. S.; Ragoisha, G. A. J. Solid State Electrochem., 2005, 9, 845.   DOI
30 Wielant, J.; Goossens, V.; Hausbrand, R.; Terryn, H. Electrochim. Acta, 2007, 52, 7617.   DOI
31 Hsu, C.; Mansfeld, F. Corrosion, 2001, 57, 747.   DOI
32 Fernandes, J. C. S.; Picciochi, R.; Belo, M. D. C.; Silva, T.M.; Ferreira, M.G.S.; Fonseca, I.T.E. Electrochim. Acta, 2004, 49, 4701.   DOI
33 Martin, F. J.; Cheek, G. T.; O’Grady, W. E.; Natishan, P. M. Corros. Sci., 2005, 47, 3187.   DOI
34 Hiemstra, T.; Yong, H.; Riemsdijk, V. Langmuir, 1999, 15, 5942.   DOI
35 Bessone, J. B.; Salinas, D. R.; Mayer, C. E.; Ebert, M.; Lorenz, W. J. Electrochim. Acta, 1992, 37, 2283.   DOI
36 Vargel, C.; Jacques, M.; Schmidt, M. P. "Corrosion ofAluminium", Elsevier, 2004, Science-Direct Online Ed. 2007, pp102-105
37 Vargel, C.; Jacques, M.; Schmidt, M. P. "Corrosion of Aluminium", Elsevier, 2004, Science-Direct Online Ed. 2007, pp173-178
38 Vargel, C.; Jacques, M.; Schmidt, M. P. "Corrosion of Aluminium", Elsevier, 2004, Science-Direct Online Ed. 2007, p320