• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.10
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• pp.1049-1054
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• 2012

Continued advancements in organic materials have led to the development of organic devices that are thin, flexible, and lightweight and that can potentially be used as low-cost energy-conversion devices. While these devices have many advantages, the environmentally induced degradation of the active materials and the low-work-function electrodes remain a valid concern. Hence, many vacuum deposition processes have been applied to develop low-permeation barrier coatings. In this work, we present the results pertaining to the developed thin-film encapsulation. Multilayer encapsulation involves the use of $SiO_x$ or $SiN_x$ with parylene. The effective water vapor transmission rates were investigated using a Ca-corrosion test. The integration of the developed barrier layers was demonstrated by encapsulating pentacene/$C_{60}$ solar cells, and the results are presented.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.4
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• pp.359-364
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• 2014

This paper describes the development of needle type probe that measures temperature and injects medicine for both diagnosis and treatment of musculoskeletal pain syndrome (MPS). The size of trigger points is from several micrometers to millimeter. Therefore, it is required to develop a medical device that is capable of not only finding the trigger points by temperature measurement, but also injecting medicine at the exact location for treatment. To challenge these difficulties, thermocouple was fabricated on the surface of a needle using metal deposition process. Special type of stainless-constantan thermocouple was achieved from the stainless body of a needle itself and deposited constantan metal film. In particular, parylene coating enables to limit the temperature sensitive area to the end of the needle tip. Fabricated needle type probe produces $3.25mV/^{\circ}C$ of thermoelectric sensitivity and compared its performance with commercial T-type thermocouple in animal muscle sample.

• Transactions on Electrical and Electronic Materials
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• v.4 no.5
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• pp.15-18
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• 2003

The Cd$\_$1-x/Zn$\_$x/Te film was produced by thermal evaporation for the flat-panel X-ray detector. The crystal structure and the surface morphology of poly crystalline Cd$\_$1-x/Zn$\_$x/Te film were examined using XRD and SEM, respectively. The leakage current and X-ray sensitivity of the fabricated films were measured to analyze the X-ray response characteristic of Zn in a polycrystalline CdZnTe thin film. The leakage current and the output charge density of Cd$\_$0.7/Zn$\_$0.3/Te thin film were measured to 0.3 1nA/$\textrm{cm}^2$ and 260 pC/$\textrm{cm}^2$ at an applied voltage of 2.5 V/$\mu\textrm{m}$, respectively. Experimental results showed that the increase of Zn doping rates in Cd$\_$1-x/Zn$\_$x/Te detectors reduced the leakage current and improved the X-ray sensitivity significantly. The leakage current was drastically diminished by the formation of thin parylene layer in the Cd$\_$0.7/Zn$\_$0.3/Te detector.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.1051-1054
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• 2000

We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2＊0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5＊2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.506-508
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• 2005

In general, organic TFTs are comprised of four components: gate electrode, gate dielectric, organic active semiconductor layer, and source and drain contacts. The TFT current, in turn, is typically determined by channel length and width, carrier field effect mobility, gate dielectric thickness and permittivity, contact resistance, and biasing conditions. More recently, a number of techniques and processes have been introduced to the fabrication of OTFT circuits and displays that aim specifically at reduced fabrication cost. These include microcontact printing for the patterning of metals and dielectrics, the use of photochemically patterned insulating and conducting films, and inkjet printing for the selective deposition of contacts and interconnect pattern. In the fabrication of organic TFTs, microcontact printing has been used to pattern gate electrodes, gate dielectrics, and source and drain contacts with sufficient yield to allow the fabrication of transistors. We were fabricated a pentacene OTFTs on flexible PEN film. Au/Cr was used for the gate electrode, parylene-c was deposited as the gate dielectric, and Au/Cr was chosen for the source and drain contacts; were all deposited by ion-beam sputtering and patterned by microcontact printing and lift-off process. Prior to the deposition of the organic active layer, the gate dielectric surface was treated with octadecyltrichlorosilane(OTS) from the vapor phase. To complete the device, pentacene was deposited by thermal evaporation and patterned using a parylene-c layer. The device was shown that the carrier field effect mobility, the threshold voltage, the subthreshold slope, and the on/off current ratio were improved.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.12
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• pp.591-596
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• 2002

This paper Presents the fabrication and test of a micropump that can be applied to an implantable cerebrospinal fluid shunt system for hydrocephalus patients The proposed micropump consists of a pair of corrugated parylene diaphragm chambers and a set of nozzle and diffuser. The electromagnetic force drives the diaphragms and pumps the fluid. The static or dynamic characteristics of the fabricated devices have been obtained experimentally. The site of the micropump is $14 \times 12 \times 8mm^3$. The flow rate increase by about $3 mell/h$ was observed in the operational pressure range the micropump.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.155-155
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• 1999

반도체 소자의 초고집적화와 고속화에 따라 최소 선폭이 급격히 줄어듬에 따라 현재 사용되고 있는 다층금속배선의 층간절연막 0.18$\mu\textrm{m}$ 급 이상의 소자에 적용할 경우 기생정전용량이 증가하여 신호의 지연 및 금속배선간에 상호간섭현상으로 반도체 소자의 동작에 심각한 문제가 대두되고 있다. 이러한 물제를 해결하기 위하여 nonoporous silica, fluorinated amorphous carbon, polyimides, poly(arylene)ether, parylene, AF4, poly(tetrafluoroethylene), divinyl siloxane bisbenzocyclobutene, Silk, 그리고 유무기 hybrid nanofoam 등이 저유전물질로 각광을 받고 있으며, 여기에 대한 연구가 우리나라를 비롯하여 미국, 일본 등에서 많은 연구가 이루어지고 있다. 따라서 본 연구에서는 2003년에 개발될 0.13$\mu\textrm{m}$급 이상의 차세대 반도체 소자에 적용될 수 있는 저유전물질 개발현황과 이들 물질 중 4GDRAM 급이상의 소자에 적용가능성이 가장 높은 유무기 hybrid nanofoam, a-C:F와 C:F-SiO2 박막에 대한 특성에 대하여 소개하고자 한다.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.973-974
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• 2004

We report the fabrication of flexible plastic ITO substrates and the measurement of oxidant permeation through the substrates. The plastic ITO substrates are composed of multiple organic and inorganic thin films. The organic thin films are deposited by vapor polymerization and the inorganic films are deposited by ion beam sputtering. In order to estimate the oxidant permeation rate, the pure Ca film is formed on the substrates and the amount of CaO produced by the oxidation of Ca is measured.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.979-982
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• 2008

We studied hybrid passivation using parylene-C, metal, photoacyl and indium zinc oxide for pentacene OTFT to assure stability in subthreshold region. After the passivation, the changes in S and $V_{on}$ of OTFT were negligible and $I_{off}$ maintained its initial value of ${\sim}10^{-12}$ A. Therefore, the hybrid passivation is suitable for practical applications based on OTFT.