• The Transactions of the Korean Institute of Power Electronics
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• v.15 no.4
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• pp.274-281
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• 2010

This paper proposes a DFPS (Dual Frequency Power Source) impedance matching device for uniformity improvement of a semiconductor plasma etching system. The DFPS consists of two parts for safe plasma processing on large-area substrates. The first part is an ICP (Inductively Coupled Plasma) for high integration by using ferrite core. The second part is a CCP (Capacitive Coupled Plasma) to control uniformity of whole cells. Proposed DFPS can achieve high productivity improvement required for semiconductor equipment industry. The proposed plasma system is analyzed, simulated and experimentally verified with a matching equipment at 27.12MHz and 400kHz.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.230-233
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• 2007

A system of anodic process of aluminum thin film has implemented for nanofabrication. The manufactured equipment consists of three main parts: chiller, reaction bath and power supply. The chiller module consists of refrigeration compressor, copper tube and coolant with a thermostat. The reaction bath has kept in same temperature as a thermodynamic canonical ensemble system during the anodic reaction process. The magnetic bar has stirred oxalic acid in bath for uniform reaction. The DC power supply has applied into two electrodes, aluminum for anode and platinum for cathode in the oxalic acid. The anodization process results in the formation of nanoporous thin films.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.2
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• pp.38-47
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• 2001

This paper decribes the development of computer-aided design of a very precise progressice die for lead frame of semiconductor chip. The approach to the system is based on knowledgr-based rules. Knowledge of fie이 experts. This system has been written in AutoLISP using AutoCAD ona personal computer and the I-DEAS drafting programming Language on the I-DEAS mater series drafting with on HP9000/715(64) workstation. Data exchange between AutoCAD and I-DEAS master series drafting is accomplished using DXF(drawing exchange format) and IGES(initial graphics exchange specification) files. This system is composed of six main modules, which are input and shape treatment, production feasibility check, strip layout, data conversion, die layout, and post processing modules. Based on Knowledge-based rules, the system considers several factors, such as V-notches, dimple, pad chamfer, spank, cavity punch, camber, coined area, cross bow, material and thickness of product, complexities of blank geometry and punch profiles, specifications of available presses, and the availability of standard parts. As forming processes and the die design system using 2D geometry recognition are integrated with the technology of process planning, die design, and CAE analysis, the standardization of die part for lead frames requiting a high precision process is possible. The die layout drawing generated by the die layout module s displayed in graphic form. The developed system makes it possible to design and manufacture lead frame of a semiconductor more efficiently.

• Journal of Powder Materials
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• v.8 no.4
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• pp.245-252
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• 2001

Recent remarkable progress in the semiconductor industry has promoted smaller size of semiconductor chips and increased amounts of heat generation. So, the demand for a substrate material to meet both the characteristics of thermal expansion coefficient and heat radiation has been on the increase. Under such conditions, tungsten(W)-copper(Cu) has been proposed as materials to meet both of the above characteristics. In the present study, the W-10wt.%Cu powders were synthesised by the mixing and hydrogen reduction of the starting mixture materials such as W-Cu, $W-CuCl_2$and $WO_3-CuCl_2$ in order to obtain the full densification. The W-10wt.%Cu produced by hydrogen reduction showed the higher interparticle friction than the simple mixed W-10wt%Cu because of the W agglomerates. In the dilatometric analysis the W-10wt.%Cu prepared from the $W-CuCl_2$was largely shrank by heating up $1400^{\circ}C$ at the constant heating rate of $5^{\circ}C$/min. The possibility of application of metal injection molding (MIM) was also investigated for mass production of the complex shaped W-Cu parts in semiconductor devices. The relationship between the temperature of molding die and the pressure of injection molding was analyzed and the heating up stage of 120-$290^{\circ}C$ in the debinding process was controlled for the most suitable MIM condition.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.52-58
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• 2017

In this study, we tried to analyze and measure the correlation between the part dimensional tolerance empirically applied by the designer and the final performance of the equipment, which is expressed as the pressing pressure uniformity. For this purpose, the dimensional tolerances and pressing pressure uniformity of eight laminator equipments were measured actually. As a result of the correlation analysis, it was confirmed that the tolerance grade for each dimension determined by the designer was valid. In the case of laminator equipment, the driving parts and the flatness have the largest influence on the uniformity of the pressing pressure.

• Advances in nano research
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• v.2 no.3
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• pp.173-177
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• 2014

This study is aimed to the numerical modeling of the surface plasmon-polariton excitation by a layer of active (electrically pumped) quantum dots embedded in a semiconductor, covered with a metal. It is shown that this excitation becomes much more efficient if the metal has a form of a thin (with thickness of several nanometers) film. The cause of this enhancement in comparison with a thick covering metal film is the partial surface plasmon-polariton localized at the metal-semiconductor interface penetration into air. In result the real part of the metal+air half-space effective dielectric function becomes closer (in absolute value) to the real part of the semiconductor dielectric function than in the case of a thick covering metal film. This leads to approaching the point of the surface plasmon-polariton resonance (where absolute values of these parts coincide) and, therefore, the enhancement of the surface plasmon-polariton excitation. The calculations were made for a particular example of InAs quantum dot layer embedded in GaAs matrix covered with an Au film. Its results indicate that for the 10 nm Au film the rate of this excitation becomes by 2.5 times, and for the 5 nm Au film - by 6-7 times larger than in the case of a thick (40 nm or more) Au film.

• Korean Journal of Optics and Photonics
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• v.9 no.2
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• pp.96-99
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• 1998

In this study, a novel long term stabilization method of optical feedback for the resonant cavity coupled semiconductor lasers is proposed, and its utility was shown experimentally. The proposed method is realized by using the pahse discriminator of optical feedback with high gain. The phase discriminating signal was obtained by the polarization spectroscopic technique using reflection light from the external reflector, which is a confocal Fabry-Perot cavity. Experimental result shows that stable control state can be maintained up to 20 hours. The period can be increased by reducing size of the system and/or fixing position stably of optical parts used, which were arranged on an optical table by using magnetic bases in this experiment. The proposed long-term stabilization method of optical feedack of a resonant external cavity coupled semiconductor laser is very useful for the field of high sensitivity measurement, and for the use in the laboratory level in particular.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.5
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• pp.40-46
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• 2017

A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.

• Journal of Korean Institute of Industrial Engineers
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• v.29 no.1
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• pp.1-13
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• 2003

In this paper, LAC(Look-ahead AGV Controller) has been developed for efficient routing of parts in semiconductor and LCD production systems. Several procedures have been developed as sub-modules. LACP(Look-ahead AGV Control Procedure) which controls AGVs using the information on the current and future status of the systems is the main element of the LAC. To support LACP, DSP(Destination Selection Procedure) which determines a destination of a part and AGV call time, SSP(Source Selection Procedure)which selects a part coming next to a buffer when the buffer becomes available. and RTM(Response Time Model) which estimates empty travel time of AGVs and waiting time for an available AGV have been developed. A simulation experiment shows that LAC reduces part's flow time, AGV utilization, average and maximum inventory level of a central buffer, empty travel time of an AGV, and waiting time for an available AGV.

• Journal of the Semiconductor & Display Technology
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• v.6 no.4
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• pp.43-47
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• 2007

In this paper, we propose a novel sensor system for measuring the arterial pulse in an oral cavity. In order to measure pulse wave in oral cavity, the proposed system is designed with reflection type arterial wave sensor, not by using transmission type arterial pulse wave sensor. Driving circuit through pulse current is designed for solving self-heating problem of LED. The effectiveness of the proposed sensor system is compared with pulse wave between pulse wave of oral cavity and other body parts as well as with characteristic measurements. The experiment shows that the proposed sensor system is adaptive to capturing consecutive and meaningful biometric signals through the variation of pulse wave changes in oral cavity when exercising. The study result expects to design and develop mobile sensors which could be adapted to healthcare devices.