• 반도체디스플레이기술학회지
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• 제3권2호
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• pp.11-15
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• 2004

Scales, accumulated on some parts of semiconductor equipments such as sputters and CVD during the device fabrication processes, often lower the lifetime of the equipments and production yields. Thus, many equipment parts have be cleaned regularly. In this study, an attempt to establish an effective process to remove scales on the sidewall of collimators located inside the chamber of the sputter was made. The EDX analysis revealed that the scales were composed of Ti and TiN with the columnar structure. Through the trial-and-error experiments, it was found that the etching in the $HNO_3$:$H_2SO_4$:$H_2O$=4:2:4 solution for 5.5 hrs at $67^{\circ}C$, after the oxide removal in the HF solution, and the heat-treatment at $700^{\circ}C$ for 1 min., was the most effective process for the scale removal.

• 반도체디스플레이기술학회지
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• 제20권1호
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• pp.59-63
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• 2021

Upper electrode is one of core parts using plasma etching process at semiconductor. The purpose of this study is to analyze effects of cutting conditions for mechanical machining of silicon upper electrode. For this research, surface roughness of machined workpiece and depth of damage inside of silicon electrode are experimented and analyzed and different values of feed rate and depth of cut are applied for the experiments. From these experiments, it is verified that the surface roughness and internal damaged layer get worse according to take more fast feed rate. In conclusion, cutting condition is very important factor for machining. Results of this study can use to develop various parts which are made from single crystal silicon and affect various benefits to the semiconductor industry for better productivity.

• 반도체디스플레이기술학회지
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• 제6권3호
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• pp.7-11
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• 2007

The design and manufacture of injection-molded parts with desired properties is a costly process dominated by empiricism, Including the repeated modification of actual tooling. The objective of this study is to obtain the good design of injection-molded polymeric parts using axiomatic design approach.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.28-33
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• 2020

Plasma etching process employs high density plasma to create surface chemistry and physical reactions, by which to remove material. Plasma chamber includes silicon-based materials such as a focus ring and gas distribution plate. Focus ring needs to be replaced after a short period. For this reason, there is a need to find materials resistant to erosion by plasma. The developed chemical vapor deposition processing to produce silicon carbide parts with high purity has also supported its widespread use in the plasma etch process. Silicon carbide maintains mechanical strength at high temperature, it have been use to chamber parts for plasma. Recently, besides the structural aspects of silicon carbide, its electrical conductivity and possibly its enhanced life time under high density plasma with less generation of contamination particles are drawing attention for use in applications such as upper electrode or focus rings, which have been made of silicon for a long time. However, especially for high purity silicon carbide focus ring, which has usually been made by the chemical vapor deposition method, there has been no study about quality improvement. The goal of this study is to reduce surface roughness and depth of damage by diamond tool grit size and tool dressing of diamond tools for precise dimensional assurance of focus rings.

• 한국CDE학회논문집
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• 제13권4호
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• pp.273-285
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• 2008

In this paper we propose an engineering bill of materials (E-BOM) copy method that can be utilized to manage the product information for each equipment during building a product lifecycle management (PLM) system in the order-specific semiconductor equipment manufacturer. The previous works studied on an E-BOM creation and management method for the mass manufacturing and production. The method is difficult to apply to an environment in which many engineering changes occur and the different specification to each equipment is required such as semiconductor equipments and facilities adopting built-to-order instead of built for inventory. Moreover the method is known to be the major drawback to deteriorate the design efficiency. Our E-BOM copy method enables users efficiently to manage the specification of a product and shortens the product development cycle. To implement the E-BOM copy method in the PLM environment, we developed the E-BOM copy system that automatically generates new parts and their numbers according to the numbering rule while copying the E-BOM from existing semiconductor equipments and then can apply the parts for reuse to new semiconductor equipments. This system can duplicate not only 3D CAD data but also technical documents.

• Journal of Korea Trade
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• 제25권6호
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• pp.78-104
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• 2021

Purpose - Semiconductors are a significant export item for Korea that is expected to continue to contribute significantly to the Korean economy in the future. Thus, the semiconductor industry is a critical component in the 4th Industrial Revolution and is expected to continue growing as the non-face-to-face economy expands as a result of the COVID-19 pandemic. In this context, this paper aims to empirically investigate how semiconductors are imported and exported in Korea from a global supply chain perspective by analysing import and export data at the micro-level. Design/methodology - This study conducts a multifaceted analysis of the global supply chain for semiconductors and related equipment in Korea by examining semiconductor imports and exports by semiconductor type, year, target country, mode of transportation, airport/port, and domestic region, using import/export micro-data. The visualisation, flow analysis, and Bayesian Network methodologies were used to compensate for the limitations of each method. Findings - Korea is a major exporter of semiconductor memory and has the world's highest competitiveness but is relatively weak in the field of system semiconductors. The trade deficit in 'semiconductor equipment and parts' is clearly growing. As a result, continued investment in 'system semiconductors' and 'semiconductor equipment and parts' technology development is necessary to boost exports and ensure a stable supply chain. Originality/value - Few papers on semiconductor trade in Korea have been published from the perspective of the global supply chain or value chain. This study contributes to the literature in this area by focusing on import and export data for the global supply chain of the Korean semiconductor industry using a variety of approaches. It is our hope that the insights gained from this study will aid in the advancement of SCM research.

• 반도체디스플레이기술학회지
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• 제2권2호
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• pp.21-24
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• 2003

Seam seal welding on the semiconductor package is a process for sealing the packages of semi-conductors, crystal parts, saw filters and oscillators with lid plate by seam welding. This paper presents the development process of automatic seam seal welding system. In this process, the process algorithm, high precision welding current control, design of welding head, high speed and high precision feeding mechanism and user interface process control program technologies are included.

• 반도체디스플레이기술학회지
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• 제22권1호
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• pp.72-77
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• 2023

In many manufacturing settings, including the semiconductor industry, products are completed by producing and assembling various components. Sorting out from randomly mixed parts and classification operations takes a lot of time and labor. Recently, many efforts have been made to select and assemble correct parts from mixed parts using robots. Automating the sorting and classification of randomly mixed components is difficult since various objects and the positions and attitudes of robots and cameras in 3D space need to be known. Previously, only objects in specific positions were grasped by robots or people sorting items directly. To enable robots to pick up random objects in 3D space, bin picking technology is required. To realize bin picking technology, it is essential to understand the coordinate system information between the robot, the grasping target object, and the camera. Calibration work to understand the coordinate system information between them is necessary to grasp the object recognized by the camera. It is difficult to restore the depth value of 2D images when 3D restoration is performed, which is necessary for bin picking technology. In this paper, we propose to use depth information of RGB-D camera for Z value in rotation and movement conversion used in calibration. Proceed with camera calibration for accurate coordinate system conversion of objects in 2D images, and proceed with calibration of robot and camera. We proved the effectiveness of the proposed method through accuracy evaluations for camera calibration and calibration between robots and cameras.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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• pp.92-96
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• 2004

Scales, accumulated on semiconductor equipment parts during device fabrication processes, often lower equipment lifetime and production yields. Thus, many equipments parts have be cleaned regularly. In this study, an attempt to establish an effective process for the removal of scales on the sidewall of collimators in the chamber of sputter is made. The EDX analysis revealed that the scales are composed of Ti and TiN with the colummar structure. It was found that the heat-treatment at 700 for 1 min. after the oxide removal in the HF solution, and then etching in the HNO3 : H2SO4 : H2O =4:2:4 solution for 5.5 hrs at 67 was the most effective process for the scale removal.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1430-1433
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• 2003

Transducers, which are incorporated in control devices for fixed wing aircraft, land vehicles. and weapon systems were designed and manufactured by use of semiconductor strain gages. These transducers consist of three parts; flange mounts, sensing rods, and semiconductor strain gages. In this investigation, we designed cylindrical sensing rods with high sensitivity and developed installation procedures of semiconductor strain gages. The semiconductor strain gage has hish gage factor such that it can produce high resistance change in spite of low strain, but it is so small and fragile that one should handle carefully and sophisticated installation method is needed for good performances. The prototype transducers are manufactured, and then tested about three important factors: sensitivity, linearity, and hysteresis. We got results or 0.084 V/N sensitivity, 0.2% nonlinearity, and 0.5% hysteresis.