• Title/Summary/Keyword: Particleboard

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Effect of Press Temperature and Time on Physical Properties of Larch Particleboard (압체온도(壓締温度)와 시간(時間)이 낙엽송(落葉松) 파티클 보오드의 물리적(物理的) 특성(特性)에 미치는 영향(影響))

  • Lee, Phil Woo;Chung, Gyun
    • Journal of Korean Society of Forest Science
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    • v.63 no.1
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    • pp.12-20
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    • 1984
  • This research was performed to estimate the properties of particleboard based on the press time and temperature which was made of chip of larch that grows in Korea. The results in this study were as follows: 1) Even though the chips, 1:1-35 ratio between length and thickness, are relatively bad condition, the surface smoothness that can easily spread the adhesive evenly and thoroughly and bonding ability of chips can give proper physical properties. 2) It shows more mechanical properties at the press time of 10 min. in MOR (Modulus of Rupture), MOE (Modulus of Elasticity) and SHA (Screw Holding Ability). 3) It is not significant according to the press time 20 min. in MOR, IBS (Internal Bonding Strength) and SHA, for the reciprocal actions between the accelerating aging effect of chip and the softening effect of adhesion are occured. 4) IBS is rising according to the increasing temp at the press time of 10 min. Because it needs to transfer the plate heat to make the proper hardening temp. In the layer. 5) The heat treatment effects have greatly influenced the stahility of dimension by falling the absorption, anisotropy and inhomegenity. As a result of these the values of thickness and linear expansion ratio were respectively dropped by the increase of press temp and the time and so did absorption.

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Thin Hardboard Manufacture from Waste Lignocellulosic Papers as Overlay Substitutes in Low Grade Plywood and Particle Board Panels(I) (고지로부터 저급합판 및 파아티클보오드 표면단판으로 사용될 수 있는 박판 하아드보오드의 제조(I))

  • Lee, Byung-Guen;Lee, Sang-Yeob
    • Journal of the Korean Wood Science and Technology
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    • v.22 no.4
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    • pp.19-25
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    • 1994
  • The purpose of this study was to determine the technical feasibility of making 3-dimensional thin hardboard panels for overlay substitutes of low grade particleboard and plywood panels. Experimental studies were directed at assembling bench-top apparatus, learning the characteristics of different types of lignocellulosic waste papers, for making thin hardboard with several combinations of them with and without resin addition. The raw materials used are waste corrugated cartons, cereal boxes, and old magazines which contain substantial amount of lignin in it. The experimental results showed that satisfactory thin(0.21~0.16cm) hardboard could be made from the residential mixed waste papers that have selected properties comparable to commercial 0.32cm hardboard. The significant mixing ratio effect of the waste papers was present on the thickness swelling, water absorption, linear expansion, and modulus of elasticity including Taber abrasion tests of the thin hardboard made. The mixing ratio of waste papers and resin in the thin hardboard prominently affected the specific gravity of it, which led to affect modulus of elasticity and those physical properties sensitively. And it was shown that the hardboard containing those physical properties can be used for overlay substitutes of low grade plywood and particleboard panels.

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Mechanical characterization of an epoxy panel reinforced by date palm petiole particle

  • Bendada, A.;Boutchicha, D.;Khatir, S.;Magagnini, E.;Capozucca, R.;Wahab, M. Abdel
    • Steel and Composite Structures
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    • v.35 no.5
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    • pp.627-634
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    • 2020
  • The past years were marked by an increase in the use of wood waste in civil and mechanical constructions. Date palm waste remains also one of the most solicited renewable and recyclable natural resources in the composition of composite materials. In Algeria, a great amount of this type of plant wastes accumulates every year. In order to make use of this waste, a new wood-epoxy composite material based on date palm petiole particleboard is developed. It makes use of date palm petiole particleboard as reinforcement and epoxy resin as matrix. The size of the particles reinforcement are between 1~3 mm and proportion of reinforcement used is 37%. In this work, experimental and numerical studies are conducted in order to characterize the wood fibre-epoxy plates. Firstly, experimental modal analysis test was carried out to determine Young's modulus of the elaborated material. Then, in order to validate the results, compression test was conducted. Furthermore, additional information about the shear modulus of this material is obtained by performing an experimental modal analysis to extract the first torsional mode. Moreover, a finite element model is developed using ANSYS software to simulate the vibration behaviour of the plates. The results show a good agreement with the experimental modal analysis, which confirms the values of Young's modulus and shear modulus.

Physico-mechanical Properties and Formaldehyde/TVOC Emission of Particleboards with Volcanic Pozzolan

  • Kim, Sumin;An, Jae-Yoon;Kim, Jin-A;Kim, Hee-Soo;Kim, Hyun-Joong;Kim, Hak-Gyeom
    • Journal of the Korean Wood Science and Technology
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    • v.35 no.2
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    • pp.39-50
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    • 2007
  • The purpose of this study was to investigate the physico-mechanical properties and characteristics on reduction of formaldehyde and total volatile organic compound (TVOC) emission from particleboard (PB) with added volcanic pozzolan. Pozzolan was added as a scavenger at the level of 1, 3, 5, and 10 wt.% of urea formaldehyde (UF) resin for PB manufacture. The moisture content, density, thickness swelling, water absorption and physical properties of PBs were examined. Three-point bending strength and internal bond strength were determined using a universal testing machine. Formaldehyde and TVOC were determined by desiccator and 20L small chamber methods. With increasing pozzolan content the physical and mechanical properties of the PBs were not significantly changed, but formaldehyde and TVOC emissions were decreased. Because pozzolan has a rough and irregular surface with porous form, it can be used as a scavenger for PBs at a content up to 10 wt.% without any detrimental effect on the physical and mechanical properties.

Reduction of Formaldehyde Emission from Particleboardsby Bio-Scavengers

  • Eom, Young-Geun;Kim, Jong-Sung;Kim, Sumin;Kim, Jin-A;Kim, Hyun-Joong
    • Journal of the Korean Wood Science and Technology
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    • v.34 no.5
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    • pp.29-41
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    • 2006
  • This study was to investigate the effect of adding additive as tannin, rice husk and charcoal, for reducing the formaldehyde emission level, on the adhesion properties of urea-formaldehyde (UF) resin for particleboard. We controlled the hot-pressing time, temperature and pressure to determine the bonding strength and formaldehyde emission. Blends of various UF resin/additives (tannin, rice husk and charcoal) compositions were prepared. To determine and compare the effect of additives (tannin, rice husk and charcoal) content, 0, 5, 10 and 15%, by weight of UF resin, were used. $NH_4Cl$ as hardener added. To determine the level of formaldehyde emission, we used the desiccator, perforator and 20 L-small chamber method. The formaldehyde emission level decreased with increased additions of additive (except rice husk). Also, increased hot-pressing time decreased formaldehyde emission level. At a charcoal replacement ratio of only 15%, the formaldehyde emission level is under F ✩ ✩ ✩ ✩ grade (emit < $0.3mg/{\ell}$). Curing of the high tannin additive content in this adhesive system indicated that the bonding strength increased. But, in the case of rice husk and charcoal, the bonding strength was much lower due to the inorganic substance. Furthermore, rice husk was poor in bonding strength as well as formaldehyde emission than tannin and charcoal.

Properties of Particleboard Using Byproduct of Plywood Manufacture - Evaluation on the Elements of Surface Layer and Pre-treatment of Particles (합판 공장 부산물을 이용한 파티클보드의 물성에 관한 연구 - 표층 구성요소 및 파티클 전처리 여부에 따른 비교 -)

  • Hwang, Jung Taek;Pi, Duck Won;Kang, Seog Goo
    • Journal of the Korean Wood Science and Technology
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    • v.41 no.1
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    • pp.33-41
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    • 2013
  • This study was performed to analyse cause of quality deterioration using byproduct of plywood and to determine physical and mechanical properties of particleboard used new bonding condition we found. The result of bending strength of Com-Ply board using EMDI is 57.7 $N/mm^2$ on linear direction and 25.1 $N/mm^2$ on vertical direction. EMDI has better water-resisting qualities than Urea formaldehyde adhesive according to result of thickness swelling and water absorption test. Pre-treatment soaked particle 72 hours in water caused increase of HCHO emission.

Effect of Carbonization Temperature on the Thermal Conductivity and Electric Properties of Carbonized Boards (탄화온도가 탄화보드의 열전도율 및 전기적 성질에 미치는 영향)

  • Oh, Seung-Won;Park, Sang-Bum;Kim, Jong-In;Hwang, Jung-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.41 no.1
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    • pp.58-63
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    • 2013
  • This study is a basic research for practical applications of carbonized boards, which measured thermal conductivity and electrical properties of carbonized boards manufactured at different carbonization temperature ($400{\sim}1,100^{\circ}C$) using a medium density fiberboard, particleboard, plywood and wood (Fraxinus rhynchophylla). The highest value of thermal conductivity was 0.1326 m/k at carbonization temperature of $900^{\circ}C$ in the carbonized particleboard. Overall, the higher density of carbonized board, thermal conductivity was faster. As the electrical resistivity decreased with increased carbonization temperature, it was almost close to conductor after carbonization temperature of $1,000^{\circ}C$. When electricity has worked on the carbonized board by high voltage, the current and the electric power increased and surface temperature of carbonized board was high.

Physical and Mechanical Properties of Three-layer Particleboards Bonded With UF and UMF Adhesives

  • Iswanto, Apri Heri;Simarmata, Janrahman;Fatriasari, Widya;Azhar, Irawati;Sucipto, Tito;Hartono, Rudi
    • Journal of the Korean Wood Science and Technology
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    • v.45 no.6
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    • pp.787-796
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    • 2017
  • A low dimensional stability and poor bending strength properties were main problems in particleboard manufacturing. The objective of this research was to evaluate the effect of mixed wood species and urea-formaldehyde (UF) or urea-melamine-formaldehyde (UMF) resins on the physical and mechanical properties of three-layer particleboards. The ratio of face/core/back layer was 1 : 2 : 1. The resin content of 12% for both UF resins and UMF resins (UF/MF = 70/30% w/w) was used. The results of this study showed that the utilization of S.mahagony shaving using both UF and UMF resins caused a decrease in the thickness swelling and water absorption of the boards. Thickness swellings of particleboard made of Sengon/Sengon/Sengon (SSS), Mahogany/Mahogany/Mahogany (MMM), Sengon/Mahogany/Sengon (SMS), and Mahogany/Sengon/Mahogany (MSM) were in the range of 23%, 12~16%, 14~16%, and 13~21%, respectively. The board bonded with UMF resin demonstrated better dimensional stability than that bonded with UF resin alone. Modulus of elasticity (MOE) and modulus of rupture (MOR) of particleboards made of S. mahagony shaving in the surface layer in both MMM and MSM boards were better than those of the SSS and SMS. MOE of MMM and MSM board was in the ranges of 24,000 to $26,000kg.cm^{-2}$ and 18,000 to $21,000kg.cm^{-2}$ respectively. Meanwhile, the MOR of board was in the ranges of 200 to $240kg.cm^{-2}$ and 190 to $228kg.cm^{-2}$, respectively.

Properties of a New Adhesive Composed of Gambir-Sucrose

  • SUCIPTO, Tito;WIDYORINI, Ragil;PRAYITNO, Tibertius Agus;LUKMANDARU, Ganis
    • Journal of the Korean Wood Science and Technology
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    • v.48 no.3
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    • pp.303-314
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    • 2020
  • Gambir is a non-wood forest product with a potential of being used as wood adhesive, due to about 33% catechin in it. Meanwhile, catechins and sucrose have not been studied as adhesives. Therefore, basic characteristics of gambir-sucrose adhesives were investigated. In this research, adhesives were prepared by dissolving gambir and sucrose in distilled water, at different blending ratios of the gambir/sucrose such as 100/0, 75/25, 50/50, and 25/75 wt%. Furthermore, gas chromatography-mass spectrometry (GC-MS) was employed to determine the gambir chemical compositions, and Fourier transform-infrared (FTIR) spectroscopy was carried out to identify chemical bonds. Particleboards with a target density of 0.8 g/㎤ were then manufactured by hot-pressing for 10 min at 200℃. The internal bond (IB) strength of particleboard was subsequently measured. Based on the GC-MS analysis, 31.11% of catechin was identified. In addition, the viscosity, density, solid content, and gelation time of the adhesives, and insoluble matter content (IMC) in boiling water were 7.30~33.24 mPa.s, 1.2~1.3 g/㎤, 25.56~28.44%, 73~420 min, and 29.75~62.10%, respectively. Adding sucrose to the adhesive was observed to raise the IMC from 49.05 to 62.10%, at 180℃ and 200℃. FT-IR analysis showed that the gambir absorption peaks occurred at approximately 1620 cm-1, assigned to the C=O stretching of 5-hydroxymethylfurfural, which tended to increase with the addition of sucrose. The reaction between gambir and sucrose was observed in the form of the dimethylene ether bridge. The 25/75 wt% gambir-sucrose adhesives and 200℃ hot-pressed temperature resulted in the highest IB strength (0.89 MPa), and met the requirement of JIS A5908-2003 type 18. Consequently, the gambir-sucrose adhesive could be used as a particleboard adhesive.

Modification of Urea Formaldehyde Resin with Pyrolytic Oil on Particleboard

  • Adegoke, Olaoluwa Adeniyi;Ogunsanwo, Olukayode Yekeen;Olaoye, Kayode Oladayo
    • Journal of Forest and Environmental Science
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    • v.36 no.3
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    • pp.219-224
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    • 2020
  • Urea formaldehyde resins are widely used in the manufacturing of wood composite and their usage is always combined with release of formaldehyde characterized to be hazardous to health during and after the manufacturing of the products. This study investigates the effectiveness of wood-based adhesive from oil of pyrolysed Triplochiton scleroxylon sawdust for the production of composite board. The wood-derived Pyrolytic Oil (PyO) was blended with Urea Formaldehyde (UF) resin to formed Pyrolytic Oil-Urea Formaldehyde (PyOUF). The obtained PyOUF called Wood-Based Adhesives at four blends and control (UF) viz; 1:1, 1:2, 1:3, 2:1, 1:3 were further employed to prepare the composite board and test for their bonding strength by physical (water absorption-WA and thickness swelling-Th.S) and mechanical properties (modulus of elasticity-MOE, modulus of rupture-MOR, and impact bending-IB). Data obtained was analysed using analysis of variance at α 0.05. The result of analysis of variance conducted on physical properties show significant difference (p≤0.05) between the WA values obtained when testing the different blending proportion of PyOUF and likewise between 2 and 24 h of immersion. PyOUF had significant effect (p≤0.05) on Th. S for 24 h but no significant different (p>0.05) for the 2 h period of soaking. The analysis of variance on mechanical properties of the composite board (MOE, MOR, and IB) show significance differences (p≤0.05) between the strength values obtained when testing the different ratios of PyO with UF. PyO content influenced the properties of the boards and it is evident that PyO can be used in the manufacture of composite board.