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http://dx.doi.org/10.5658/WOOD.2013.41.1.33

Properties of Particleboard Using Byproduct of Plywood Manufacture - Evaluation on the Elements of Surface Layer and Pre-treatment of Particles  

Hwang, Jung Taek (Wood Based Composite Materials Research ChungNam National University)
Pi, Duck Won (Wood Based Composite Materials Research ChungNam National University)
Kang, Seog Goo (Wood Based Composite Materials Research ChungNam National University)
Publication Information
Journal of the Korean Wood Science and Technology / v.41, no.1, 2013 , pp. 33-41 More about this Journal
Abstract
This study was performed to analyse cause of quality deterioration using byproduct of plywood and to determine physical and mechanical properties of particleboard used new bonding condition we found. The result of bending strength of Com-Ply board using EMDI is 57.7 $N/mm^2$ on linear direction and 25.1 $N/mm^2$ on vertical direction. EMDI has better water-resisting qualities than Urea formaldehyde adhesive according to result of thickness swelling and water absorption test. Pre-treatment soaked particle 72 hours in water caused increase of HCHO emission.
Keywords
Com-Ply board; byproduct; pre-treatment; HCHO emission;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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