• 광물과 암석
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• 제36권4호
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• pp.345-353
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• 2023

본 연구는 상업용 영동 일라이트 분말 제품의 판매 규격, 즉 메쉬(mesh)에 따른 구성광물, 입도, 화학조성의 차이를 조사하여, 일라이트 분말 제품의 특성을 이해하고 다양한 활용 분야를 개척하기 위한 광물학적 데이터베이스로 활용하고자 하였다. 충청북도 영동군의 광산을 보유한 두 곳의 회사에서 제공받은 상업용 일라이트 분말 시료를 X-선 회절 분석, 레이저 회절 입도 분석, 주사전자현미경 분석, X-선 형광 분석을 이용해 조사하였다. X-선 회절 분석 결과, 두 광산의 일라이트 분말 제품에는 주로 일라이트 및 백운모, 석영, 사장석이 존재하며, 이는 각 광산의 광석의 구성광물과 일치하는 경향을 보인다. 레이저 회절 입도 분석에서는 제품 규격에 따라 입자 크기의 차이가 나타났으며, 입도의 균일성은 메쉬가 높아질수록 증가하는 경향을 보였다. 주사전자현미경 분석에서는 입자의 형태와 크기가 규격에 따라 다르게 나타났다. 일라이트 입자의 크기는 제품의 규격 메쉬에 따른 차이가 크게 없으며, 주로 장석 및 석영의 입자 크기에 변화가 발생하는 것으로 나타났다. 또한, 시료의 화학 조성은 광산마다 다소의 차이가 있으나, 규격별로 큰 차이는 나타나지 않았다. 이러한 결과를 토대로, 상업용 일라이트 분말의 활용 분야를 고려할 때 규격에 따른 특성 변화를 고려하여 선택하는 것이 중요하다. 본 연구 결과는 상업용 일라이트 분말의 다양한 응용 가능성을 제시하며, 산업적 활용 및 새로운 기술 개발에 기여할 것으로 기대된다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.567-568
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.835-836
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• 2009

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.519-520
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• 2007

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.1084-1086
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• 1999

The breakdown was caused by particle in GIS and various methode was suggested to find particle in GIS. In this paper, four states of particle was imitated which are particle on electrode, particle on enclosure, particle on spacer and crossing particle. The discharge voltage of each states was classified by four voltages which are initial, development, later and close discharge voltage. $\Phi$-Q-N pattern was analyzed according to the states and to the discharge voltages. In the result, the electrical discharge pattern according to the particle states may be distinguished.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2003년도 추계 학술대회논문집
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• pp.43-48
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• 2003

When the Eulerian-Lagrangian method is used to analyze the particle laden two-phase flow, a large number of particles should be used to obtain statistically meaningful solutions. Then it takes too much time to track the particles and to average the particle properties in the numerical analysis of two-phase flow. The purpose of this paper is to reduce the computation time by means of a set of particle gird separate to the flow grid. Particle motion equation here is the simplified B-B-O equation, which is integrated to get the particle trajectories. Particle turbulent dispersion, wall collision, and wall roughness effects are considered but the two-way coupling effects between gas and particles are neglected. Particle laden 2-D channel flow is solved and it is shown that the computational efficiency is indeed improved by using the current method

• 한국도로학회논문집
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• 제15권5호
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• pp.31-45
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• 2013

PURPOSES : Determination of particle packing model variables that can be used for formulation of new DEM based particle packing model by examining existing particle packing models METHODS : Existing particle packing models are thoroughly examined by analytical reformulation and sensitivity analysis in order to set up DEM based new particle packing model and to determine its variables. All model equations considered in this examination are represented with consistent expressions and are compared to each others to find mathematical and conceptual similarity in expressions. RESULTS : From the examination of existing models, it is observed that the models are very similar in their shapes although the derivation of the models may be different. As well, it is observed that variables used in some existing models are comprehensive enough to estimate particle packing but not applicable to DEM simulation. CONCLUSIONS : A set of variables that can be used in DEM based particle packing model is determined.

• 조명전기설비학회논문지
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• 제15권5호
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• pp.14-19
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• 2001

전계해석법을 이용하여 나타내었다. 이때 모의한 GIS 챔버내 금속이물의 위치는 전극부착시, 외함부착시 그리고 자유운동시로 하였다. 그 결과 GIS챔버의 절연파괴전계의 경우, 전극에 파티클 부착시가 가장 작게 나타났고, 파티클 자유운동시가 중간, 외함에 파티클 부착시가 가장 작게 나타남을 알 수 있었다. 또한 파티클 위치에 따른 전계해석의 경우 전극에 파티클 부착시가 가장 크게 나타났고, 파티클 자유운동시가 중간, 외함에 파티클 부착시가 가장 작게 나타났다. 이 결과는 국내 GIS의 절연설계에 설제적인 참고자료가 될 것으로 사료된다.

• 대한기계학회논문집B
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• 제29권12호
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• pp.1321-1328
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• 2005

The burning characteristics of interacting coal particles in a convective flow are numerically investigated at various Reynolds numbers. The transient combustion of 2-dimensionally arranged particles, both the fixed particle distances of 5 radii to 20 radii horizontally and 4 radii to 24 radii vertically, is studied. The results obtained from the present numerical analysis indicate that the transient flame configuration and retardation of particle temperature augmentation with the horizontal or vertical particle spacing substantially influence devolatilization process and carbon conversion ratio of interacting particles. Volatile release and carbon conversion ratio of the second particle with decreasing horizontal and vertical particle spacing decrease gradually, whereas those of the first particle with decreasing vertical particle spacing increase due to flow acceleration. When the vertical particle spacing is smaller than $6R_0$, volatile release and carbon conversion ratio of the second particle decrease due to reduction of flame penetration depth and interference of oxygen diffusion by the first particle.

• 한국레이저가공학회지
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• 제6권3호
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• pp.29-35
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• 2003

In semiconductor processing, there are two types of particle contaminated onto the wafer, i.e. dry and wet state particles. In order to evaluate the cleaning performance of laser shock wave cleaning method, the removal of 1 m sized alumina particle at different particle conditions from silicon wafer has been carried out by laser-induced shock waves. It was found that the removal efficiency by laser shock cleaning was strongly dependent on the particle condition, i.e. the removal efficiency of dry alumina particle from silicon wafer was around 97％ while the efficiencies of wet alumina particle in DI water and IPA are 35％ and 55％ respectively. From the analysis of adhesion forces between the particle and the silicon substrate, the adhesion force of the wet particle where capillary force is dominant is much larger than that of the dry particle where Van der Waals force is dominant. As a result, it is seen that the particle in wet condition is much more difficult to remove from silicon wafer than the particle in dry condition by using physical cleaning method such as laser shock cleaning.