• Journal of Korean Society of Water and Wastewater
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• v.22 no.3
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• pp.359-366
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• 2008

The series of experiments under the various conditions were carried out to evaluate the feasibility of dissolved air flotation (DAF) as an alternative of conventional gravity sedimentation (CGS) and to investigate the decrease of the loadings following to biological wastewater treatment processes in livestock wastewater system. On the basis of the experiment result between CGS and DAF processes, for the other water quality criteria as well as suspended solid the removal efficiency of DAF process was about 20~25 % better than CGS process on average. In addition, the particle removal efficiency of DAF process became higher in proportion as the increase of air to solid (A/S) ratio and the general wastewater treatment efficiency of DAF process was enough to meet the requirement of loading decrease to following biological process even at low A/S ratio range. Though DAF process is widely known as an solid separation unit, there was not the notable relationship between particle separation efficiency and several pollutant removal efficiencies like $COD_{Cr}$ and nutrients (T-N, T-P). Assume that the $COD_{Cr}$ was removed as the fraction of particle separation in this experiment, the removal efficiency of T-N and T-P were sensitive to removal efficiency of $COD_{Cr}$, especially.

• Steel and Composite Structures
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• v.15 no.2
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• pp.151-162
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• 2013

In this study, an electrolyzing device for the production of metal powders was designed and fabricated. The production of copper powders was performed using a variety of current densities, anode-cathode distances and power removal times. The effect of these parameters on powder particle size and shape was determined. Particle size was measured using a laser diffraction unit while the powder shape was determined by SEM. Experimental results show that an increase in current density leads to a decrease in powder particle size. In addition particle shape changed from globular dendritic to acicular dendritic with increasing the current density. Distance between the cathode and anode also showed a similar influence on powder particle size and shape. An increase in time of powder removal led to an increase in powder particle size, as the shape changed from acicular dendritic to globular dendritic.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.51-58
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• 2020

Many types of optical plastic films are essential in optoelectronics display unit fabrication and it is important to develop high precision laser cutting methods of optical films with extremely low level of film surface contamination by fume particles. This study investigates the effects of suction and blowing air motions with air flow misalignment in removing fume particles from laser cut line by employing random particle trajectory simulation and probabilistic particle generation model. The computational results show fume particle dispersion behaviors on optical film under suction and blowing air flow conditions. It is found that suction air flow motion is more advantageous to blowing air motion in reducing film surface contamination outside designated target margin from laser cut line. While air flow misalignment adversely affects particle dispersion in blowing air flows, its effects become much more complicated in suction air flows by showing different particle dispersion patterns around laser cut line. It is required to have more careful air flow alignment in fume particle removal under suction air flow conditions.

• Korean Chemical Engineering Research
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• v.45 no.2
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• pp.203-207
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• 2007

In this paper efficient method for particle removal from silicon wafers by usage of HF and ozone was studied. It was found that at least 0.3 vol% concentration of HF was required for particle removal and removal efficiency increased with the application of megasonic in ozonated water. Additional cleaning with minute amount of ammonia (0.01 vol%) after HF/Ozone step showed over 99% in removal efficiency. It is proposed that the superior cleaning efficiency of HF-Ozone-ammonia is due to micro-etching of silicon surface and impediment of particle re-adsorption in alkali environment. Compared to SC-1 cleaning method micro roughness has also been slightly improved. Therefore it is expected that HF-ozone-ammonia cleaning method is a viable alternative to the conventional wet cleaning methods.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.24 no.8
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• pp.1069-1076
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• 2000

As the environmental problems grow, the regulation of the pollutants emitted from power plants increases. Most of the pollutants in particle phase are removed by particle removal facilities, but fine particles between 0.1 micron and I micron in diameter have a low removal efficiency compared to particles in other size ranges. Therefore the present concern has concentrated on the removal of those fine particles. The purpose of this study is to grow fine particles by condensation to the range larger than I micron. Theoretically the general dynamic equation is solved with an assumption that the particle size follows a log-normal distribution to calculate the temporal behavior of the size distribution. Experiments have been carried out to compare the results with the theoretical predictions. Particles grown by condensation are sampled by impactors and observed with SEM photographs.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.5-9
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• 2004

Microcircuit fabrication requires precise control of impurities in tiny regions of the silicon. These regions must be interconnected to create components and VLSI circuits. The patterns to define such regions are created by lithographic processes. In order to image features smaller than 70 nm, it is necessary to employ non-optical technology (or next generation lithography: NGL). One such NGL is extreme ultra-violet lithography (EUVL). EUVL transmits the pattern on the wafer surface after reflecting ultra-violet through mask pattern. If particles exist on the blank mask, it can't transmit the accurate pattern on the wafer and decrease the reflectivity. It is important to care the blank mask. We removed the particles on the wafer using focused ion beam (FIB). During removal, FIB beam caused damage the multi layer mask and it decreased the reflectivity. The relationship between particle removal and reflectivity is examined: i) transmission electron microscope (TEM) observation after particle removal, ii) reflectivity simulation. It is found that the image mode of FIB is more effective for particle removal than spot and bar mode.

• Journal of the Semiconductor & Display Technology
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• v.11 no.3
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• pp.7-11
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• 2012

Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.

• Journal of Korean Society of Water and Wastewater
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• v.19 no.1
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• pp.16-24
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• 2005

Mathematical model was developed to verify a sequential particle removal taking place in a granular media gravity filter. Consequential multi-layer filtration cycle model was applied to verify the fraction of filter effluent particles that are filter influent particles that were never removed as well as the fraction of filter effluent particles that were detached after deposition were performed through laboratory experiments. Three sizes of marker particles were injected ahead of the filter column as a pulse in the presence of four sizes of polystyrene particles that were used as a primary source of particles in the raw suspension to investigate particle attachment alone in contrast to net removal from attachment and detachment. Microscopic counting of filter effluent particles was assumed to reflect attachment. Experimental results indicated that particle detachment is significant beginning from the early phase of filtration. For each size of fluorescent microspheres at one filter depth, fluorescent microsphere removal increased with filter runtime to a maximum due to ripening. The detached fraction of effluent particles increased with particle size and filter depth. The presence of detached particles and the increasing fraction of detached particles in deeper bed were confirmed.

• Journal of Industrial Technology
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• v.30 no.A
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• pp.127-132
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• 2010

We analyzed the effects of several process variables on the $SO_2$ removal and particle growth by the dielectric barrier discharge - photocatalysts hybrid process. In this process, $SO_2$ was converted into the ammonium sulfate ($(NH_4)_2SO_4$) particles. The size and crystallinity of ammonium sulfate particles were examined by using TEM and XRD analysis. The dielectric barrier discharge reactor consisted of two zones: the first is for plasma generation and the second is for ammonium sulfate particles formation and growth. The first zone of reactor was filled with glass beads as a dielectric material. To enhance $SO_2$ removal process, the $TiO_2$ photocatalysts were coated on glass beads by dip-coating method. As the voltage applied to the plasma reactor or the pulse frequency of applied voltage increases, the $SO_2$ removal efficiency increases. Also as the initial concentration of $SO_2$ decreases or as the residence time increases, the $SO_2$ removal efficiency increases. $(NH_4)_2SO_4$ particles continue to grow by particle coagulation and surface reaction, moving inside the reactor. Larger particles in site are produced according to the increase of residence time or $SO_2$ concentrations.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.179-180
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• 2013