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Particle Removal on Silicon Wafer Surface by Ozone-HF-NH4OH Sequence  

Lee, Gun-Ho (R & D Center, Siltron)
Bae, So-Ik (R & D Center, Siltron)
Publication Information
Korean Chemical Engineering Research / v.45, no.2, 2007 , pp. 203-207 More about this Journal
Abstract
In this paper efficient method for particle removal from silicon wafers by usage of HF and ozone was studied. It was found that at least 0.3 vol% concentration of HF was required for particle removal and removal efficiency increased with the application of megasonic in ozonated water. Additional cleaning with minute amount of ammonia (0.01 vol%) after HF/Ozone step showed over 99% in removal efficiency. It is proposed that the superior cleaning efficiency of HF-Ozone-ammonia is due to micro-etching of silicon surface and impediment of particle re-adsorption in alkali environment. Compared to SC-1 cleaning method micro roughness has also been slightly improved. Therefore it is expected that HF-ozone-ammonia cleaning method is a viable alternative to the conventional wet cleaning methods.
Keywords
Wafer Cleaning; Ozone; HF; Particle Removal; Ammonia Water;
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