• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.83-89
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• 2014

Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.17-24
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• 2012

Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of $150^{\circ}C$ or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.2
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• pp.49-59
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• 2002

The main function of plastic materials in food packaging is to preserve a food for safe transportation and storage. The interactions between food and plastic materials in food packaging have become increasingly important for food quality and safety because monomer, low molecular weight components, or additives of plastic packaging materials can migrate into a food. The use of antioxidants in plastic materials can help protect the degradation of film itself and retard the oxidation of a packaged food containing lipid, through the migration of antioxidant from the packaging to a product via an evaporation / sorption mechanism. Nowadays, antioxidant (BHT) impregnated plastic materials are used for commercial food packaging application with the intention of achieving an extended shelf life of food in USA. Alpha tocopherol, as one of the most important free radical scavengers, has been well known in biological systems. Moreover, the potential use of alpha tocopherol as an additive for polymers used in the packaging industry may offer the most positive perception from both consumers and manufacturers. Alpha tocopherol has been used as an antioxidant for polyolefin resins fabricated to both bottles and film and has applications in the food packaging industry as a replacement for BHT. Today, alpha tocopherol offers an attractive choice for use as an antioxidant in polymers. This paper provides an overview of antioxidant effectiveness and applications for its use by the food packaging industry based on the evaporation-sorption mechanism of a packaging model product, where quality is associated with lipid oxidation. Important analytical techniques for predicting antioxidant interaction between the package system and product are discussed.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.17-25
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• 2017

Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.15-22
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• 2013

Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 GHz antennas at Samsung Electronics [1]. The LTCC 60 GHz antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author's best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 GHz measured bandwidth ($S_{11}{\leq}-10$ dB) from 57~66 GHz is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.

• International Journal of Internet, Broadcasting and Communication
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• v.13 no.3
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• pp.148-154
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• 2021

We propose the AI Smart Factory Model for integrated management of production processes in this paper .It is an integrated platform system for the production of food packaging containers, consisting of a platform system for the main producer, one or more production partner platform systems, and one or more raw material partner platform systems while each subsystem of the three systems consists of an integrated storage server platform that can be expanded infinitely with flexible systems that can extend client PCs and main servers according to size and integrated management of overall raw materials and production-related information. The hardware collects production site information in real time by using various equipment such as PLCs, on-site PCs, barcode printers, and wireless APs at the production site. MES and e-SCM data are stored in the cloud database server to ensure security and high availability of data, and accumulated as big data. It was built based on the project focused on dissemination and diffusion of the smart factory construction, advancement, and easy maintenance system promoted by the Ministry of SMEs and Startups to enhance the competitiveness of small and medium-sized enterprises (SMEs) manufacturing sites while we plan to propose this model in the paper to state funding projects for SMEs.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.30-32
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• 2005

This paper reports on an LTCC-based packaging method using Au/Sn eutectic bonding process for RF MEMS applications. The proposed packaging structure was realized by a micromachining technology. An LTCC substrate consists of metal filled vertical via feedthroughs for electrical interconnection and Au/Sn sealing rim for eutectic bonding. The LTCC capping substrate and the glass bottom substrate were aligned and bonded together by a flip-chip bonding technology. From now on, shear strength and He leak rate will be measured then the fabricated package will be compared with the LTCC package using BCB adhesive bonding method which has been researched in our previous work.

• Journal of Biosystems Engineering
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• v.30 no.6 s.113
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• pp.347-353
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• 2005

Paper angle, environment friendly packaging material, has been mainly used as an edge protector, But, in the future, paper angle will be applied to package design of heavy product such as strength reinforcement or unit load system (ULS). Therefore. understanding of buckling behavior fur angle itself, compression strength and quality standard are required. The objectives of this study were to characterize the buckling behavior by theoretical and finite element analysis, and to develop compression strength model by compression test for symetric and asymetric paper angle. Based on the result of theoretical and finite element analysis, as applied load level was bigger and/or the length of angle was longer, incresing rate of buckling of asymmetric paper angle was higher than that of symmetric paper angle. Decreasing rate of minimum principal moment of inertia significantly increased as the extent of asymmetric angle increased, and buckling orientation of angle was open- direction near the small web. Incresing rate of maximum compression strength (MCS) for thickness of angle decreased as the web size increased in symmetric angle. MCS of asymmetric angle of 43${\times}$57 and 33${\times}$67 decreased $15{\~}18\%$ and $65{\~}78\%$, and change of buckling increased $12{\~}13\%$ and $62{\~}66\%$, respectively.