• Title/Summary/Keyword: Paper packaging

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Recent Trends of MEMS Packaging and Bonding Technology (MEMS 패키징 및 접합 기술의 최근 기술 동향)

  • Choa, Sung-Hoon;Ko, Byoung Ho;Lee, Haeng-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.9-17
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    • 2017
  • In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

Fully Embedded 2.4GHz Compact Band Pass Filter into Multi-Layered Organic Packaging Substrate

  • Lee, Seung-J.;Lee, Duk-H.;Park, Jae-Y.
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.39-44
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    • 2008
  • In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

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Packaging MEMS, The Great Challenge of the $21^{st}$ Century

  • Bauer, Charles-E.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.04a
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    • pp.29-33
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    • 2000
  • MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than $9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

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Study on the Pre-treatment for Quantitative Analysis of Mercury in Paper Packaging Materials (지류포장재에서의 수은 정량분석을 위한 전처리 방법 연구)

  • Ko, Seung-Tae;Lee, Tai-Ju;Park, Ji-Hyun;Kim, Hyoung-Jin
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.42 no.5
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    • pp.67-73
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    • 2010
  • Paper packaging materials are essential in protection and transportation of commercial or industrial products. Raw materials for packaging paper production are mainly obtained from various grades of waste paper. For this reason, the recycled fibers from waste paper would probably have possibility of containing heavy metals. This study was focused on the development of optimum pre-treatment method for the quantitative analysis of mercury. The optimum pre-treatment for open digestion system were obtained at the treatment conditions of acid combination with $HNO_3/HCl/H_2O_2$ or $HNO_3/H_2SO_4$ at $80^{\circ}C$. The optimum pre-treatment conditions in closed digestion system were determinated by the acid combination with $HNO_3/HCl/H_2O_2/HF$ in microwave at 320 W for 20 min. The recovery rate in open digestion system was 85~94% and in closed digestion system was indicated as about 100%. Therefore, the closed system is superior than the open system in pre-treatment method for the quantitative analysis of mercury, and the detected mercury contents in the sample of KOCC, AOCC and kraft sack paper were measured below 1 ppm.

A Study on Sustainable Packaging for Flower Basket Design (지속 가능한 꽃바구니 디자인 패키징에 관한 연구)

  • Ahn, Hye Kyung;Kim, Heung Ryeol
    • Journal of the Korean Society of Floral Art and Design
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    • no.43
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    • pp.81-100
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    • 2020
  • Since sustainable packaging of flower basket designs that are sold from florist shops is needed for both the seller and the buyer, studying of second packaging of flower basket design has begun. In this study, based on the survey that has been done in 2019, and the analysis of the interview that has been done in 2020, the suggestion of sustainable packaging development is the purpose. The definition of flower basket design was done and surveys of the status of domestic flower basket designs' second packaging were done in accordance with the type of basket which is an object, transportation, and characteristic of a florist shop. For sustainable packaging, based on physical theory, second packaging which depends on the packaging that includes design factor, transportation final destination has to be different. The factors to be considered as sustainable packaging are the quality of opaque paper, the necessity of first packaging, packaging structure that can fix an object, the form of second packaging influenced by types of transportation. Suggestions for packaging development included new materials for first packaging, eco-friendly objects that can be recycled and reused, structural packaging design, standardization and variability of packaging, protection of floristry which is the fundamental purpose of packaging, and brand advertisement effect. Based on the result of this study further designs of packaging will be commercialized. This study is significant for serving the opportunity of new packaging design for futuristic floristry that fit for unmanned system and studying of categories of products.

A Study on Improvement of Optical Characteristics by Packaging Methods in Three Electrode-Type Reflective Display (3전극형 반사형 디스플레이에서 패키징 방법에 의한 광특성 개선에 관한 연구)

  • Park, Sang-Hyun;Kim, Young-Cho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.3
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    • pp.170-174
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    • 2017
  • In 3 electrode reflective displays using a plastic substrate, unstable packaging induces particle clumping and optical degradation due to external air inflow and electronic ink evaporation. In this work, we fabricate 3 electrode electronic paper using glass wafer, ITO/plastic film, and ITO/glass/gas barrier film as an upper substrate after injecting electronic ink onto the lower substrate. Then, we studied its properties. After operating under stress conditions for 336 hours at $85^{\circ}C$ and 75% humidity, the reflectivity of driven e-paper panels with white color was 25.5% for the panels using glass wafer, 22.5% for plastic film including a gas barrier layer, and 16% for plastic film only. From these optical properties, we conclude that gas barrier film improves upper film isolation as a desirable packaging method.

Correlation of Texture and Sensory Analysis on Film Surfaces for Implementing Emotional Design (감성디자인 구현을 위한 플라스틱 필름 표면의 거칠기와 감각 특성의 상관관계 도출)

  • Do Yeop Kim;Yong Ju Lee;Minjung Joo;Ha Kyoung Yu;Hyung Jin Kim
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.30 no.2
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    • pp.149-160
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    • 2024
  • One of the main functions of packaging is promoting the products. Competitive markets demand that products appeal more to consumers in many perspectives. Other than its original purpose, which is protection, packaging has been tasked with implementing the emotional appeal of a product through unique shapes, textures, and visual designs. Understanding emotional appeals to consumer is a potential marketing strategy so that research have been done about techniques to visualize the design and print the specific textures. Especially, paper-like films are known as eco-friendly or emotional design and they are able to protect the products from oxygen or water vapor better than papers. In this study, paper-like films, which is printed with inks to have rougher surfaces, are analysed in terms of roughness, friction, imaging and sensory evaluation of subjective softness from consumers. Also, the prediction model was established with the correlation of the measured results and sensory panel test (SPT) of consumer preferences by touch. The results showed that the prediction of subjective texture preference was contributed by 63.9% for surface roughness and 36.1% for friction profile parameters. It confirmed that surface roughness characteristics should be prioritized to improve tactile preference for paper-like films.

Manufacture of Water-Resistant Corrugated Board Boxes for Agricultural Products in the Cold Chain System

  • Jo, Jung-Yeon;Min, Choon-Ki;Shin, Jun-Seop
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.44 no.2
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    • pp.29-34
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    • 2012
  • For the purpose of developing liner board for water-resistant corrugated board in the cold chain system, several types of base paper for corrugated board were purchased from the market and 6 different boards were produced in the paperboard mill by applying the chemicals on the base paper. Then, water-moisture resistant performance and physical properties of the boards were compared each other. The liner board which is dried at high temperature with pressure by Condebelt papermaking system(CK paper) showed a superior performance in strength over common liner boards. Strength of the board increased by surface chemical treatment up to 60% of compressive strength and 30% of bursting strength. Starch insolubilization with Ammonium-Zirconium Carbonate(AZC) and surface coating with a surface size and a moisture resistant chemical on CK paper showed the best result. Therefore, this method was recommended to produce the outer liner board for water -resistant corrugated board.

A Study on the Application Direction of Finite Element Analysis in the Field of Packaging through Research Trend Analysis in Korea (국내 연구 동향 분석을 통한 포장분야에서 유한요소해석의 적용 방향에 관한 고찰)

  • Lee, Hakrae;Jeon, Kyubae;Ko, Euisuk;Shim, Woncheol;Kang, Wookgun;Kim, Jaineung
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.23 no.3
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    • pp.191-200
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    • 2017
  • Proper packaging design can meet both the environmental and economic aspects of packaging materials by reducing the use of packaging materials, waste generation, material costs, and logistics costs. Finite element analysis(FEM) is used as a useful tool in various fields such as structural analysis, heat transfer, fluid motion, and electromagnetic field, but its application in the field of packaging is still insufficient. Therefore, the application of FEM to the field of packaging can save the cost and time in the future research because it is possible to design the package by computer simulation, and it is possible to reduce the packaging waste and logistics cost through proper packaging design. Therefore, this study investigated the FEM papers published in Korea for the purpose of helping research design using FEM program in the field of packaging in the future. In this paper, we analyzed the 29 papers that were directly related to the analysis of FEM papers published in domestic journals from 1991 to 2017. As a result, we analyzed the research topic, FEM program, and analysis method using each paper, and presented the direction that can be applied in future packaging field. When the FEM is applied to the packaging field, it is possible to change the structure and reduce the thickness through the stress and vibration analysis applied to the packaging material, thereby reducing the cost by improving the mechanical strength and reducing the amount of the packaging material. Therefore, in the field of packaging research in the future, if the FEM is performed together, economical and reasonable packaging design will be possible.

Manufacture of Water-Resistant Corrugated Fiberboard Boxes for Agricultural Products in the Cold Chain System (IV) - Measurement and analysis of storage condition, distribution route, and packaging method for selected agricultural products - (농산물 저온유통용 내수골판지 상자의 제조(제4보) - 대상농산물별 저온유통조건, 유통경로 및 포장규격 조사 분석 -)

  • Lee Myoung-Hoon;Jo Jung-Yeon;Min Choon-Ki;Shin Jun-Seop
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.38 no.1 s.113
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    • pp.62-69
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    • 2006
  • This study was carried out to measure and analyze the storage condition, distribution route, and packaging method of four selected agricultural products(small tomato, cabbage, peach, and carrot) in the cold chain system. It was shown that dew-forming phenomenon by fruits and vegetables deteriorates the agricultural product quality and physical properties of corrugated fiberboard box during the cold chain system. The compressive strength deterioration in corrugated fiberboard boxes was much greater for single wall(SW) corrugated fiberboard containers than for double wall(DW) in low temperature-high humidity condition. To reduce the deterioration of box and dew-forming phenomenon, water-repellency treatment should be over $R_6$. However, water-resistant treatment of corrugated fiberboard containers would be effective under high relative humidity conditions more than 75% RH. It was suggested that functional corrugated fiberboard box packaging would be an optimum method to reduce the deterioration of agricultural products quality by. It was also achieved controlling the relative humidity and temperature during the storage and physical distribution process.