• 제목/요약/키워드: Palladium(Pd)

검색결과 353건 처리시간 0.022초

다양한 UBM층상의 Sn0Ag0.5Cu 솔더 범프의 고속 전단특성에 미치는 전단속도의 영향 (Effect of Shearing Speed on High Speed Shear Properties of Sn1.0Ag0.5Cu Solder Bump on Various UBM's)

  • 이왕구;정재필
    • 대한금속재료학회지
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    • 제49권3호
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    • pp.237-242
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    • 2011
  • The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

Ni 박막 위 20 nm급 고정렬 Pt 크로스-바 구조물의 형성 방법 (Pattern Formation of Highly Ordered Sub-20 nm Pt Cross-Bar on Ni Thin Film)

  • 박태완;정현성;조영래;이정우;박운익
    • 대한금속재료학회지
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    • 제56권12호
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    • pp.910-914
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    • 2018
  • Since catalyst technology is one of the promising technologies to improve the working performance of next generation energy and electronic devices, many efforts have been made to develop various catalysts with high efficiency at a low cost. However, there are remaining challenges to be resolved in order to use the suggested catalytic materials, such as platinum (Pt), gold (Au), and palladium (Pd), due to their poor cost-effectiveness for device applications. In this study, to overcome these challenges, we suggest a useful method to increase the surface area of a noble metal catalyst material, resulting in a reduction of the total amount of catalyst usage. By employing block copolymer (BCP) self-assembly and nano-transfer printing (n-TP) processes, we successfully fabricated sub-20 nm Pt line and cross-bar patterns. Furthermore, we obtained a highly ordered Pt cross-bar pattern on a Ni thin film and a Pt-embedded Ni thin film, which can be used as hetero hybrid alloy catalyst structure. For a detailed analysis of the hybrid catalytic material, we used scanning electron microscope (SEM), transmission electron microscope (TEM) and energy-dispersive X-ray spectroscopy (EDS), which revealed a well-defined nanoporous Pt nanostructure on the Ni thin film. Based on these results, we expect that the successful hybridization of various catalytic nanostructures can be extended to other material systems and devices in the near future.

자동차(自動車) 폐촉매(廢觸媒)의 침출액(浸出液)으로부터 시멘테이션에 의한 백금족(白金族) 금속(金屬)의 회수(回收) (Recovery of Platinum Group Metals from the Leach Solution of Spent Automotive Catalysts by Cementation)

  • 김민석;김병수;김은영;김수경;류재욱;이재천
    • 자원리싸이클링
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    • 제20권4호
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    • pp.36-45
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    • 2011
  • 금속분말을 환원제로 사용하는 시멘테이션에 의하여 자동차 폐촉매의 침출액과 침출잔사의 세척액으로부터 백금족 금속을 환원 석출시켜 회수하는 연구를 수행하였다. 환원제로 사용한 알루미늄, 마그네슘 그리고 아연이 백금족 금속의 시멘테이션에 미치는 영향을 조사하였으며 알루미늄을 최적 환원제로 선정하였다. 침출액에 19.3 당량의 알루미늄을 첨가하고 $50{\sim}60^{\circ}C$에서 10분간 시멘테이션을 행하였을 때 백금, 팔라듐, 로듐의 환원석출율은 각각 99.3%, 99.4%, 90.2% 정도 이었다. 또한 세척액에 알루미늄을 45 당량 투입한 후 시멘터이션 반응을 통해 백금, 팔라륨, 로듐을 각각 97%, 97%, 90% 회수할 수 있었다. 그리고 회수한 환원석출물의 금속불순물들을 질산침출로 제거함으로써 백금족 금속의 품위를 약 10% 정도 향상시킬 수 있었다.