• Title/Summary/Keyword: Pad temperature

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Elastic Deformation Induced Preload Change in Tilting Pad Journal Bearing (탄성변형으로 인한 틸팅패드 저널베어링의 예압 변화)

  • Donghyun Lee;Junho Suh
    • Tribology and Lubricants
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    • v.39 no.3
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    • pp.102-110
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    • 2023
  • This study aims to quantify the variation in the performance of a tilting pad journal bearing (TPJB) owing to the elastic deformation of its pad. To this end, we first defined a parameter, "elastic preload", and predicted the changes in the performance of the TPJB, as a function of the preload amount. We used the iso-viscosity Reynolds equation, which ignores the temperature rise due to viscous shear in thin films, and the resultant thermal deformation of the bearing structure. We employed a three-dimensional finite element model to predict the elastic deformation of the bearing pad, and a transient analysis, to converge to a static equilibrium condition of the flexible pads and journal. Conducting a modal coordinate transformation helped us avoid heavy computational issues arising from a mesh refinement in the three-dimensional finite element pad model. Moreover, we adopted the Hertzian contact model to predict the elastic deformation at the pivot location. With the aforementioned overall strategy, we predicted the performance changes owing to the elastic deformation of the pad under varying load conditions. From the results, we observed an increase in the preload due to the pad elastic deformation.

Performance Research of a Multi Functional Tree Protection Pad (다목적 기능을 가진 수목보호패드의 성능 연구)

  • Jung, Yong-Jo;Lee, Kyung-Yeon
    • Journal of the Korean Society of Environmental Restoration Technology
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    • v.21 no.1
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    • pp.133-143
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    • 2018
  • In spite of the growing importance of landscaping trees, the rate of flawed and withered trees damaged by pest, disease, drought or frost is increasing. In order to evaluate the performance of the Tree Protective Pad, which are developed to reduce the failure ratio in landscape planting, the tree protective pad for 'digging', 'pest controlling', and 'insulating' are tested based on the five functional criteria; moisturizing effect, wither preventive effect, pest and disease control, thermal effect, tensile strength, and environmental performance. The result of this study is as follows. The moisturizing effect of the tree protective pad for digging is found to be outstanding. According to the result of testing the pad on trees, in particular, it is better than jute tape in wither preventive effect, which means it is expected to prevent flaw and wilt from planting during the improper seasons like summertime. The experiment of installing the protective tree pad for pest controlling to the trunk of Quercus mongolica shows that preventive effect of the pad from diseases and insects is superior, and it also has economical effect by reducing the use of agricultural chemicals. The comparative test of the pad for insulating and jute tape proves that the temperature of the pad is about $2^{\circ}C$ higher than outside. The rate of tensile strength and biodegradation of the pad exceeds the optimal level, so it is revealed that the pad may be the work efficient and environment-friendly product. Likewise, by timely irrigating trees, the tree protective pad economically prevents trees from pest, disease,drought or frost, which may be caused by improper seasonal or delayed planting. As a means of reducing the flaw and facilitating the growth of trees, the exceptional performance of the pad is expected to effectively used in landscape planting and management.

A Study on Temperature Field of Solid Disc Brake based on Thermal-mechanical Coupled Model (열-기계적 복합 모델을 기반으로 한 Solid 디스크 브레이크의 온도장에 관한 연구)

  • Wu, Xuan;Hwang, Pyung;Jeon, Young-Bae
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.396-401
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    • 2008
  • The disc-pad brake system is an important part of automobile safety system. During braking, the kinetic energy and potential energies of a moving vehicle are converted into the thermal energy through frictional heat between the brake disc and the pads. Most of the thermal energy dissipated through the brake disc. The temperature could be exceed the critical value for a given material, which leads to undesirable effects, such as the brake fade, premature wear, brake fluid vaporization, bearing failure, thermal cracks, and thermallyexcited vibration. The object of the present study is to investigate temperature field and temperature variation of brake disc and pad during single brake. The brake disc is decelerated at the initial speed with constant acceleration, until the disc comes to stop. The pad-disc brake assembly is built by 3D model with the appropriate boundary condition. In the simulation process, the mechanical loads are applied to the thermomechanical coupling analysis in order to simulate the process of heat produced by friction.

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Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization

  • Zhuanga, Yun;Borucki, Leonard;Philipossian, Ara;Dien, Eric;Ennahali, Mohamed;Michel, George;Laborie, Bernard;Zhuang, Yun;Keswani, Manish;Rosales-Yeomans, Daniel;Lee, Hyo-Sang;Philipossian, Ara
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.2
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    • pp.53-57
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    • 2007
  • In this study, a novel slurry containing ceria as the abrasive particles was analyzed in terms of its frictional, thermal and kinetic attributes for interlayer dielectric (ILD) CMP application. The novel slurry was used to polish 200-mm blanket ILD wafers on an $IC1000_{TM}$ K-groove pad with in-situ conditioning. Polishing pressures ranged from 1 to 5 PSI and the sliding velocity ranged from 0.5 to 1.5 m/s. Shear force and pad temperature were measured in real time during the polishing process. The frictional analysis indicated that boundary lubrication was the dominant tribological mechanism. The measured average pad leading edge temperature increased from 26.4 to $38.4\;^{\circ}C$ with the increase in polishing power. The ILD removal rate also increased with the polishing power, ranging from 400 to 4000 A/min. The ILD removal rate deviated from Prestonian behavior at the highest $p{\times}V$ polishing condition and exhibited a strong correlation with the measured average pad leading edge temperature. A modified two-step Langmuir-Hinshelwood kinetic model was used to simulate the ILD removal rate. In this model, transient flash heating temperature is assumed to dominate the chemical reaction temperature. The model successfully captured the variable removal rate behavior at the highest $p{\times}V$ polishing condition and indicates that the polishing process was mechanical limited in the low $p{\times}V$ polishing region and became chemically and mechanically balanced with increasing polishing power.

Thermal Behavior of Automotive Ventilated Disk Brake (자동차 디스크 브레이크의 방열성능에 관한 연구)

  • 김진택;백병준
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2000.11a
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    • pp.186-192
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    • 2000
  • The heat generated in contact type braking system can cause an unacceptable braking performance. Thermal behavior of ventilated disk brake system is presented in this paper. The temperature and velocity fields of 3-D unsteady simulated model are obtained using a software package "FLUENT". The numerical results show that there exits a temperature nonuniformity between the disk faces contacting with pads. The conduction rate through the disk and pad is calculated and the effect of material conductivity is also investigated.estigated.

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Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System

  • Lee, Hyo-Sang;DeNardis, Darren;Philipossian, Ara;Seike, Yoshiyuki;Takaoka, Mineo;Miyachi, Keiji;Doi, Toshiro
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.1
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    • pp.26-31
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    • 2007
  • The goal of this study is to determine if High Pressure Micro Jet (HPMJ) conditioning can be used as a substitute for, or in conjunction with, conventional diamond pad conditioning. Five conditioning methods were studied during which 50 ILD wafers were polished successively in a 100-mm scaled polisher and removal rate (RR), coefficient of friction (COF), pad flattening ratio (PFR) and scanning electron microscopy (SEM) measurements were obtained. Results indicated that PFR increased rapidly, and COF and removal rate decreased significantly, when conditioning was not employed. With diamond conditioning, both removal rate and COF were stable from wafer to wafer, and low PFR values were observed. SEM images indicated that clean grooves could be achieved by HPMJ pad conditioning, suggesting that HPMJ may have the potential to reduce micro scratches and defects caused by slurry abrasive particle residues inside grooves. Regardless of different pad conditioning methods, a linear correlation was observed between temperature, COF and removal rate, while an inverse relationship was seen between COF and PFR.

Experimental Investigation on the THD Preformance of a Large Tilting Pad Journal Bearing (대형 틸팅패드 저어널베어링의 THD 성능에 관한 실험적 연구)

  • 하현천;김경웅;김영춘;김호종
    • Tribology and Lubricants
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    • v.9 no.2
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    • pp.29-35
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    • 1993
  • The thermohydrodynamic(THD) performance of a large tilting pad journal bearing in laminar and turbulent flow regions is investigated experimentally. The continuous shaft surface temperature, and bearing surface temperature are measured along with the shaft speed and the bearing load for various flow rates. It is observed that the shaft surface temperature is constant in the circumferential direction and increases with the increase of shaft speed in both low and high shaft speed region, however, there exist transition region where the shaft surface temperature decreases with the increase of shaft speed. When the turbulence occurs in the lubricant film, both the inlet and maximum bearing surface temperature steeply increase and the temperature gradient in the circumferential direction decreases.

COG(chip on glass) 구조에서 유리를 투과하는 레이저 조사 방식에 의한 area array type 패키지의 마운팅 공정

  • 이종현;김원용;이용호;김영석
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.07a
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    • pp.119-126
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    • 2001
  • Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

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