• 제목/요약/키워드: Pad temperature

검색결과 346건 처리시간 0.023초

자동차용 브레이크 로터의 재료로 사용되는 회주철의 미세구조에 따른 마찰특성에 관한 연구 (Effect of the Microstructure of Gray Cast Iron Disk on Friction Characteristics)

  • 조민형;장호
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 1999년도 제29회 춘계학술대회
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    • pp.240-246
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    • 1999
  • The effect of microstructure of gray cast iron disk was investigated by using a pad-on-disk type friction tester. Three different rotors with different microstructures were studied in this work. They showed a pearlitic matrix, a ferritic matrix, and a martensitic structure, respectively. All of them have graphite flakes in common. Drag tests at different pressure and speed conditions were carried out to study friction stability, temperature rise during drags. The rotor containing pearlitic matrix showed lower values of friction coefficient, small amount of temperature rise, and less fading. The results showed that gray cast iron disk containing pearlitic matrix has good friction characteristics.

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자동차용 마찰재의 성형조건에 따른 마찰 특성에 관한 연구 (The Effect of Manufacturing Parameters of Automotive Friction Materials on Friction Characteristics)

  • 김광석;장호
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 1999년도 제29회 춘계학술대회
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    • pp.247-254
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    • 1999
  • The effect of manufacturing parameters such as molding and curing conditions on friction characteristics of friction materials were studied using a pad-on-disk type friction tester. The optimal manufacturing rendition for the best friction characteristics were investigated using friction materials containing 15 ingredients employing Taguchi robust design experiment. The friction characteristics were strongly affected by pressing time, pressing temperature, pressing pressure, curing time, curing temperature.

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타공 디스크에 의한 열적 성능 및 내구성 향상 연구 (Study on Improvement of Thermal Performance and Durability by Disk with Holes)

  • 한문식;조재웅
    • 한국기계가공학회지
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    • 제10권1호
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    • pp.62-66
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    • 2011
  • In this study, the thermal performance of disk can be compared with disk and disk with holes through numerical analysis. The capacity of thermal emission on general disk becomes more than on disk with holes at the distribution of temperature at first and the magnitude of equivalent stress on general disk becomes less than on disk with holes at the distribution of stress. The capacity of thermal emission or the magnitude of thermal deformation on disk with holes becomes less than that on general disk 30 minutes later. The disk with holes is worn less and more durable than general disk. The performance of cooling and braking force at disk and pad can be improved by installing the disk with holes.

Pb Free 솔더를 사용한 솔더 접합부의 접합 강도 향상에 관한 연구 (Study on Joining Strength Improvement of Solder Joint with Pb Free Solder)

  • 신영의;김영탁
    • Journal of Welding and Joining
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    • 제15권2호
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    • pp.36-42
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    • 1997
  • In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.

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솔더 포일을 이용한 무플럭스 솔더링에 관한 연구 (A Study on Fluxless Soldering using Solder Foil)

  • 신영의;김경섭
    • Journal of Welding and Joining
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    • 제16권5호
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    • pp.100-107
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    • 1998
  • This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

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웨이퍼 폴리싱 공정의 회전속도와 진폭속도에 따른 가공특성 연구 (A Study on the Characteristics of a Wafer-Polishing Process at Various Machining and Oscillation Speed)

  • 이은상;이상균;김성현;원종구
    • 한국기계가공학회지
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    • 제11권1호
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    • pp.1-6
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    • 2012
  • The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

Optimum Design of the Screw extruder using Thermo-mechanical Analysis

  • Cho, Seung-Hyun;Kim, Chung-Kyun
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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    • pp.28-33
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    • 2001
  • Screw conveyors are used extensively in industrial for conveying and elevating materials. Despite their apparent simplicity, the mechanics of the conveying action is very complex. so many engineers depend on experiential data. Capacities of screw are pumping, steady flow of polymer melts, steady volumetric throughput etc. they are affected by geometry of screw, heat flux, pressure on inside barrel, rotating velocity, friction coefficient at screw surface etc. by computation volumetric efficiency increases as rotating velocity increases and decreases as friction coefficient increases. also it decreases with short pitch length. and double flight screw is more effective than single flight screw. The temperature of polymer melts by heating pad and injection pressure play a very important role in the injection molding machine. so in this paper we analyze thermal distortion and stress of screw includes pressure and temperature distributions by finite element analysis to understand what design factors influence on volumetric throughput efficiency of the screw and thermo-mechanical characteristics of screw.

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Polyester/면 혼방직물의 alkali 처리가공 (Alkali-Treatment of Polyester/Cotton Blend Fabric)

  • Lee, Suk-Young;Cho, Hwan
    • 한국염색가공학회지
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    • 제3권3호
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    • pp.6-14
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    • 1991
  • To develop an one-bath process for weight-reduction and mercerization of polyester/cotton fabric, concentrated NaOH solution was padded and steam-treated at high temperature. Following results which can be used commercially are obtained. (1) Steaming temperature of 110-12$0^{\circ}C$ is most efficient. (2) Optimum concentration of NaOH solution is 15-20%. (3) Most favorable weight-reduction is 20% in the aspect of fabric handle, and under this treating condition, dye exhaustion onto the mercerized cotton fiber is also increased to 40% or more. From above results, we believe that the economical and concurrent weight-reduction and mercerzation of polyester/cotton fabric can be realized. Moreover, with continuous treatment by pad-steam procedure, it is expected that this is, also, advantageous for the improvement of fabric quality and productivity.

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BGA용 Sn-3.5Ag 롤의 리플로 솔더링 특성 (Reflow Soldering Characteristics of Sn-3.5Ag Balls for BGA)

  • 한현주;정재필;하범용;신영의;박재용;강춘식
    • Journal of Welding and Joining
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    • 제19권2호
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    • pp.176-181
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    • 2001
  • Reflow soldering characteristics of Sn-3.5Ag and Sn-37Pb balls for BGA(Ball grid Array) were investigated. Diameter of 0.76mm ball was set on a Cu/Ni/Au-coated pad and reflowed in air with changing peak soldering temperature and conveyor speed. Peak temperatures were changed from 240 to 28$0^{\circ}C$ for Sn-3.5Ag, and from 220 to 26$0^{\circ}C$ for Sn-37Pb balls. As results, heights of solder balls increased and widths decreased with peak soldering temperature. Through aging treatment at 10$0^{\circ}C$ for 1.000 hrs, average hardness of Sn-3.5Ag balls bonded at 25$0^{\circ}C$ cecreased from 14.90Hv to 12.83Hv And with same aging conditions, average shear strength of Sn-3.5Ag balls bonded at 26$0^{\circ}C$ decreased from 1727gf to 1650gf.

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다중날을 가진 스크류의 최적화 설계 (The optimum Design of the Multi-flight Screw using Finite Element Analysis)

  • 최동열;조승현;김청균
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2001년도 제33회 춘계학술대회 개최
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    • pp.248-256
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    • 2001
  • Capacities of screw are pumping, steady flow of polymer melts, volumetric efficiency, steady volumetric throughout etc. they are affected by geometry of screw, heat flux, pressure on inside barrel, rotating velocity, friction coefficient at screw surface etc. Also the temperature of polymer melts by heating pad and injection pressure play a very important role in the injection molding machine. by computation volumetric efficiency increases as rotating velocity increases, flight number increses, and decreases as friction coefficient increases. but volumetric throughout is different :s flight number increases with helix angle variability. so in this paper we analyze thermal distortion and stress of screw includes pressure and temperature distributions by finite element analysis to understand what design factors influence on thermo-mechanical characteristics of screw.

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