• Title/Summary/Keyword: Pad temperature

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디스크 브레이크 저더 개선을 위한 신뢰성 향상 연구

  • Jeong, Won-Seon;Lee, Chang-Su;Song, Hyeon-Seok;Jeong, Do-Hyeon
    • Proceedings of the Korean Reliability Society Conference
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    • 2011.06a
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    • pp.99-106
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    • 2011
  • In this study, the analysis technique, which can estimate the temperature rise and thermal deformation of the ventilated disc considering the vehicle information, braking condition and properties of the disc and pad, is developed. The analytical process of the braking power generation during braking is mathematically derived. The thermal energy, which is applied to the surface of a disc as heat flux, is calculated. Then, the temperature rise and thermal deformation of a disc are estimated using FE software, SAMCEF. Shape of the cross section of the disc is optimized according to the response surface analysis method in order to minimize the temperature rise and thermal deformation. The hot judder analysis is done using the optimized disc, and the analysis results are discussed.

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Impact of External Temperature Environment on Large FCBGA Sn-Ag-Cu Solder Interconnect Board Level Mechanical Shock Performance

  • Lee, Tae-Kyu
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.53-59
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    • 2014
  • The mechanical stability of solder joints in electronic devices with Sn-Ag-Cu is a continuous issue since the material was applied to the industry. Various shock test methods were developed and standardized tests are used in the industry worldwide. Although it is applied for several years, the detailed mechanism of the shock induced failure mechanism is still under investigation. In this study, the effect of external temperature was observed on large Flip-chip BGA components. The weight and size of the large package produced a high strain region near the corner of the component and thus show full fracture at around 200G level shock input. The shock performance at elevated temperature, at $100^{\circ}C$ showed degradation based on board pad designs. The failure mode and potential failure mechanisms are discussed.

Axisymmetric Temperature Analysis of Ventilated Disk using Equivalent Parameters (등가상수를 이용한 벤트레이트 디스크의 축대칭 온도 해석)

  • 여태인
    • Transactions of the Korean Society of Automotive Engineers
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    • v.11 no.1
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    • pp.137-142
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    • 2003
  • In automotive brake systems, the frictional heat generated can cause high temperature at the interface of rotor and pad which may deteriorate the material properties of the sliding parts and can result in brake fade. Conventionally, a pie-shaped 3-dimentional model is adopted to calculate temperature of ventilated disk using finite element method. To overcome the difficulties in preparing 3D finite element model and reduce the computational time required, the ventilated rotor is to be analyzed, in this study, as an axisymmetric finite element model in which, taking into considerations the effects of cooling passages, a homogenization technique is used to obtain the equivalent thermal properties and boundary conditions for the elements placed at the vent holes. Numerical tests show the proposed procedure can be successfully applied in practice, replacing 3-dimensional thermal analysis of ventilated disk.

Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding

  • Lee, Haksun;Choi, Kwang-Seong;Eom, Yong-Sung;Bae, Hyun-Cheol;Lee, Jin Ho
    • ETRI Journal
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    • v.38 no.6
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    • pp.1163-1171
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    • 2016
  • Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

Analysis of Greenhouse Thermal Environment by Model Simulation (시뮬레이션 모형에 의한 온실의 열환경 분석)

  • 서원명;윤용철
    • Journal of Bio-Environment Control
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    • v.5 no.2
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    • pp.215-235
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    • 1996
  • The thermal analysis by mathematical model simulation makes it possible to reasonably predict heating and/or cooling requirements of certain greenhouses located under various geographical and climatic environment. It is another advantages of model simulation technique to be able to make it possible to select appropriate heating system, to set up energy utilization strategy, to schedule seasonal crop pattern, as well as to determine new greenhouse ranges. In this study, the control pattern for greenhouse microclimate is categorized as cooling and heating. Dynamic model was adopted to simulate heating requirements and/or energy conservation effectiveness such as energy saving by night-time thermal curtain, estimation of Heating Degree-Hours(HDH), long time prediction of greenhouse thermal behavior, etc. On the other hand, the cooling effects of ventilation, shading, and pad ||||&|||| fan system were partly analyzed by static model. By the experimental work with small size model greenhouse of 1.2m$\times$2.4m, it was found that cooling the greenhouse by spraying cold water directly on greenhouse cover surface or by recirculating cold water through heat exchangers would be effective in greenhouse summer cooling. The mathematical model developed for greenhouse model simulation is highly applicable because it can reflects various climatic factors like temperature, humidity, beam and diffuse solar radiation, wind velocity, etc. This model was closely verified by various weather data obtained through long period greenhouse experiment. Most of the materials relating with greenhouse heating or cooling components were obtained from model greenhouse simulated mathematically by using typical year(1987) data of Jinju Gyeongnam. But some of the materials relating with greenhouse cooling was obtained by performing model experiments which include analyzing cooling effect of water sprayed directly on greenhouse roof surface. The results are summarized as follows : 1. The heating requirements of model greenhouse were highly related with the minimum temperature set for given greenhouse. The setting temperature at night-time is much more influential on heating energy requirement than that at day-time. Therefore It is highly recommended that night- time setting temperature should be carefully determined and controlled. 2. The HDH data obtained by conventional method were estimated on the basis of considerably long term average weather temperature together with the standard base temperature(usually 18.3$^{\circ}C$). This kind of data can merely be used as a relative comparison criteria about heating load, but is not applicable in the calculation of greenhouse heating requirements because of the limited consideration of climatic factors and inappropriate base temperature. By comparing the HDM data with the results of simulation, it is found that the heating system design by HDH data will probably overshoot the actual heating requirement. 3. The energy saving effect of night-time thermal curtain as well as estimated heating requirement is found to be sensitively related with weather condition: Thermal curtain adopted for simulation showed high effectiveness in energy saving which amounts to more than 50% of annual heating requirement. 4. The ventilation performances doting warm seasons are mainly influenced by air exchange rate even though there are some variations depending on greenhouse structural difference, weather and cropping conditions. For air exchanges above 1 volume per minute, the reduction rate of temperature rise on both types of considered greenhouse becomes modest with the additional increase of ventilation capacity. Therefore the desirable ventilation capacity is assumed to be 1 air change per minute, which is the recommended ventilation rate in common greenhouse. 5. In glass covered greenhouse with full production, under clear weather of 50% RH, and continuous 1 air change per minute, the temperature drop in 50% shaded greenhouse and pad & fan systemed greenhouse is 2.6$^{\circ}C$ and.6.1$^{\circ}C$ respectively. The temperature in control greenhouse under continuous air change at this time was 36.6$^{\circ}C$ which was 5.3$^{\circ}C$ above ambient temperature. As a result the greenhouse temperature can be maintained 3$^{\circ}C$ below ambient temperature. But when RH is 80%, it was impossible to drop greenhouse temperature below ambient temperature because possible temperature reduction by pad ||||&|||| fan system at this time is not more than 2.4$^{\circ}C$. 6. During 3 months of hot summer season if the greenhouse is assumed to be cooled only when greenhouse temperature rise above 27$^{\circ}C$, the relationship between RH of ambient air and greenhouse temperature drop($\Delta$T) was formulated as follows : $\Delta$T= -0.077RH+7.7 7. Time dependent cooling effects performed by operation of each or combination of ventilation, 50% shading, pad & fan of 80% efficiency, were continuously predicted for one typical summer day long. When the greenhouse was cooled only by 1 air change per minute, greenhouse air temperature was 5$^{\circ}C$ above outdoor temperature. Either method alone can not drop greenhouse air temperature below outdoor temperature even under the fully cropped situations. But when both systems were operated together, greenhouse air temperature can be controlled to about 2.0-2.3$^{\circ}C$ below ambient temperature. 8. When the cool water of 6.5-8.5$^{\circ}C$ was sprayed on greenhouse roof surface with the water flow rate of 1.3 liter/min per unit greenhouse floor area, greenhouse air temperature could be dropped down to 16.5-18.$0^{\circ}C$, whlch is about 1$0^{\circ}C$ below the ambient temperature of 26.5-28.$0^{\circ}C$ at that time. The most important thing in cooling greenhouse air effectively with water spray may be obtaining plenty of cool water source like ground water itself or cold water produced by heat-pump. Future work is focused on not only analyzing the feasibility of heat pump operation but also finding the relationships between greenhouse air temperature(T$_{g}$ ), spraying water temperature(T$_{w}$ ), water flow rate(Q), and ambient temperature(T$_{o}$).

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알칼리성 슬러리를 이용한 단결정 및 다결정 실리콘의 화학적 기계적 연마 특성 평가

  • Kim, Hyeok-Min;Gwon, Tae-Yeong;Jo, Byeong-Jun;Venkatesh, R. Prasanna;Park, Jin-Gu
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.24.1-24.1
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    • 2011
  • CMP (Chemical Mechanical Planarization)는 고직접도의 다층구조의 소자를 형성하기 위한 표면연마 공정으로 사용되며, pattern 크기의 감소에 따른 공정 중요도는 증가하고 있다. 반도체 소자 제조 공정에서는 낮은 비용으로 초기재료를 만들 수 있고 우수한 성능의 전기 절연성질을 가지는 산화막을 만들 수 있는 단결정 실리콘 웨이퍼가 주 재료로 사용되고 있으며, 반도체 공정에서 실리콘 웨이퍼 표면의 거칠기는 후속공정에 매우 큰 영향을 미치므로 CMP 공정을 이용한 평탄화 공정이 필수적이다. 다결정 실리콘 박막은 현재 IC, RCAT (Recess Channel Array Transistor), 3차원 FinFET 제조 공정에서 사용되며 CMP공정을 이용한 표면 거칠기의 최소화에 대한 연구의 필요성이 요구되고 있다. 본 연구에서는 알칼리성 슬러리를 이용한 단결정 및 다결정 실리콘의 식각 및 연마거동에 대한 특성평가를 실시하였다. 화학적 기계적 연마공정에서 슬러리의 pH는 슬러리의 분산성, removal rate 등 결과에 큰 영향을 미치고 연마대상에 따라 pH의 최적조건이 달라지게 된다. 따라서 단결정 및 다결정 실리콘 연마공정의 최적 조건을 확립하기 위해 static etch rate, dynamic etch rate을 측정하였으며 연마공정상의 friction force 및 pad의 온도변화를 관찰한 후 removal rate을 계산하였다. 실험 결과, 단결정 실리콘은 다결정 실리콘보다 static/dynamic etch rate과 removal rate이 높은 것으로 나타났으며 슬러리의 pH에 따른 removal rate의 증가율은 다결정 실리콘이 더 높은 것으로 관찰되었다. 또한 다결정 실리콘 연마공정에서는 friction force 및 pad의 온도가 단결정 실리콘 연마공정에 비해 상대적으로 더 높은 것으로 나타났다. 결과적으로 단결정 실리콘의 연마 공정에서는 화학적 기계적인 거동이 복합적으로 작용하지만 다결정 실리콘의 경우 슬러리를 통한 화학적인 영향보다는 공정변수에 따른 기계적인 영향이 재료 연마율에 큰 영향을 미치는 것으로 확인되었으며, 이를 통한 최적화된 공정개발이 가능할 것으로 예상된다.

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Friction and Wear Properties of High Manganese Steel in Brake Friction Material for Passenger Cars (자동차용 브레이크 마찰재에서 고망간강의 마찰 및 마모특성)

  • Jung, Kwangki;Lee, Sang Woo;Kwon, Sungwook;Song, Myungsuk
    • Tribology and Lubricants
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    • v.36 no.2
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    • pp.88-95
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    • 2020
  • In this study, we investigate the mechanical properties of high manganese steel, and the friction and wear characteristics of brake friction material containing this steel, for passenger car application, with the aim of replacing copper and copper alloys whose usage is expected to be restricted in the future. These steels are prepared using a vacuum induction melting furnace to produce binary and ternary alloys. The hardness and tensile strength of the high manganese steel decrease and the elongation increases with increase in manganese content. This material exhibits high values of hardness, tensile strength, and elongation; these properties are similar to those of 7-3 brass used in conventional friction materials. We fabricate high manganese steel fibers to prepare test pad specimens, and evaluate the friction and wear characteristics by simulating various braking conditions using a 1/5 scale dynamometer. The brake pad material is found to have excellent friction stability in comparison with conventional friction materials that use 7-3 brass fibers; particularly, the friction stability at high temperature is significantly improved. Additionally, we evaluate the wear using a wear test method that simulates the braking conditions in Europe. It is found that the amount of wear of the brake pad is the same as that in the case of the conventional friction material, and that the amount of wear of the cast iron disc is reduced by approximately 10. The high manganese steel is expected to be useful in the development of eco-friendly, copper-free friction material.

Development of a Method for Rapid Analysis of DNA Hybridization (측방유동방식 신속 DNA 교잡 분석법의 개발)

  • 정동석;최의열
    • Korean Journal of Microbiology
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    • v.39 no.2
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    • pp.114-117
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    • 2003
  • In molecular biology, it is necessary to develop an easy and rapid method to identify a specific DNA sequence. Though Southern and Northern blot techniques have been used widely for the analysis of gene structure and function, those methods are inconvenient in the points that we need to control incubation temperature, time, and other parameters to get the final result. In this study, we report a new method for the rapid analysis of specific DNA sequence with the modification of an immunochromatographic method. The lateral flow DNA analysis strip is composed of a sample pad, a nitrocellulose membrane for the separation and propagation of analytes, and an absorption pad for the generation of capillary action. Capture DNA was immobilized on the membrane by UV cross-linking and target DNA was labeled with Cy-5 for signaling. The samples containing target DNA were applied onto the sample pad, incubated for 15 min for separation, and scanned with a GSI fluorescence scanner. Though the hybridization reaction occurs in a short time without any washing steps, there appears to be little cross hybridization between the different sequences. The result showed a possibility that the new method can be used for the rapid identification of specific DNA sequence among the samples.

A Study on Squeal Noise Simulation considering the Friction Material Property Changes according to Temperature and Pressure in an Automotive Brake Corner Module (차량용 브레이크 코너 모듈에서 마찰재의 온도와 압력에 따른 물성치 변화를 고려한 스퀼 소음 해석 연구)

  • Cho, Hojoon;Kim, Jeong-Tae;Chae, Ho-Joong
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2012.10a
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    • pp.546-552
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    • 2012
  • This paper is a study on squeal noise simulation under the consideration of temperature and pressure dependent material properties of friction material. For this, data of pressure and temperature dependent material properties of lining is achieved by using lining data base and exponential curve fit. Complex eigenvalue analysis is performed for predicting squeal noise frequency and instability and chassis dynamo test is performed for achieving squeal noise frequency, sound pressure level, occurrence temperature & pressure. Initial multi models are composed for considering complex interface conditions such as pad ear-clip, piston-housing and guide pin-torque member. The simulation result of base models is compared with the test result. Squeal noise simulation under the consideration of temperature and pressure dependent material properties of friction material is performed and analyzed using multi models. And additional condition is disc material property variation. Entire simulation conditions are combined and analyzed. Finally, this paper proposes direction of the warm squeal noise model.

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Board Level Reliability Evaluation for Package on Package

  • Hwang, Tae-Gyeong;Chung, Ji-Young
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2007.04a
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    • pp.37-47
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    • 2007
  • Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

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