• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.3 s.40
• /
• pp.47-51
• /
• 2006

Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A conditioning disk is used during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In this study, we characterized diamond disk with 9 kinds of sample.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.4
• /
• pp.321-326
• /
• 2005

Chemical mechanical polishing(CMP) process is essential technology to be applied to manufacturing the dielectric layer and metal line in semiconductor devices. It has been known that overpolishing in CMP depends on pattern selectivity as a function of density and pitch, and use of fixed abrasive pad(FAP) is one method which can improve the pattern selectivity. Thus, dishing & erosion defects can be reduced. This paper introduces the manufacturing technique of FAP using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. When applied to tungsten blanket wafers, the FAP resulted in appropriate performance in point of uniformity, material selectivity and roughness. Especially, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with the proposed FAP.

• Proceedings of the SAREK Conference
• /
• 2006.06a
• /
• pp.976-981
• /
• 2006

In case of attaching thermoelectric module and heat source, the polymer pad is attached on the $Al_2O_3$ plate, which is cooling side of thermoelectric module, in order to enhance mechanical safety of the system. It is impossible to calculate the exact distribution of temperature and flow pattern of inner gap of thermoelectric module. Therefore CFD(Computational Fluid Dynamics) analysis was executed to determine the thermo-fluid phenomena and distribution by Fluent. As the result of these analysis, heat transfer was dominated by conduction and the difference of temperature was linear distribution according to the thickness of polymer sheet.

• Proceedings of the SAREK Conference
• /
• 2006.06a
• /
• pp.1144-1149
• /
• 2006

Electric power is generated by Seeback Effect if there is thermal difference in pettier module. Peltier module is composed by alumina, Bi-Te semiconductor and insulation (or air). If load is increased in pettier module, the alumina of module will be destroyed. One of the preventing method of module destruction is using damper between module and heat source. But the electric Power is dropped because of decrease of thermal difference, if thermal conductivity of damper was tourer than other thermoelectric materials. We design, Polymer Pad for enhancing thermoelectric porter. As the result of these experiment, Polymer Pad is more superior than the Rubber in the stability and thermal conduction.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.16 no.2
• /
• pp.167-174
• /
• 2004

A sorption cool pad brings cooling effect without any pre-cooling, nor any external energy supply. It uses evaporative cooling effect stimulated by the desiccative sorption. In this paper, heat and mass transfer in the sorption cool pad are investigated theoretically. The evaporative cooling process caused by the desiccant is modeled and analyzed considering the sorption characteristics of the desiccant. Two nondimensional parameters are found to dominate the cooling process： one is related to the psychrometric characteristics and the other is to the sorption capacity of the desiccant. The former decides the time to reach the lowest temperature and the later controls the time duration of the cooling effect being sustained.

• Journal of the Korean Society for Precision Engineering
• /
• v.18 no.11
• /
• pp.168-173
• /
• 2001

The chemical mechanical polishing (CMP) is generally consisted of pad, slurry including abrasives and so on. However, there are some problems in a general CMP: defects, a high Cost of Consumable (CoC), an environmental problem. The slurry including abrasives especially gives rise to not only increase a CoC, but also prohibition from achieving an eco-process. This paper introduces an abrasive capsulation pad to achieve an eco-process decreasing abrasives used is CMP. The binder wth a water a water swelling and a water soluble characteristic is used for an auto-conditioning, and the $CeO_2$abrasive is selected for an abrasive capsulation pad. Comparing with a conventional CMP, an abrasive capsulation pad appears good characteristics in ILD CMP and is able to achieve an eco-process decreasing wasted slurry.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.10
• /
• pp.212-220
• /
• 2002

The finishing process for die and mold manufacturing is very important because it influences the final quality of products. Injection molds need higher quality surface than general purpose dies and molds. Conventional polishing can not make mold surface down to nanometer roughness efficiently because of their loading and glazing. This paper focused on the development of fixed abrasive pad using water swelling mechanism of polymer binder network. Self-conditioning was recognized as the long term polishing stabilization tool without any loading or glazing because water makes fixed abrasives free by swelling of the pad. Consequently, stable nano-polishing process has been applied on the injection mold, from the experimental results with polished surface roughness of Ra 15.1nm on STD-11 die steel.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.651-652
• /
• 2005

Chemical mechanical polishing (CMP) has emerged as the planarization technique of choice in integrated circuit manufacturing. Especially, polishing pad is considered as one of the most important consumables because of its properties. Generally, conventional polishing pad has irregular pores and asperities. If conditioning process is except from whole polishing process, smoothing of asperities and pore glazing occur on the surface of the pad, so repeatability of polishing performances cannot be expected. In this paper, CMP pad with microstructure was made using micro-molding technology and repeatability of ILD(interlayer dielectric) CMP performances and was evaluated.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.16 no.2
• /
• pp.121-127
• /
• 2004

This paper describes conceptual development and idea-verification of a sub-miniature portable cooler which dose not necessitate any pre-cooling nor any external energy supply. The basic principle of the cooling mechanism is the vaporization of water and sub-sequent cooling due to the evaporative latent heat loss. In this work, the vaporization of the water is stimulated by desiccant material to improve the cooling effect. The evaporative cooling caused by the desiccant is modeled and analyzed considering the sorption characteristics of the desiccant. In addition, the portable cooler is fabricated in the shape of a thin pad, and its cooling characteristics are tested and compared with the analytic results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.38-39
• /
• 2005

We have investigated the effect of the pad surface characteristics such as roughness, groove density and wear of pad on within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). We found that WIWNU increases as pad surface roughness($R_{pk}$; Reduced peak height) increases in an early stage of polishing. But after polishing time goes to a certain extent, WIWNU decreases as uniformity of pad surface roughness. Also, groove of pad has effect on relative pad stiffness although original mechanical properties of pad are unchanged by grooving. WIWNU decreases as relative pad stiffness decreases. In addition, conditioning process causes non-uniform wear of pad during in CMP. The profile of pad wear has a significant effect on WIWNU.