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Theoretical Analysis on the Heat and Mass Transfer in a Sorption Cool Pad  

황용신 (한국과학기술연구원 열·유동제어연구센터)
이대영 (한국과학기술연구원 열·유동제어연구센터)
박봉철 (국민대학교 자동차공학 전문대학원)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.16, no.2, 2004 , pp. 167-174 More about this Journal
Abstract
A sorption cool pad brings cooling effect without any pre-cooling, nor any external energy supply. It uses evaporative cooling effect stimulated by the desiccative sorption. In this paper, heat and mass transfer in the sorption cool pad are investigated theoretically. The evaporative cooling process caused by the desiccant is modeled and analyzed considering the sorption characteristics of the desiccant. Two nondimensional parameters are found to dominate the cooling process: one is related to the psychrometric characteristics and the other is to the sorption capacity of the desiccant. The former decides the time to reach the lowest temperature and the later controls the time duration of the cooling effect being sustained.
Keywords
Sorption cooling; Desiccant; Sorption isotherm; Evaporative latent heat; Cool pad;
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  • Reference
1 Evaporative heat transfer characteristics of industrial safety helmets /
[ Liu,X.;Holmer,I. ] / Applid Ergonomics   ScienceOn
2 Conceptual development of a subminiature cooler applying evaporative cooling /
[ Hwang,Y.S.;Lee,D.Y.;Kim,W.S. ] / Proc. of the SAREK '02 Summer Annual Conference
3 Potential of cooling enhancement in an air cooled condenser by evaporative cooling /
[ Lee,D.Y.;Baik,Y.J.;Kim,Y. ] / Proc. of the SAREK '02 Summer Annual Conference
4 /
[ ASHRAE ] / ASHRAE Handbook 2001 Fundamentals
5 A general theory of wet surface heat exchangers and its application to regenerative evaporative cooling /
[ Maclaine-Cross,I.L.;Banks,P.J. ] / ASME J. Heat Transfer
6 Heat tansfer enhancement in an air-cooled heat exchanger by evaporative cooing /
[ Song,C.H.;Lee,D.Y.;Ro,S.T. ] / Int. J. Heat Mass Transfer   ScienceOn
7 Gas-assisted evaporative cooling of high density electronic midules /
[ Bar-Cohen,A.;Sherwood,G.;Hodes,M.;Solbreken,G. ] / IEEE Trans. on Components, Packaging, and Manufacturing Technology   ScienceOn