• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.70-71
• /
• 2005

The material that is both conductive in electricity and transparent to the visible ray is called transparent conducting thin film. It is investigated the performance of ITO-CMP process using commercial silica slurry with the various conditioning temperatures by control of de-ionized water (DIW). Removal rate of ITO thin film was improved after CMP process after pad conditioning at the high temperature by improved exclusion of slurry residues in polishing pad..

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2003.11a
• /
• pp.281-288
• /
• 2003

In this paper, seismic responses of large tilting pad journal bearings which have $3\~5$ tilting pads were numerically analyzed. The turbulent lubrication equation, the energy equation and motion equation were solved at each time step. The regime of operation of this bearing is laminar, turbulent and transitional. Also viscosity of working fluid was considered as function of only temperature and inlet pressure build-up was considered. Numerical results for a large tilting pad journal bearing showed journal center, maximum temperature, maximum pressure, friction torque. The relationship of bearing response and seismic intensity are discussed.

• Proceedings of the SAREK Conference
• /
• 2006.06a
• /
• pp.976-981
• /
• 2006

In case of attaching thermoelectric module and heat source, the polymer pad is attached on the $Al_2O_3$ plate, which is cooling side of thermoelectric module, in order to enhance mechanical safety of the system. It is impossible to calculate the exact distribution of temperature and flow pattern of inner gap of thermoelectric module. Therefore CFD(Computational Fluid Dynamics) analysis was executed to determine the thermo-fluid phenomena and distribution by Fluent. As the result of these analysis, heat transfer was dominated by conduction and the difference of temperature was linear distribution according to the thickness of polymer sheet.

• Journal of the Korean Society of Safety
• /
• v.27 no.2
• /
• pp.7-12
• /
• 2012

This paper describes electrical fire on electric pad caused by defect of hot wires. We analyzed two type electric pad using by carbon type hot wire and magnetic shielded type hot wire. First, a carbon type hot wires electric pad is virtually impossible to connect hot wire as a method of electrical welding or soldering. In order to connect between hot wires, that has to splice carbon type material connector. If junction of hot wires was occurrence of poor connection on electric pad, it increase contact resistance on this junction point. With increasing contact resistance, junction of hot wires on electric pad generates local heating and finally leads to electrical fire. An electric pad using by a magnetic shielded type hot wire happened local heating on signal wire for sensing temperature-rise caused by applying current for magnetic shielded. With increasing local heating of signal wire, insulated coating of hot wire was melted. Finally the magnetic shielded type hot wire electric pad lead to electrical fire with breakdown between signal wire and hot wire. In this paper, we analyzed shape of damage in hot wire caused by electrical local heating and investigated fire cause on electric pad due to defect of hot wires.

• Nuclear Engineering and Technology
• /
• v.16 no.2
• /
• pp.70-79
• /
• 1984

With the help of the nuclear computational system for a large LMFBR (KAERI-26 group cross section library/1DX/2DB), the reactivity coefficients for the diagrid expansion and the pad expansion at the beginning of cycle of the equilibrium core of SUPER-PHENIX I are calculated and reviewed. the core is described using R-Z geometry model, and a two-dimensional multigroup diffusion theory is used. For reference cases, reactivity calculations for radial and axial uniform expansion are performed, and also calculated are reactivity variations due to changes in material density and core volume. The reactivity coefficient for the diagrid expansion is calculated to be -0.553pcm/mil. The temperature coefficient corresponding to the above value is -1.0766pcm/$^{\circ}C$ and is well in accord with the French datum of -1.09pcm/$^{\circ}C$ within 1.2% difference. With the use of 4he calculational method for the diagrid expansion effect, reactivity calculations for the pad expansion bringing about nonuniform expansion are performed, which show that the calculational method is very useful in the analysis of the pad expansion effect. The reactivity coefficients for the pad expansion are calculated to be -0.2743 pcm/mil and -0.2786pcm1mi1 for the averaged expansion model and for the integrated pancake model, respectively. Under the assumption of the free expanding core the temperature reactivity coefficients for each model are obtained to be -0.5766pcm/$^{\circ}C$ and -0.5858pcm/$^{\circ}C$, both of which agree with the French datum of -0.574pcm/$^{\circ}C$ within 2% difference.

• The Transactions of the Korean Institute of Electrical Engineers D
• /
• v.55 no.8
• /
• pp.386-396
• /
• 2006

We implemented the Drug-Pad Moxibustion Method in order to improve the conventional moxibustion therapy. This method is aimed to eliminate burning wounds and smoke, which are the defects of conventional moxibustion therapy. And we performed to verify the efficiency by comparing the Drug-Pad Moxibustion Method with the conventional Indirect Moxibustion Therapy. We measured the body heat and the lasting time of blood circulation improvement using thermography. The moxibustion therapy has two kinds of effects: The formers are pharmacological effects of the Moxa's vasodilators and antioxidants. The latters are thermal effects which cause improvement of the blood circulation. To remove the demerits without omission of above therapeutic effects, we extracted the vasodilators and antioxidant compounds from the Moxa-$CH_2Cl_2$ fraction Moxa-EtOAc and composed the moxibustion kit with $(Ba_{0.8}\;Sr_{0.2})_{0.996}\;Y_{0.004}\;TiO_2+0.5_{WT}\;SiO_2%$ Positive Temperature Coefficients Thermistor. The experimental demonstrations have been made by the stimulating the spot which is CV4(Kwan-Won), CV8(Shin-Guel), CV12(Jung-Wan) acupuncture points of the conception vessel meridian(CV). And stimulating time was one hour. We divided the subjects into 5 groups such as no stimulation group, conventional Indirect Moxibustion group, only Drug-Pad stimulation group, only heat stimulation group, and Drug-Pad Moxibustion group. In the different cases, we have measured the body heat in pre-stimulation, just after stimulation, 2 hours after, and 4 hours after. The body heats of the group who were stimulated by the Drug-Pad Moxibustion Method were increased by over the $2^{\circ}C$. And the body heats of the group who were stimulated by the Indirect Moxibustion Method were increased by average the $1^{\circ}C$. We have evaluated that the Drug-Pad Moxibustion Method is improvement on the conventional Indirect Moxibustion Method by the heat-increasing rate is 200% and the lasting time is 150% with the body heat of the abdominal region. In the conclusions, We have implemented the Drug-Pad Moxibustion Method and evaluated the efficiency of the Drug-Pad Moxibustion Method comparing with the conventional Indirect Moxibustion Method.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.8
• /
• pp.739-744
• /
• 2009

Rail-pad is an important and readily replaceable component of a railway track, as it is the elastic layer between the rail and the sleeper. Characteristics and useful lifetime prediction of rail-pad was very important in design procedure to assure the safety and reliability. In this paper, the degradation of rail pad properties as a function of their in-service life is studied with a view of developing a technique for predicting the optimum period of track maintenance with regard to pad replacement. In order to investigate the useful lifetime, the accelerate test were carried out. Accelerated test results changes as the threshold are used for assessment of the useful life and time to threshold value were plotted against reciprocal of absolute temperature to give the Arrhenius plot. By using the acceleration test, several useful lifetime prediction for rail-pads were proposed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.47-48
• /
• 2007

A CMP Process has many factors that affect result of a polished wafer. Dominant factors are velocity, pressure and temperature in process. A pad profile is also considered as affecting factor of CMP. Accoding to variation of a pad profile, the each pan of a wafer is differently pressured. It appears to affect the uniformity of a wafer. A pad profile varies as a swing arm conditioner which have been ordinarily used in industry. A swing arm conditioner has several sectors in its swing path. This study aims that a wafer get a good uniformity as swing arm conditioner's path on pad is analyzed and simulated. Through the simulation, tendency of pad profile after conditioning will be predicted and the result of simulation compared with the result of experiment. The optimized pad profile would be made by to vary swing arm's velocity on each sector. In order to maintain the optimized profile, conditioner design or swing arm's velocity should be changed and designed.

• Journal of Welding and Joining
• /
• v.16 no.4
• /
• pp.92-97
• /
• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.450-455
• /
• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.