• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.1
• /
• pp.33-38
• /
• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Korean Journal of Acupuncture
• /
• v.40 no.4
• /
• pp.156-168
• /
• 2023

Objectives : This study aimed to determine the status of thermal stimulation devices approved in Korea for medical applications over the past 10 years, and based on this, to obtain insight for future thermal treatment in Korean medical institutions. Methods : We searched the item classification list entitled "Regulations on Medical Device Items and Rating by Item" from the Ministry of Food and Drug Safety Notice No. 2021-24, 2021 (Enforced March 19, 2021; www.mfds.go.kr) for individually licensed heaters using the terms "heat" and "heating". Results : We identified 17 items of thermal stimulation product group, of which 1,308 devices were licensed by February 4, 2022, and 53.2% of them (n=696) were devices with valid permits for distribution in Korea. Among the licensed devices, heating pad systems under/overlay (electric, home use) were approved the most, but combinational stimulator (for medical use, home use; Grade 2) accounted for the highest percentage among the current valid permission. Moxibustion apparatuses were licensed separately for electrical use and non-electrical use, and occupied a low percentage of the total devices. We analyzed 307 devices that were accompanied by technical documents and found that the heat sources were wires in 145 (47.2%), infrared rays in 44 (14.3%) and ultrasonic waves in 42 (13.7%) devices. Most (83.1%) devices were used for pain relief, while other applications included beauty, cancer treatment, maintenance of infant body temperature, and healing fractures. Conclusions : Thermal stimulation devices accounted for about 0.9% of all medical devices, and among them, combinational stimulators and heating pad systems under/overlay had the most valid permits. Thermal stimulation devices using heating wires and infrared rays were the most prevalent, and most were used to relieve pain. In order to develop a range of thermal stimulation devices that can be utilized in Korean medical institutions, it is imperative that they have potential applications beyond pain management, addressing various medical purposes. To achieve this, foundational research is necessary to effectively apply diverse heat sources based on medical objectives.

• Science of Emotion and Sensibility
• /
• v.20 no.2
• /
• pp.171-178
• /
• 2017

'Smart Sensibility Mat (SSM)' was developed and manufactured for positive sensibility of newborn with fiber, digital, and sensibility technology to reflect features and advantages of kangaroo care. For tactile stimuli, the tube of the silicon material to provide a constant temperature of $32^{\circ}C$ was inserted into the mat and connected to the water-thermostat. To provide a uniform temperature throughout the mat, the fabric by the inserting conductive yarn was attached to the mat surface. After wrapping the mat with cotton pad, the polyurethane foam used as medicine in order to similar to the human skin was bonded to the surface of the mat. To provide the auditory stimuli of a level of 30dB with mother's heartbeat sounds and voice recorded in advance, the Bluetooth speaker was inserted into the mat. To investigate the effects of SSM, 10 newborns who born within two weeks were involved in this experiment. While the baby was lying on each of the general mat (GM) and SSM, the baby's physiological signals-heart rate, breathing rate, temperature- were measured and then, those were conducted t-test to examine the difference between the signals of SSM and GM. The results were as follows: heart rate (t=8.131, p<.001) and respiratory rate (t=7.227, p<.001) among the physiological signals of SSM decreased significantly than GM within the normal range. Temperature (t=1.062, p=0.292) at SSM showed a tendency to decrease than GM within the normal range. This means the tactile stimuli and the auditory stimuli providing from SSM give stable physiological responses. Thus, SSM leads to have psychological comfort and stability of newborns.

• Food Science and Preservation
• /
• v.14 no.1
• /
• pp.1-7
• /
• 2007

This study was conducted to determine if chlorine dioxide ($ClO_{2}$) gas might minimize microbial contamination of fresh produce. After exposing grapes to 20 ppm or 40 ppm of chlorine dioxide gas in a closed container, grapes treated with 20 ppm $ClO_{2}$ were packaged in Ny/PE/L-LDPE pouches, stapes treated with 40 ppm $ClO_{2}$ were placed in an empty corrugated box, and untreated control grapes were placed in a box with a sachet containing $ClO_{2}$ gas adsorbed to silica gel (a silica gel pad). The free volume of the sachet material allowed the release of $ClO_{2}$ gas into the headspace of packages containing fresh grapes. Control fruit not exposed to $ClO_{2}$, was placed in a box and stored at either $25^{\circ}C$ or $0^{\circ}C$. Fruit in Ny/PE/L-LDPE film treated with 20 ppm $ClO_{2}$ lost almost no weight during storage at either $25^{\circ}C$ or $0^{\circ}C$. Such fruit had a lower soluble solid content than did other fruit samples. Titratable acidity tended to fall rapidly during storage at either $25^{\circ}C$ or $0^{\circ}C$. Anthocyanin content of grapes decreased over 21 days at $25^{\circ}C$ but increased over 10 weeks at $0^{\circ}C$. The total microbial count of grapes treated with $ClO_{2}$ gas and silica gel pads were lower than controls at $25^{\circ}C$. Fruit treated with 20 ppm $ClO_{2}$ and packaged in Ny/PE/L-LDPE pouches had lower microbial counts than other fruit samples when stored at $0^{\circ}C$. The silica gel pad did not significantly improve total microbial count (compared to untreated control samples) at $0^{\circ}C$. This result may be attributed to a higher rate of diffusion of $ClO_{2}$ gas at room temperature.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.22 no.3
• /
• pp.160-168
• /
• 2021

This study was undertaken to determine the effect of different cooling systems on the performance and hair cortisol of sows under heat stress. During a 21-day experiment, a total of 40 multiparous sows (Landrace×Yorkshire; 242.84±2.89 kg) were allotted to 4 treatments, each with 10 replicates (1 sow per pen). The experimental treatments were CP (Cooling pad), AC (Air conditioner), SC (Snout cooling), and MS (Mist spray). We observed an increase in the average daily feed intake during lactation (p<0.05) in the CP and AC treatment groups. AC treatment had the highest (p<0.05) and SC treatment had the lowest (p<0.05) piglet weight at weaning. During lactation, sows administered SC and MS treatments had higher (p<0.05) hair cortisol accumulation, as compared with the AC and CP treatments. Hair cortisol accumulation in piglets during lactation was highest with MS treatment (p<0.05), and lowest after CP treatment (p<0.05). MS treatment had the highest (p<0.05), and AC treatment had the lowest (p<0.05) respiratory rate and rectal temperature during lactation. In conclusion, our results indicate that a cooling pad and air conditioning cooling system increases the productivity of a sow, as compared to snout cooling and mist spray cooling systems.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.4
• /
• pp.19-25
• /
• 2011

The size reduction of the semiconductor chip and the improvement of the electrical performance have been enabled through the introduction of the Cu/Low-K process in modern electronic industries. However, Cu/Low-K has a disadvantage of the physical properties that is weaker than materials used for existing semiconductor manufacture process. It causes many problems in chip manufacturing and package processes. Especially, the delamination between the Cu layer and the low-K dielectric layer is a main defect after the temperature cycles. Since the Cu/Low-K layer is located on the top of the pad of the flip chip, the stress on the flip chip affects the Cu/Low-K layer directly. Therefore, it is needed to improve the underfill process or materials. Especially, it becomes very important to select the underfill to decrease the stress at the flip-chip and to protect the solder bump. We have solved the delamination problem in a 90 nm Cu/Low-K flip-chip package after the temperature cycle by selecting an appropriate underfill.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.2
• /
• pp.37-45
• /
• 2008

In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip chip assemblies were investigated for the flip chip interconnections on organic substrates with 100 um pitch. After multiple reflows at $250^{\circ}C\;and\;280^{\circ}C$, bump contact resistances were almost same regardless of number of reflows and reflow temperature. In the high temperature storage test, there was no bump contact resistance change at $125^{\circ}C$ up to 2000 hours. However, bump contact resistances slightly increased at $150^{\circ}C$ due to Kirkendall voids formation. In the electromigration test, Cu/SnAg double-bump flip chip assemblies showed no electromigration until about 600 hours due to reduced local current density. Finally, in the thermal cycling test, thermal cycling failure mainly occurred at Si chip/Cu column interface which was found out the highest stress concentration site in the finite element analysis. As a result, Al pad was displaced out under thermal cycling. This failure mode was caused by normal compressive strain acting Cu column bumps along perpendicular direction of a Si chip.

• The Journal of Korean Medicine
• /
• v.27 no.1 s.65
• /
• pp.165-183
• /
• 2006

Objectives : We implemented the Artemisia Extract Moxibustion Method and had the clinical tests for the diabetes with it. Methods : We implemented Artemisia extract made by extracting the vasodilator and antioxidant compounds from Artemisia-CH2C12 fraction and the moxibustion method constructed with DC Power supply, controller, Artemisia pad. single and multiple heating terminal with PTC(Positive Temperature Coefficient) thermistor. And we performed to estimate the efficiency on the questionnaire and the clinical tests with 23 cases of the diabetics. Results : We have estimated the improvement over 60% the symptoms that were the upper and lower limbs pain, frequent urination, spontaneous perspiration, thirst, decrease of body weight, and malaise after the moxibustion treatment on 5 cases among 23 cases. And the 19 cases took the biochemical check-up after the moxibustion treatment. From the results of biochemical check-up, the average HbAlc of before treatment was 8.400%, and after treatment 7.632%. The average HbAlc was decreased significantly after treatment (P<0.001). And the average urinary blood of before treatment was 0.73 and after treatment 0.27. The average urinary blood was decreased significantly after treatment (P<0.001). In addition the average FBS before treatment was 182.64 mg/dl, after treatment 161.77 mg/dl. Conclusions : We could estimate that our proposed moxibustion method was a significant treatment method for the diabetes.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.18 no.10
• /
• pp.817-822
• /
• 2017

The braking system is one of the most important components in vehicles and machines. It must exert a reliable braking force when they are brought to a halt. Generally, frictional heat is generated by converting kinetic energy into heat energy through friction. As the kinetic energy is converted into heat energy, high temperature heat is generated which affects the mechanical behavior of the braking system. Frictional heat affects the thermal expansion and friction coefficient of the brake system. If the temperature is not controlled, the brake performance will be decreased. Therefore, it is important to predict and control the heat generation of the brake. Various numerical analysis studies have been carried out to predict the frictional heat, but they assumed the existence of boundary conditions in the numerical analysis to simulate the frictional heat, because the simulation of frictional heat is difficult and time consuming. The results were based on the assumption that the frictional heat is different from the actual temperature distribution in a rotating brake system. Therefore, the reliability of the cooling effect or thermal stress using the results of these studies is insufficient. In order to overcome these limitations and establish a simulation procedure to predict the frictional heat, this study directly simulates the frictional heat generation by using a thermal-structure coupling element. In this study, we analyzed the thermo-mechanical behavior of a brake model, in order to investigate the thermal characteristics of brake systems by using the Finite Element method (FEM). This study suggests the necessity to directly simulate the frictional heating and it is hoped that it can provide the necessary information for simulations.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.