• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.69-74
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• 2013

In this paper, the impact of integrating large number of I/O (Input-Output) and Core power Delivery Network (PDN) on a 6 layers Flip-Chip Ball Grid Array (FCBGA) package is investigated. The impact of core induced supply noise on high-speed I/O interfaces, and high-speed I/O interface's supply noise coupling to adjacent high-speed I/O interfaces' jitter impact are studied. Concurrent stress validation software is used to induce SSO noise on each individual I/O interfaces; and at the same time; periodic noise is introduced from Core PDN into the I/O PDN domain. In order to have the maximum coupling impact, a prototype package is designed to merge the I/O and Core PDN as one while impact on jitter on each I/O interfaces are investigated. In order to understand the impact of the Core to I/O and I/O to I/O noise, the on-die noise measurements were measured and results were compared with the original PDN where each I/O and Core PDN are standalone and isolated are used as a benchmark.

• Journal of Distribution Science
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• v.21 no.6
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• pp.51-68
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• 2023

Purpose: This study aims to explore the impact of green products' claim skepticism on green purchase intention and further investigates the moderating role of environmental concern in the relationship. This study, by drawing the persuasion knowledge model expected that ambiguity avoidance penalizes less familiar brands than familiar brands. Further, the present study building on Hofstede's cultural dimension, specifically, uncertainty avoidance, undertook a scenario to understand any difference that exist between uncertainty avoidance cultural groups. This study also investigates gender differences in green claim skepticism and proclivity to purchase green products. Research design, data, and methodology: For analyzing the relationship relevant hypotheses were designed, and R-programming software was used. To test the hypotheses two independent sample t-test and regression analysis were carried out. Results: The results suggest that consumers' skepticism toward green claims influenced the intention to purchase eco-friendly products. The study finding also confirms the effect is moderated by environmental concern. Also, the findings of two scenarios reveal that consumers in high uncertainty avoidance culture exhibited a greater level of skepticism for green print advertising and green packaging claims when the brand in the advertising and packaging was unfamiliar than when it was familiar. Conclusions: To alter the negative effect of skepticism the consumer should believe the environmental claims are valid so that they can contribute to solving sustainability issues.

• Journal of the Korea Safety Management & Science
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• v.15 no.1
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• pp.109-120
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• 2013

As information-oriented industry has been developed and electronic devices has come to be smaller, lighter, multifunctional, and high speed, the components used to the devices need to be much high density and should have find pattern due to high integration. Also, diverse reliability problems happen as user environment is getting harsher. For this reasons, establishing and securing products and components reliability comes to key factor in company's competitiveness. It makes accelerated test important to check product reliability in fast way. Out of fine pattern failure modes, failure of Electrochemical Migration(ECM) is kind of degradation of insulation resistance by electro-chemical reaction, which it comes to be accelerated by biased voltage in high temperature and high humidity environment. In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, $20/20{\mu}m$ pattern width/space applied by Semi Additive Process, was performed, and through this test, the investigation of failure mechanism and the life-time prediction evaluation under actual user environment was implemented. The result of accelerated test has been compared and estimated with life distribution and life stress relatively by using Minitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life has been estimated under 95% confidence level of failure data happened in each test conditions. And the life in actual usage environment has been predicted by using generalized Eyring model considering temperature and humidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have been calculated.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.42-45
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• 2018

As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.3
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• pp.195-201
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• 2023

Garlic (Allium sativum)is a major crop in most Asian countries, and its consumption in Asia-Pacific countries exceeds 90% of the global consumption. It contains beneficial ingredients and numerous essential nutrients, such as manganese, vitamin B6, and vitamin B1. Garlic demand is rising not only in Asian countries but also around the world. Particularly, garlic demand has been steadily increasing in European countries, such as Spain, France, Italy, and the American continent. In South Korea, 331,671 tons and 387,671 tons of garlic was produced in 2018 and 2019, respectively, making the country the fifth ranking garlic producer in the world, and the production has been increasing every year. In this study, the study on temperature distribution in cold storage of Korean garlic in folding wire mesh pallet container using CFD (Computational Fluid Dynamics) analysis was performed and Computations were based a commercial simulation software (ANSYS Workbenh Ver. 18.0). Considering the respiration heat of garlic, the decreasing rate of temperature in the area in contact with the cold air was fast due to the inflow of cold air inside, while the decreasing rate of temperature in the center of the pallet was very low. In order to maintain a uniform temperature distribution inside the agricultural product storage pallet in a low-temperature warehouse, it is considered desirable to install an air passageway to allow low-temperature air to flow into the wire mesh pallet.

• Journal of the Ergonomics Society of Korea
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• v.25 no.2
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• pp.85-94
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• 2006

The purpose of this study is to extract typical body shapes of Korean adults based on the three-dimensional Korean anthropometric data measured through 5th national anthropometric survey and to examine the suitability of the 3-D human shape data for the interior packaging. 36 three-dimensional anthropometric variables related to the design of vehicle interior were considered for the appraisal of typical body shapes. Four major factors were extracted by the factor analysis and factor scores were calculated for all subjects. Typical or standard drivers of Korean adults were selected by the minimum deviation criteria for the four factor scores with respect to 5th, 50th, and 95th percentiles, respectively. Typical drivers of Korean adults were visualized by the CATIA-HUMAN program due to the absence of proper application software for three-dimensionally scanned human body data. There are considerable differences between the anthropometric data of Korean adults and those provided by CATIA-HUMAN program, which shows that the modeling data provided by CATIA-HUMAN should not be directly applied to the ergonomic evaluation for the vehicle design. This suggests the necessity for the development of suitable software for scanned human shape data. It is also expected that the anthropometric data of typical drivers extracted from this study help design package layouts and improve the suitability of ergonomic evaluation for Korean customers.

• Journal of IKEEE
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• v.17 no.3
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• pp.221-228
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• 2013

About functional parameters of a LED/UVLED (Light Emitting Diode/Ultra Violet LED), one of the most important parameters is the I-V characteristic. By researching factors affect to the I-V characteristic of uvled, we found that beside of the structure of the device itself, there is the influence of the electrode materials, electrode shapes, the process of wiring and packaging. In this work, we want to improve the performance of UVLED to find out the optimal mask design principles. The study is based on theoretical mathematical models, as well as the use of simulation software tool Comsol. From all results obtained, the team has improved mask design to manufacture electrodes for GaN-based UVLED. Electrode masks are designed by three softwares, which are Intellisuite, Klayout and AutoCad. Intellisuite masks would be used in fabrication simulation while Klayout and AutoCad are used to fabricate electrodes in experiments. As well as, we silmulated the structure of an uvled 355nm emission wavelength by TCAD software, in order to compare with uvled sample that has the same emission wavelength.

• Journal of Sensor Science and Technology
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• v.25 no.2
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• pp.155-159
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• 2016

In this work, we have developed a test system to examine whether the charge indicator of the plug-in hybrid electric vehicle (PHEV) works properly or not. In PHEV, the driver should charge the necessary electricity by plugging in manually and be able to know the charging status through the charge indicator conveniently located for the charging individual. Our system used the CAN bus to transmit the same commands from ECU to the indicator to test the proper operation of the indicator lights. It measured the electric current values during operation and analyzed to determine the quality of the indicators. The inspection items included the proper packaging, the electrical shorts, the LED lighting during charging, the LED lighting for charging failure, and the LED lighting when errors occur. We developed the system for the operators in the factory allowing them to approve the test results at the site. We developed the hardware, the control software, and the software to store the test results and the history of the products in the database. Serial numbers were given to the good quality products and the bar code labels were printed to trace the products afterwards. Through this work, we developed a system to inspect the electric parts in real time upon fabrication. We are planning to further improve our system to inspect the brightness of the indicator by adding the vision inspection in future.

• Journal of Korea Port Economic Association
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• v.21 no.3
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• pp.83-113
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• 2005

In this study, for purpose of searching for measures to lower the logistics costs which is one of the most difficulties for the small-medium sized manufacturers in Pusan and Kimhae, those manufacturers were surveyed with questionnaire about the facts in the export logistics costs, difficulties related to the costs, and measures they thought for lowering the cost. Taking account of findings from the survey, the comprehensive measures of saving the export logistics costs were to be proposed. In the surveyed manufacturers, the problems they thought over export logistics costs lied in short logistics information and transportation-related difficulties in cargo and distribution, insufficient standardization in packaging and the shortage of material handling equipments in unloading. In transportation, frequent non-fulfillment of in-time shipment, cost increase including over consumption of transportation time due to traffic jam, and the biased heavy use of inland transportation were pointed out as problems. In customs clearance, logistics information, and marine insurance, addressed were complexity in custom clearance and bonded transportation procedures, and the shortage of software and hardware to construct logistics information system.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.47-56
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• 2015

In this paper, the Thermal behavior and reliability characteristics of carbon CCL (Copper Claded Layer), which can be used as the core of HDI (High Density Interconnection) PCB (Printed Circuit Board) are evaluated through experiments and numerical analysis using CAE (Computer Aided Engineering) software. For the characterization of the carbon CCL, it is compared with the conventional FR-4 core and Heavy Cu core. From research results, the deformation amount of the flexure strength of PCB is the highest with pitch grade carbon and thermal behavior of PCB is lowest as temperature increases. In addition, TC (Thermal Cycling), LLTS (Liquid-to-Liquid Thermal Shock) and Humidity tests have been applied in the PCB with carbon core and the reliability of PCB with carbon core is confirmed through reliability tests. Also, possibility of uneven surface of the via hole and wear of the drill bit due to the carbon fibers are analyzed. surface of the via hole is uniform, the surface of the drill bit is smooth. Therefore, it is proved that the carbon CCL has the drilling workability of the same level as conventional core material.