• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.37 no.3
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• pp.33-40
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• 2005

In this study, a nano-colloidal silica sol was applied to control the anti-slip property by spraying on kraft paper. Two kinds of nano-colloidal silica sol which have cationic and anionic charge were applied in kraft paper, and the friction and physical strength properties of kraft paper were investigated. The application of colloidal silica sol on wet web in wet-end process by spraying method was tried to improve the friction property and to avoid the general problems of machine contaminations caused by the scattering of sprayed silica particles in dryer part. The physical properties of sheet were also improved by the application of wet web spraying method, and the optimum conditions of wet web spraying operation were closely related with the conditions of pH and electrical charge of wet web and silica sol.

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.221-225
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• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• Journal of Microbiology and Biotechnology
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• v.11 no.2
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• pp.193-198
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• 2001

Preparation of antibacterial biopolymer film which is suitable for food packaging film was investigated using K-carrageenan as a base material. K-Carrageenan showed good biodegradability and film-forming characteristic but poor mechanical properties under humid condition. Also, various bacteria grew well on its surface. The poor mechanical properties could be improved by mixing with alginate at a 1:1 ratio and crosslinking with $CaCl_2$ solution. Antibacterial property coul be provided by modifying the K-carrageenan film surface with acrylic acid plasma followed by ion-exchange with $Ag^+$ ions. Such prepared film still showed good biodegradability by various fongi.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.190-192
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• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• Journal of Welding and Joining
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• v.24 no.2
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• pp.10-16
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• 2006

본 논문에서는 전자 패키징의 고밀도 실장 프로세스와 관련하여 많은 연구와 개발이 이루어지고 있는 무연 솔더의 양산적용시의 문제점 침 도전성 접착제 및 3차원 패키징 기술과 신뢰성 평가방법 등을 개략적으로 소개하였다. 현재 국제적 규약에 의한 무연 솔더의 사용이 의무화되어 가고, 이에 따라 기존 솔더의 전기적 접속성, 열 도전성, 접합성 등의 특성을 확보하기 위한 새로운 재료 및 공정에 대한 연구 및 개발이 필요한 시점이다. 또한 기존의 접합 방법에서의 고집적화 및 미세 피치의 한계를 넘기 위한 3차원 패키징 기술 등이 시도되고 있다. 따라서 신소재 개발 및 공정 변화에 맞는 새로운 신뢰성 평가 방법의 도출도 필요하다. 아울러 국내 대학 및 관련 연구소에서도 국제 경쟁력을 향상시키고 차세대 첨단 산업 분야의 신기술을 확보하고 이를 선도하기 위한 체계적인 연구 활동이 요구된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.3-6
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• 2004

Power semiconductor devices are being compact, high performance and intelligent thanks to recent remarkable developments of silicon design, process and related packaging technologies. Developments of MOS-gate transistors such as MOSFET and IGBT are dominant thanks to their advantages on high speed operation. In conjunction with package technology, silicon technologies such as trench, charge balance and NPT will support future power semiconductors. In addition, wide band gap material such as SiC and GaN are being studies for next generation power semiconductor devices.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.10
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• pp.83-90
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• 2007

The vehicle dynamic control system needs to detect the yaw rate of vehicle and a yaw rate sensor is required as a central component. Therefore, A sensor on the basic of the "tuning fork method" for automotive controls is being developed. The sensor was fabricated by the surface micro machining process to miniaturize its size. The sensor output offset is ${\pm}0.37^{\circ}/sec$ in the room temperature. The resonance frequency of the fabricated yaw rate sensor is measured to 5.29kHz for the drive mode. Tests of the sensor demonstrate that its performance is equivalent to that required for implementation of a yaw control system. Vehicle handling and safety are substantially improved using the sensor to implement yaw control.

• Journal of Distribution Science
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• v.12 no.5
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• pp.33-40
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• 2014

Purpose - This paper aims to review cold chain management, especially in the pharmaceutical industry, to explore the cold chain process of delivering temperature-sensitive pharmaceutical products, and to identify areas for further development. Research design, data, and methodology - The paper, based on literature review and corporate analysis, reviews the development and status of the cold supply chain system, including its important role in the pharmaceutical industry. Results - Logistics in this field requires more stages than are typically needed. Due to the unique characteristics of the market, few companies can provide the services; currently, only few global companies with large networks and high technologies can afford to do so. Expanding pharmaceutical markets to meet global demand will require cold chain development, especially in "pharmerging" markets. Conclusions - Cold chain is a highly sensitive market in terms of products being carried within the chain that itself is a complex system. However, at the same time, it is a niche market with new opportunities. Hence, a sound cold chain infrastructure is needed to satisfy companies, governments, and customers for both commercial and public reasons.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.12
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• pp.9-17
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• 2009