• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.55-60
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• 2012

In order to develop electroless-plated Nickel Phosphate (Ni-P) as a contact material for high efficient low-cost silicon solar cells, we evaluated the effect of ambient thermal annealing on the degradation behavior of interfacial adhesion energy between electroless-plated Ni-P and silicon solar cell wafers by applying 4-point bending test method. Measured interfacial adhesion energies decreased from 14.83 to 10.83 J/$m^2$ after annealing at 300 and $600^{\circ}C$, respectively. The X-ray photoelectron spectroscopy analysis suggested that the bonding interface was degraded by environmental residual oxygen, in which the oxidation inhibit the stable formation of Ni silicide phase between electroless-plated Ni-P and silicon interface.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.15-19
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• 2013

The n-type $Bi_2(Te_{0.9}Se_{0.1})_3$ powders, which were fabricated by melting/grinding method and dispersed with 0.5 vol% $TiO_2$ nanopowders, were hot-pressed in order to investigate the effects of $TiO_2$ dispersion on the thermoelectric properties of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$. Excellent thermoelectric properties such as a maximum figure-of-merit of $2.93{\times}10^{-3}/K$ and a maximum dimensionless figure-of-merit of 1.02 were obtained for the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$. With dispersion of 0.5 vol% $TiO_2$ nanopowders, the maximum figure-of-merit and the maximum dimensionless figure-of-merit decreased to $2.09{\times}10^{-3}/K$ and 0.68, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.9-13
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• 2002

Recently, Organic electroluminescent devices (OELDs) have been demonstrated the medium sized full color display with effective multi-layer thin films. In this study, the multi-layer OELDs were prepared on the patterened ITO (indium tin oxide)/glass substrates by the vacuum thermal evaporation method. The low molecule compounds such as $Alq_3$(trim-(8-hydroxyquinoline)aluminum) and CTM (carrier transfer material) as the electron transport and injection layers as well as TPD (triphenyl-diamine) and CuPc (copper phthalocyanine) as the hole transport and injection layers were used. The luminance was rapidly increased above the threshold voltage of 10 V. The luminance and emission spectrum for the OELDs samples with $A1/CTM/Alq_3$/TPD/1TO structures were found to be 430 cd/$m^2$and 512 nm at 17 V showing green color emission. In contrast, the samples with $Li-A1/Alq_3$/TPD/CuPC/1TO multi-structures showed 508 nm in emission spectrum and 650 cd/$m^2$at 17 V in the luminance. The increment of luminance may be ascribed to the improved efficiency of recombination in the region of the emission layers by the deposition of CuPc as hole injection layer and the low work function of the Li-Al electrode compared to the Al electrode.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.127-132
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• 2019

In this study, barium strontium titanate (BSTO) with high dielectric perovskite structure was synthesized by liquid-solid solution synthesis and the surface was modified using trimethylsilyl chloride (TMCS) as a silylation agent. Silylation surface modification is a method of reacting -OH ligand on the surface of BSTO nanoparticles with Cl in TMCS to generate HCl and replacing the ligand on the surface of nanoparticles with -Si, -CH₃. Silylation was optimized by varying the concentration of TMCS, and the structure of the silicon network was confirmed by Fourier-transform infrared spectroscopy. In addition, the crystallinity of BSTO nanoparticles was confirmed by X-ray diffractometer and the size of the nanoparticles was calculated using Scherrer equation. The field emission scanning electron microscopic image observed the change of the surface-modified BSTO particle size, and the contact angle measurement confirmed the hydrophobic property of the contact angle of 120.9° in the optimized nanoparticles. Finally, the surface-modified BSTO dispersion experiment in de-ionized water confirmed the hydrophobic degree of the nanoparticles.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.33-39
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• 2010

Printing technologies have been indicated as alternative methods for patterning conductive, semi-conductive or insulative materials on account of their low-cost, large-area patternability and pattern flexibility. For application of the printing technologies in manufacture of semiconductor or display modules, ink or paste composed of nanoparticles, solvent and additives are basically needed. Here, we report recent advances in eco-friendly nano-ink technology for semiconductor and display technology. Then, we will introduce an eco-friendly ink formation technology developed in our group with an example of manufacturing $SiO_2$ nanopowders and inks. We tried to manufacture ultrafine $SiO_2$ nanoparticles by applying a low-temperature synthetic method, and then attempted to fabricate the printed $SiO_2$ film onto the glass substrate to see whether the $SiO_2$ nanoparticles are feasible for the printing or not. Finally, the electrical characteristics of the films were measured to investigate the effect of the manufacturing parameters.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.9-17
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• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.49-53
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• 2017

We study on the change of electrical properties of two-dimensional (2D) $SnSe_2$ materials with respect to Cl doping as $SnSe_{1.994}Cl_{0.006}$ under a high temperature condition. (300~450 K) By the simple solid-state reaction method, non-and Cl-doped 2D $SnSe_2$ materials are successfully synthesized with negligible impurities as confirmed by X-ray diffraction. From the temperature dependence of resistivity, it is observed that the conduction mechanism is changed from hopping to degenerate conduction with Cl doping. By Hall effect measurement, an increase on electron carrier concentration from ${\sim}7{\times}10^{16}$ to ${\sim}3{\times}10^{18}cm^{-3}$ with Cl doping verifies that Cl is an effective electron donor which results in the encouraged carrier concentration. Detailed analysis for temperature dependent Hall mobility reveals that the electrical transports in high temperature regime are governed by the grain boundary-controlled mechanism for non-doped $SnSe_2$, which is effectively suppressed by Cl-doping as entering metallic transport regime.

• Korean Journal of Food Science and Technology
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• v.53 no.5
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• pp.634-639
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• 2021

This study investigated the effects of cold plasma (CP) treatment on the properties of biopolymer films prepared with defatted mustard meal (DMM films). CP treatments using N₂, O₂, He, Ar, and dry air did not affect the tensile properties, water vapor permeability, color, and morphology of DMM films, whereas the treatments using He and Ar improved their printability. The tensile strength (TS) of O₂- or air-CP-treated DMM films and the elastic modulus (EM) of O₂-, He-, Ar-, or air-CP-treated films were lower than those of the untreated films. An increase in the power of Ar-CP treatment resulted in an increase in EM. The optimum treatment power and time for minimizing yellowness changes by Ar-CP treatment were 420 W and 40 min, respectively. The results demonstrated the potential application of CP treatment to improve the film properties of DMM films and possibly other agricultural by-product-based biopolymer films, making the films more applicable to food packaging.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.