• 제목/요약/키워드: Packaging machine

검색결과 128건 처리시간 0.023초

국내 포장 폐기물에 따른 재질별 재활용 공정 현황 및 재활용 문제점 (The Current Status of Recycling Process and Problems of Recycling according to the Packaging Waste of Korea)

  • 고의석;심원철;이학래;강욱건;신지현;권오철;김재능
    • 한국포장학회지
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    • 제24권2호
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    • pp.65-71
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    • 2018
  • 생산자 책임 재활용제도(EPR)의 재활용의무대상 품목은 포장재군에 따라 종이팩, 유리병, 금속캔, 합성수지포장재 구분되어질 수 있다. 폐종이팩의 경우 압축된 종이팩을 해리하여 폴리에틸렌 필름 및 기타 이물질을 분리하고 세척, 분쇄, 건조과정을 거쳐 화장지 원단으로 제작한 후 다양한 화장지로 가공 생산하고 있다. 그러나 알루미늄 호일이 첩합된 종이팩은 재활용 공정 중 잔유물이 발생하여 화장지의 품질을 저해하고 제품 편의성을 위해 부착된 마개, 스트로우와 같은 새로운 성형구조의 제품들은 재활용 공정에서 수작업의 과정을 추가하여 재활용 수율을 낮추는 문제점이 있다. 유리병은 재사용과 재활용으로 구분가능하며 재사용은 주류, 음료병들이 대상이고 재활용은 1회용 유리병이나 깨진 유리병을 대상으로 하고 있다. 유리병 재활용은 폐유리병 회수 과정, 이물질 제거, 색상별 분류, 파쇄, 원료화 과정을 거쳐 제병업체에 공급되며, 철금속성분 제거, 저비중 물질 제거 등을 제외하고 대부분 수작업에 의존한다. 유리병은 무색 계열, 갈색 계열, 녹색 계열의 색상이 주를 이루고 있으며 재활용 과정에서 주된 3색 이외의 색상의 경우 재생원료의 품질을 저해시키는 원인이 되고 있다. 합성수지 라벨의 다량 접착제와 병의 직접 인쇄는 잉크의 색상에 의하여 품질저하가 발생하며, 유리병에 사용되는 플라스틱 마개 또한 재활용 공정에서 이물질 제거과정을 어렵게 한다. 금속캔은 자동선별기를 통해서 철캔과 알루미늄캔을 분류한 후 압축하여 용광로를 통해 철, 알루미늄으로 재생산된다. 재활용 공정에서 가공육 알루미늄 캡의 플라스틱 뚜껑은 선별이 어렵기 때문에 플라스틱 뚜껑을 사용하지 않거나 분리 배출할 수 있는 방안이 필요하며 금속캔 또한 금속이 아닌 마개, 라벨이 재활용 공정에서 수작업 공정을 추가로 필요하게 하고 있다. 합성수지 포장재 중 복합재질의 경우 선별된 압축품을 파쇄한 뒤 용융성형을 통한 물질 재활용, 열분해를 통한 유화, 압축성형을 통한 고형연료 제조단계를 통해 재생제품을 생산하며, 단일 합성수지는 자력선별, 풍력선별, 비중선별 등 다양한 방법을 통해 선별공정을 거처 압축, 파쇄, 세척, 용융압출, Pellet 형태의 재생 원료를 만드는 물질 재활용 과정을 거친다. 종이, 금속 라벨, 복합재질 리드 등은 합성수지 재활용에 문제를 발생시키는 요인으로 비중 1미만의 비수분리성 접(참)착식 라벨의 경우가 이에 해당한다. 이 연구를 통해 종이팩, 유리병, 금속캔, 합성수지의 재활용 공정 모두 재활용 대상과 다른 물질의 유입이 재활용공정을 방해하거나 재활용 비용, 시간을 증대시키고 있음을 확인하였다. 각 포장재별로 종이팩 포장재의 스트로우를 비롯한 합성수지 성형구조물과 금속과 유리병 포장재의 이물질을 포함한 라벨과 마개 및 잡자재 그리고 합성수지 포장재의 금속, 종이 복합재질이 이에 해당하였다. 따라서 재활용 산업의 활성화를 위해서는 제품이나 포장재의 설계 단계에서부터 재활용에 용이한 재질 구조가 요구되어지며, 정부차원의 지원과 관련 법 제도 개선이 필요하다.

초음파 플립칩 접합 모듈의 위상최적화 설계 및 성능 실험 (Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging)

  • 김지수;김종민;이수일
    • Journal of Welding and Joining
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    • 제30권6호
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    • pp.113-119
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    • 2012
  • Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

A:V Ratio 변화에 따른 Sn-37Pb, Sn-4.0Ag-0.5Cu Solder 접합부의 특성 연구 (A Study on Characteristics of Sn-37Pb and Sn-4.0Ag-0.5Cu Solder Joints as Various A:V Ratio)

  • 한현주;임석준;문정탁;이진
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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    • pp.67-73
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    • 2001
  • To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

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솔더 인쇄조건 및 외적요소가 인쇄효율에 미치는 영향 (Effect of Solder Printing Conditions and External Factors on Printing Efficiency)

  • 하충수;권혁구
    • 마이크로전자및패키징학회지
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    • 제25권1호
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    • pp.23-28
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    • 2018
  • 최근 4차 산업혁명의 조류 하에 표면 실장 분야에서도 Smart Factory 구현을 위한 노력이 활발히 이루어지고 있다. 표면 실장 분야에서도 이러한 변화와 발 맞추어 많은 연구가 진행되고 있으며, 그중 핵심 공정이라 할 수 있는 솔더 인쇄 공정의 최적화에 대한 방법과 인쇄 효율에 영향을 미치는 인쇄 외적 요소에 대한 영향도를 분석하였다. 이 분석에는 설비에서 제공하는 Big Data를 활용하여 통계적 방법으로 접근하였고, 신뢰성 높은 결과와 함께 시뮬레이션을 통해 결과을 예측할 수 있는 가능성을 확인하였다. 이 연구가 실장 분야의 Smart Factory 구현에 조금이나마 기여가 되었으면 하는 바람이다.

DIMM-in-a-PACKAGE Memory Device Technology for Mobile Applications

  • Crisp, R.
    • 마이크로전자및패키징학회지
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    • 제19권4호
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    • pp.45-50
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    • 2012
  • A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

Furnish Potential for Packaging Papers-Influence on Plant Design and Product Quality

  • Feridun Dormischian;Dietmar Borschke
    • 한국펄프종이공학회:학술대회논문집
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    • 한국펄프종이공학회 2000년도 제26회 펄프종이기술 국제세미나
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    • pp.34-39
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    • 2000
  • Today's size of production operations in the packaging paper sector I sconstantly increasing , featuring integral processing systems, high-speed paper machines, and the increased marketing of lower basis weight products. The risk factors involved in these large investments lie more than ever in the available furnish potential and ongoing requirements for further closure of water loops and lower operating costs. A comparison is drawn between recovered paper furnish mixtures used in European mills with regard to fibre properties, strength potential and contaminant content, Both the furnish situation and development trends in modern fluting and testliner machines are instigating concept changes in stock preparation, the approach flow as well as in process water and rejects technology. Developments are currently focussed for example on more efficient debris separation using fine slotted screening, optimized refining , more systematic process water management with loop separation and integral water clarification as well as more efficient removal of microstickies, fillers and fines through appropriate combination of rejects handling and water clarification processes. Product quality differentiation depends decisively on strength characteristics as a function of refining , fines removal , paper machine technology, and sizing . Maximum availability of today's high speed paper machines and , as a result, cost effective production can be ensured by optimum balancing of all subsystems with in the overall concept and by reliable control of problems with contaminants and deposits.

인공지능 기반의 스마트 센서 기술 개발 동향 (Recent Progress of Smart Sensor Technology Relying on Artificial Intelligence)

  • 신현식;김종웅
    • 마이크로전자및패키징학회지
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    • 제29권3호
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    • pp.1-12
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    • 2022
  • 인공지능 기술의 급속한 발전으로 기존 센서에 인간의 지능과 유사한 기능을 부여하기 위한 연구가 큰 주목을 받고 있다. 기존에는 주로 센서로써의 기초 성능지표, 예를 들어 감도 및 속도 등을 향상시키기 위한 연구가 주로 진행되었지만, 최근에는 분류나 예측 등의 인공지능을 센서에 결합하기 위한 시도가 확대되고 있다. 이를 바탕으로 최근 질병 감지 센서, 모션 감지 센서 및 가스 센서 등 거의 센서 전 분야에서 지능형 센서에 대한 연구 결과가 활발히 보고되고 있다. 본 논문에서는 인공지능의 기본적인 개념, 종류 및 메커니즘과 더불어, 최근 보고된 지능형 센서에의 적용 사례에 대해 알아보고자 한다.

그라비어 인쇄에서의 G7 Calibration 적용에 관한 연구 (A Study on the G7 Calibration Application in Gravure Printing)

  • 장영엽;오성상;조가람;이재수
    • 한국인쇄학회지
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    • 제31권1호
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    • pp.65-78
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    • 2013
  • In gravure printing ink in printed flexible packaging considering the characteristics of the study more accurate color management options and results were as follows. When applying G7 calibration, P2P of the target GRACol G7 evaluate the delta $L^*$ and delta $F^*$, CMY and K-scale average of the results of delta $L^*$ and the highest tolerance G7 average of 1.5 and 3.0 are included in all the best. In addition, the average delta $F^*$ and super delta $F^*$, G7 tolerance by being included within the scope of color management, G7 calibration was possible. Target IT 8.7/4 CMYK, when applied to the calibration G7, Color gravure printing machine is applied to the average of the previous decreased from 12.4 to 3.6. In addition, if a digital proof is EPSON WT 7900 the average color applied to the previous reduction from 5.24 to 0.74 because of the gravure printing color proofing system was effective in the management. G7 calibration by applying the reference print profile of the Epson WT 7900-G-icc, the average was 0.74 coloration, and gravure-G-icc cases, the average color of the 3.60 per GRACol average of all the five colors below were included within the allowable range. Thus, the flexible packaging gravure printing color management of printed after applying the first G7 calibration, the results refer to the press by the profiling, and where best to take advantage of the profile creation was good.

Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials

  • Chung, Myong-Soo;Lee, Wang-Hyun;You, Young-Sun;Kim, Hye-Young;Park, Ki-Moon;Lee, Sun-Young
    • Food Science and Biotechnology
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    • 제15권1호
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    • pp.5-12
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    • 2006
  • Degradation performance of environmentally friendly plastics that can be disintegrated by combination of sunlight, microbes in soil, and heat produced in landfills was evaluated for use in industries. Two multi-degradable master batches (MCC-101 and MCC-102 were manufactured, separately mixed with polyethylene using film molding machine to produce 0.025 mm thick films, and exposed to sunlight, microbes, and heat. Low- and high-density polyethylene (LDPE and HDPE) films containing MCC-101 and MCC-102 became unfunctional by increasing severe cleavage at the surface and showed high reduction in elongation after 40 days of exposure to ultraviolet light. LDPE and HDPE films showed significant physical degradation after 100 and 120 days, respectively, of incubation at $68{\pm}2^{\circ}C$. SEM images of films cultured in mixed mold spore suspension at $30^{\circ}C$ and 85% humidity for 30 days revealed accelerated biodegradation on film surfaces by the action of microbes. LDPE films containing MCC-l01 showed absorption of carbonyls, photo-sensitive sites, at $1710\;cm${-1}$ when exposed to light for 40 days, whereas those not exposed to ultraviolet light showed no absorption at the same frequency. MCC-101-based LDPE films showed much lower $M_w$ distribution after exposure to UV than its counterpart, due to agents accelerating photo-degradation contained in MCC-101.

고기능성 생활용기 성형을 위한 대용량 스택금형 개발 (Development of large-capacity stack mold for the high-performance household case)

  • 신장순;김유진;정귀재;황순환;허영무;윤길상;정우철;서태일
    • Design & Manufacturing
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    • 제2권3호
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    • pp.28-31
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    • 2008
  • In recent, the demand of high-productivity injection mold is increased because of the growth of international packaging market which is induced by an increase of population. The increase of productivity leads to the large-capacity injection molding machine and peripheral devices. For solving this problem, the stack mold which is based on the exsiting machine and device has researched in advanced countries actively. In this paper, as the preliminary research of stack mold development, the stack mold which has 2 level ${\times}4$ cavity was designed and fabricated. Besides, the motion and structural analysis were performed to verify the stability of developed stack mold.

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