• 한국포장학회지
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• 제22권3호
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• pp.107-117
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• 2016

In order to reduce packaging and logistics costs for any business, it is important to identify opportunities for improvement throughout an entire logistics system including measurement of the performance and cost of packaging. Although the importance of packaging in a supply chain has been recognized by many scholars and experts, the total cost and value of packaging have not been successfully estimated. This paper reviews the recent researches and articles that tried to quantify the value of packaging focusing on the business decision between reusable and expendable shipping container systems. Three key factors such as cost, ownership, and standardization are identified and discussed in terms of impact on supply chain costs and performances. It is important to understand that the decision of a package system can change a logistics activities and even entire logistical system. Hence, the total cost and value of transport packaging should be calculated with understanding of interactions with logistical activities throughout supply chain. Identifying the opportunities and constraints of packaging changes on total logistics cost and activities must be carefully examined before implementation of a packaging system.

• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.49-52
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• 2001

This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.155-162
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• 1999

A bare chip packaging technology by an encapsulated flip chip bonding on a build-up printed circuit board has emerged in 1991. Since then, it enabled a high density and low cost semiconductor packaging such as a direct chip bonding on mother board and high density surface mount components, such as BGA and CSP. This technology can respond to various requirements from applications and is considered to take over a main role of semiconductor packaging in the next decade.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.1-7
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• 2001

This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

• 월간포장계
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• 통권362호
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• pp.75-82
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• 2023

• 한국포장학회지
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• 제10권1호
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• pp.27-36
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• 2004

Software summarized packaging technology related is needed for low cost and high efficiency in production and packaging design of corrugated board, and in development of these softwares, distribution and packaging environment of one's country must be reflected, well. In domestic occasion, software related to corrugated board packaging dont's exist nearly, and in many industrial fields, the more higher role and importance of packaging in various industrial field is, the more higher necessity of that is. In this study, on the base of preceeding studies (Park, 2001; 2003; 2003), software to optimize board combination that is most importance and sensitivity in composition of cost elements in production and packaging design of corrugated board was developed. This software was composed of input module, output module, database and management module, and calculation module, and efficiency of this software was analyzed on the both sides of sensitivity in design result and effectiveness in a case analyse. In the inward design results having same strength, board combination balance, bursting strength, box weight, and cost were greatly different. Therefore, optimum inward design according to user's design specifications is possible, and in a case analysis for actual products, obtained the more profitable results than before design.

• 한국IT서비스학회지
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• 제11권2호
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• pp.275-289
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• 2012

Although the specification of packaging box is one of the most important process to be considered before deciding cost in terms of production and logistics, there are no efficient services in our country at this time as such the making decision only through the empirical knowledge. In this research, we have developed the packaging specification design system based on the web online packaging IT service. The developed system was advanced from the existing-inefficient process of deciding the specification of packaging box, and which can decide the specification of packaging box considering the efficiency of logistics through use of IT based tool. Therefore, this study shows applied cases of normalized packaging process through the obtained packaging design simulation program. The packaging specification design system can provide the simulation and user interface. Those could calculate the specification of packaging box(packaging box size, packaging box quantity, packaging box pattern, packaging compressive strength, packaging cost etc.) considering the efficiency of logistics.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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• pp.7-38
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• 2000

Performance, reliability, form factor drive flip chip use. BGAs and CSPs will provide stepping stone to FC DCA .Growing vendor infrastructure - Low cost, high density organic substrates -New generations of fluxes and underfills .Adhesives flip chip technology as a low cost flip chip alternatives -Low cost Au stud or Electroless Ni bumps -Reliable thermal cycling and electrical performance.

• 한국포장학회지
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• 제6권1호
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• pp.12-18
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• 2000

If optimum design technique is applied in the design of packaging container for bulk materials, merits on the side of not only economic and compression performance but distribution efficiency are expected. In this study, on the ground of the optimum models for required board area and compression strength performance, optimum design program having faculties of outward and inward optimum design and information design was developed. This program was composed of input module, output module, database and management module, and calculation module. Though the packaging specifications ars same, requied board area, board composition and cost of container were greatly different according to exterior packaging conditions. Also, about 12% in weight of container was lighter, and about $13{\sim}17%$ in cost of container was reduced when the program was applied for 2 kinds of bulk materials.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 The IMAPS-Korea Workshop 2000 Emerging Technology on Packaging
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• pp.55-85
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• 2000

MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.