• Journal of Information Technology Services
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• v.11 no.2
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• pp.275-289
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• 2012

Although the specification of packaging box is one of the most important process to be considered before deciding cost in terms of production and logistics, there are no efficient services in our country at this time as such the making decision only through the empirical knowledge. In this research, we have developed the packaging specification design system based on the web online packaging IT service. The developed system was advanced from the existing-inefficient process of deciding the specification of packaging box, and which can decide the specification of packaging box considering the efficiency of logistics through use of IT based tool. Therefore, this study shows applied cases of normalized packaging process through the obtained packaging design simulation program. The packaging specification design system can provide the simulation and user interface. Those could calculate the specification of packaging box(packaging box size, packaging box quantity, packaging box pattern, packaging compressive strength, packaging cost etc.) considering the efficiency of logistics.

• The monthly packaging world
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• s.147
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• pp.72-75
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• 2005

• Journal of Biosystems Engineering
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• v.35 no.5
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• pp.323-329
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• 2010

Physical damages on fruits may be caused by shock and vibration inputs that transmitted from the transporting vehicle through the packaging and cushioning materials to the fruit. In this study, both half sine shock test and trapezoidal shock test were performed by MIL-STD-810F specification in order to investigate and represent the shock response properties such as peak acceleration and shock amplification factors of the pear according to packaging and cushioning materials for optimal packaging design during transportation. Shock excitation data that had been measured on the vehicle operating on the real road were used. Shock response properties measured by half sine shock test were smaller than those measured by trapezoidal shock test. Results represent that corrugation shapes and thickness can significantly affect the cushioning performance than the paper configurations of cushioning pad and showed that fruits may be damaged seriously while transported on the unpaved road without the properly cushioned packaging practices.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.27-33
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• 2010

We have successfully demonstrated a high-pin-count and thin embedded-LSI package to realize next generation's mobile terminals. The following three design key points were applied: (i) Using Cu posts, (ii) Using the coreless structure, (iii) Using a Cu plate as the ground plane. In order to quantitatively determine the contribution of the three points, the five-stage process for reducing the number of metal layers is described by means of the electrical simulation. The point-(i) and (ii) are effective from the viewpoint of the power integrity (PI); that is, these points play important roles in reducing the number of metal layers, and especially the point-(ii) contributes at least twice as the point-(i). The point-(iii) is not effective in the PI, but has a few effects on the signal integrity (SI). For reducing the number of metal layers, we should, at first, pay attention whether the PI characteristics fulfill the specification, and then we should confirm the SI characteristics.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.1-7
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• 1999

A single RF transceiver evaluation board have been developed for the purpose of application to the 900MHz band transceiver contained RF-IC chip And environment test was evaluated. The RF-IC chipset includes LNA(Low Noise Amplifier), down-conversion mixer, AGC(Automatic Gain Controller), switched capacitor filter and down sampling mixer. The RF evaluation board for the testing of chipset contained various external matching circuits, filters such as RF/IF SAW(Surface Acoustic Wave) filter and duplexer and power supply circuits. With the range of 2.7~3.3V the operated chip revealed moderate power consumption of 42mA. The chip was well operated at the receiving frequency of 925~960MHz. Measurement result is similar to general RF receiving specification of the 900MHz digital mobile phone.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.481-485
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• 2000

A new type of compliant press-fit pin has been developed and evaluated for use packaging of electronic telecommunications equipments. Main requirements for design are defined the upper limit of pin insertion force and the lower limit of pin retention force. Upper limit of pin insertion force is set to protect the copper plate of the inner PTH wall. Lower limit of pin retention force is set to satisfy a wire-wrapping specification. Results are represented by insertion force and retention force variations according to the front angle, rear angle and material, etc.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.2 no.1
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• pp.37-49
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• 2008

At the present time the task of designing a highly integrated ZigBee radio frequency (RF) receiver with an excellent coexistence performance is still very demanding and challenging. This paper presents a number of system issues and design considerations for a ZigBee RF receiver, namely IEEE 802.15.4, for coexistence with wireless devices in the 2.4-GHz ISM-band. With regard to IEEE 802.15.4, the paper analyzes receiver performance requirements for; system noise figure (NF), system third-order intercept point (system-IIP3), local oscillator phase noise and selectivity. Based on some assumptions, the paper illustrates the relationship between minimum detectable signal (MDS) and various situations that involve the effects of electromagnetic interference generated by other wireless devices. We infer the necessity of much more stringent specification requirements than the published standard for various wireless communication field environments

• Journal of the Korean Society for Precision Engineering
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• v.30 no.9
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• pp.893-899
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• 2013

Recently, the requirement of automation in the cell production system is increasing due to a decrease of skilled workers who are the key point of a cell production system. This paper proposes a dual-arm robot designed and implemented with consideration of being applied to a cell production line of cellular phone. A specification was derived from the analysis of production process and the consideration of configuration for human-robot cooperation. Design and implementation results of the proposed dual-arm robot were suggested and the feasibility was verified through the demonstration of the proposed robot in some of packaging job of cellular phone.

• Journal of Distribution Science
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• v.13 no.7
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• pp.41-51
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• 2015

Purpose - This study analyzes loading efficiency by loading pattern for package standardization and reduction of logistics costs, along with the creation of revenue for the revenue review panel (RRP) of Membership Wholesale Clubs (MWC). The study aims to identify standard dimensions that can help improve the compatibility of the pallets related to display patterns preferred by the MWC and thereby explore ways to enhance logistics efficiency between manufacturers and retailers through standardization. Research design, data, and methodology - The study investigates and analyzes the current status based on actual case examples, i.e., manufacturer A and Korea's MWC (A company, B company, and C company), and thus devises improvement measures. To achieve this, the case of manufacturer A delivering to MWC was examined, and the actual pallet display patterns for each MWC were investigated by visiting each distribution site. In this study, TOPS (Total Optimization Packaging Software, USA) was used as the tool for pallet loading efficiency simulations the maximum allowable dimension was set to 0.0mm to prevent the pallet from falling outside the parameters, and the loading efficiency was analyzed with the pallet area. In other words, the study focused on dimensions (length x width x height) according to the research purpose and thereby deduced results. Results - The analysis of pallet loading patterns showed that the most preferred loading patterns for loading efficiency according to product specification, such as pinwheel, brick, and block patterns, were used in the case of the general distribution products, but the products were configured with block patterns in most cases when delivered to MWCs. The loading efficiency by loading pattern was analyzed with respect to 104 nationally listed standard dimensions. Meanwhile, No.51 (330 × 220mm) of KS T 1002 (1,100 × 1,100mm) was found to be the dimension that could bring about an improved loading efficiency, over 90.0% simultaneously in both the T-11 and T-12 pallet systems in a loading pattern configuration with the block pattern only, and the loading efficiency simulation results also confirmed this as the standard dimension that can be commonly applied to both the T-11 pallet (90.0%) and the T-12 pallet (90.7%) systems. Conclusions - The loading efficiency simulation results by loading pattern were analyzed: For the T-11 pallet system, 17 standard dimension sizes displayed the loading efficiency of 90.0% or more as block patterns, and the loading capacity was an average of 99.0%. For the T-12 pallet system, 35 standard dimension sizes displayed the loading efficiency of more than 90% as block patterns (the average loading efficiency of 98.6%). Accordingly, this study proposes that the standard dimensions of 17 sizes with the average loading efficiency of 99.0% should be applied in the use of the T-11 pallet system, and those of 35 sizes with the average loading efficiency of 98.6% should be reviewed and applied in the use of the T-12 pallet system.