• 제목/요약/키워드: Package-on-package

검색결과 4,334건 처리시간 0.027초

플라스틱 IC 패키지의 습열 파괴 해석 (Hygrothermal Cracking Analysis of Plastic IC Package)

  • 이강용;양지혁
    • 한국정밀공학회지
    • /
    • 제15권1호
    • /
    • pp.51-59
    • /
    • 1998
  • The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

  • PDF

Structural Evaluation on the Impact of a Radioisotope Package

  • Chung, Sung-Hwan;Lee, Heung-Young;Ku, Jeong-Hoe;Seo, Ki-Seog;Han, Hyun-Soo
    • Nuclear Engineering and Technology
    • /
    • 제30권5호
    • /
    • pp.462-469
    • /
    • 1998
  • A package to transport high-level radioactive materials is required to withstand normal transport and hypothetical accident conditions pursuant to the IAEA and domestic regulations. The package should maintain the structural safety not to release radioactive material in any condition. The structural safety of the package has been evaluated by tests using proto-type or scaled-down models, however, the method by analysis is gradually utilized due to recent advancement of computers and computer codes. In this paper, to evaluate the structural safety of a radioisotope package of the KAERI, the three dimensional impact analyses under 9m free drop and 1m puncture were performed with an explicit finite-element code, the LS-DYNA3D code. The maximum stress intensity on each part was calculated and the structural safety of the package was evaluated in accordance with the regulations.

  • PDF

RN-BSN 학생을 위한 문제중심학습(Problem-Based Learning) 패키지 개발 - 임신, 분만, 산욕여성의 상황을 중심으로 - (Development of a Problem-based Learning Package for RN-BSN Students - Based on the Cases of Women during Pregnancy, Childbirth and Postpartum -)

  • 송영아;신혜숙
    • 여성건강간호학회지
    • /
    • 제11권2호
    • /
    • pp.99-109
    • /
    • 2005
  • Purpose: The purpose of this study is to present a procedure for developing a PBL package and to provide the example of its application. Method: In this study, the PBL package was proposed based on the integrated curricular under maternity nursing. The PBL package model proposed by Little was applied to this study. Result: The procedure for developing the PBL package includes course objectives, learning objectives, concept mapping, situation scenario, tutor guide, and evaluation method. Clinical scenarios used in 3 PBL packages were composed of a pregnant women, a childbirth women, and a postpartum women. The Eight detailed steps are given in this study. Conclusion: Through these findings, the steps might be easier and more useful for nurse professionals to begin using the PBL package in maternity nursing. In addition, the steps will actively contribute to imply the PBL in nursing education.

  • PDF

박형 기판을 사용한 Package-on-Package용 상부 패키지와 하부 패키지의 Warpage 분석 (Warpage Analysis for Top and Bottom Packages of Package-on-Package Processed with Thin Substrates)

  • 박동현;신수진;안석근;오태성
    • 마이크로전자및패키징학회지
    • /
    • 제22권2호
    • /
    • pp.61-68
    • /
    • 2015
  • 박형 package-on-package의 상부 패키지와 하부 패키지에 대하여 에폭시 몰딩 컴파운드(EMC)에 따른 warpage 특성을 분석하였다. 또한 동일한 EMC로 몰딩한 패키지들의 warpage 편차를 측정하고 박형 상부 기판과 하부 기판 자체의 warpage 편차를 측정함으로서, 박형 패키지에서 warpage 편차를 유발하는 원인을 분석하였다. 박형 기판을 사용한 상부 및 하부 패키지에서는 기판 자체의 큰 warpage 편차에 기인하여 EMC의 물성이 패키지의 warpage에 미치는 영향을 규명하는 것이 어려웠다. EMC의 몰딩 면적이 $13mm{\times}13mm$로 기판($14mm{\times}14mm$)의 대부분을 차지하는 상부 패키지에서는 온도에 따른 warpage의 변화 거동이 유사하였다. 반면에 EMC의 몰딩 면적이 $8mm{\times}8mm$인 하부 패키지의 경우에는 (+) warpage와 (-) warpage가 한 시편에 모두 존재하는 복합적인 warpage 거동에 기인하여 동일한 EMC로 몰딩한 패키지들에서도 상이한 온도-warpage 거동이 측정되었다.

Who Are Domestic Travel Agency Users and Who Buys Full Package Trips? A Study of Korean Outbound Travelers

  • AHN, Young-Joo;LEE, Seul Ki;AHN, Yoon-Young
    • The Journal of Asian Finance, Economics and Business
    • /
    • 제6권4호
    • /
    • pp.147-158
    • /
    • 2019
  • The purpose of this study is to identify differences based on demographic characteristics and travel-related characteristics: first, whether travelers used a domestic travel agency and second whether travelers purchased a full-package travel program. A sample selection probit model was used to provide simultaneous evaluation of the different characteristics of outbound travelers. The present study investigates how tourists make decisions based on two travel-pattern choices. It then goes on to explore the characteristics of outbound travelers from South Korea. The data is drawn from a nationwide survey in South Korea, and a total of 859 surveys were used for analysis. Due to the interdependent nature of the choices, a sample selection probit model was used to estimate outbound tourists' use of domestic travel agency and purchase of full travel package. Significant determinants of domestic travel agency use are identified as age, gender, marital status, party size, children, length of travel, and travel distance, while those of full travel package purchase are age, marital status, and travel purpose. Estimated results provide manifestations of differing travel needs of outbound travelers. the results of this study demonstrate differences between travel-agency users and full-package travel-program consumers and provide determinants that affect the purchase of full-package travel.

한·중 저가 화장품 콘텐츠의 패키지 디자인요소 비교 분석 (Comparison Analysis on Package Design Elements of Low-Price Cosmetic Contents in Korea and China)

  • 왕소혜;박영심;김치용;이창근
    • 한국멀티미디어학회논문지
    • /
    • 제19권8호
    • /
    • pp.1553-1563
    • /
    • 2016
  • Thesedays, not only a quality of a product but also a design of it plays an important role. Throughout this analysis, I would like to discuss how a design of package works in the cosmetics with the fact that low cost cosmetics sales better than high cost cosmetics. In this research, there are five samples each for Korean and Chinese low-costed cosmetics to yield a result about an element of package design. Based on that result, there was an survey about two different package design followed by the research problems. Throughout research, an attention and familiarity of package which was considered of characteristics of China was more effective on Chinese consumers. In order to activate the content market of cosmetics, it is utilized to manufacture taking into account the maximum of the design elements in the package design is a conclusion that affect the time of purchase. In this paper, one in which I hope to help in the development of being utilized as a basis article content market industry for pre-market research foray into the Chinese market is South Korean cosmetics.

시선추적장치를 활용한 라면 패키지 디자인의 시각적 요소에 대한 시각적 주의집중도 분석 (Analysis of Visual Attention on Visual Elements of Ramen Package Design using Eye-Tracking Device)

  • 박민희;권만우;황미경;김현성
    • 한국멀티미디어학회논문지
    • /
    • 제25권7호
    • /
    • pp.945-952
    • /
    • 2022
  • In a market situation full of brands and products, packaging requires a differentiated design that reflects the needs and trends of the times, as well as the characteristics of the product. Therefore, in this study, through literature reviews, market research methods, questionnaire surveys, eye-tracking experiments, etc., we derived related research and current status of ramen package design, and visual expression elements that induce consumers' subjective perception and interest. As a result, the ramen package design was generally simplified and tended to visualize the spicy taste. Second, consumers buy bag ramen once a week on average at a large discount mart, consider the color of the ramen package design as important, and recognize that the aesthetics of the package design can improve quality. Finally, the spicy phrases and ramen illustrations were the first visual elements of the ramen package design, and for the longest time, attention was focused on the brand name.

오픈소스 소프트웨어를 활용한 자연어 처리 패키지 제작에 관한 연구 (Research on Natural Language Processing Package using Open Source Software)

  • 이종화;이현규
    • 한국정보시스템학회지:정보시스템연구
    • /
    • 제25권4호
    • /
    • pp.121-139
    • /
    • 2016
  • Purpose In this study, we propose the special purposed R package named ""new_Noun()" to process nonstandard texts appeared in various social networks. As the Big data is getting interested, R - analysis tool and open source software is also getting more attention in many fields. Design/methodology/approach With more than 9,000 R packages, R provides a user-friendly functions of a variety of data mining, social network analysis and simulation functions such as statistical analysis, classification, prediction, clustering and association analysis. Especially, "KoNLP" - natural language processing package for Korean language - has reduced the time and effort of many researchers. However, as the social data increases, the informal expressions of Hangeul (Korean character) such as emoticons, informal terms and symbols make the difficulties increase in natural language processing. Findings In this study, to solve the these difficulties, special algorithms that upgrade existing open source natural language processing package have been researched. By utilizing the "KoNLP" package and analyzing the main functions in noun extracting command, we developed a new integrated noun processing package "new_Noun()" function to extract nouns which improves more than 29.1% compared with existing package.

낙하충격해석을 통한 대형 전자제품의 완충포장재 최적설계 (Optimal Design for Cushioning Package of a Heavy Electronic Product Using Mechanical Drop Analysis)

  • 금대현;김원진;김성대;박상후
    • 한국소음진동공학회논문집
    • /
    • 제14권2호
    • /
    • pp.128-135
    • /
    • 2004
  • Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 %.

리플로 납땜 공정에서 플라스틱 IC 패키지의 습기 및 열로 인한 파손문제 해석 (Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process)

  • 이강용;이택성;이경섭
    • 대한기계학회논문집A
    • /
    • 제20권4호
    • /
    • pp.1347-1355
    • /
    • 1996
  • The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.