• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.3-7
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• 2000

In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.

• 펄프종이기술
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• 제39권2호
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• pp.68-77
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• 2007

It is necessary to recognize philosophical and scientific depth, contained in traditional culture in a correct fashion, in order to succeed and develop our excellent traditional culture. Some studies on storage, circulation, and package design of traditional food will multiple the added value of traditional culture. So this research was carried out for making packing cases of kinds of Korean dried confectionery using Hanji by traditional manufacturing method, Hanji textile, charcoal Hanji and jade Hanji, and for developing environmental-friendly Korean dried confectionery package as more luxurious packaging papers by putting an exterior design on the surface. The results measured physical properties, air permeability and anti-mold activity of Hanji, and designing Korean dried confectionery are as follows. The physical properties and air permeability used to manufacture Korean dried confectionery package, turned out to be no affection to the food packaging Hanji. In order to avoid the monotonousness of Korean dried confectionery package, it was designed with Hanji textile together with elegant traditional pattern. It is estimated to increase the value of Korean dried food and to make the anti-mold activity of Hanji added charcoal and jade effective. In conclusion, by developing individual properties of traditional food and proper packaging paper as well as packaging design according to circulating situation, it is considered that the taste and the fancy can be maximized. After all, by applying excellent traits contained in our race's culture, it is possible to develop the package cases into competitive ones. And it would be able to increase utilization of Hanji. Namely, production of high quality traditional food package with Hanji is expected for new valuable industry of Hanji.

• 한국융합학회논문지
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• 제13권4호
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• pp.271-278
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• 2022

탄산음료는 우리 생활 속에서 인기가 높은 음료의 일종으로 젊은 층을 중심으로 판매되고 있다. 현재 판매되고 있는 탄산음료는 브랜드가 많고, 대부분 식감의 구분이 강조되고 있으며, 브랜드 이미지와 패키지에 있어 전체적으로 패키지 디자인을 더욱 상업화하였다. 탄산음료 패키지 디자인의 감성경험을 증가시키는 것이 필요하며, 이는 브랜드의 부가가치를 높일 수 있다. 감성은 인간의 가장 보편적인 심리 경험으로써 사물에 대한 주관적인 경험과 느낌이다. 탄산음료의 패키지 디자인에 감성경험의 접목하기를 통해, 탄산음료를 구매하면서 보다 많은 감성적 사용자 경험을 선사해 제품 패키지 디자인의 다양화를 실현하고, 소비자의 감성적 욕구를 충족스키는 것이다. 본 논문은 우선, 탄산음료의 패키지 디자인에 대한 논문을 고찰하고, 시판 중인 탄산음료의 판매 현황에 대한 조사와 패키지 디자인 분석하고, 설문조사를 실시한다. 연구결과, 패키지 디자인을 통해 감성을 경감할 수 있다는 점을 알아냈다. 본 연구가 앞으로 패키지 디자인의 감성경험 향상에 있어 시사점이 되기를 바란다.

• 한국정보처리학회논문지
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• 제7권9호
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• pp.2783-2796
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• 2000

전자상거래 시스템에서 패키지 상품의 구매가 이루어지기 위해서는 패키지 상품을 구성하는 상품들이 구비되어 있어야 할뿐만 아니라 충분한 수량이 확보되어 있어야만 구매자의 요구가 있을 때 이를 실시간으로 처리할 수 있게 된다. 그리고 다수의 사용자가 동시에 가상쇼핑몰에 접근하여 패키지 상품을 구매하고자 할 때에도 상품에 대한 동시성 제어가 효율적으로 이루어져야만 한다. 본 논문에서는 고정형 패키지와 맞춤형 패키지상품 구매 시 상품선택과 구매가 효율적으로 이루어지도록 하기 위해서 모든 상품에 대한 실 수량과 판매가능 수량정보를 유지토록 함으로써 구매자의 요구를 실시간으로 처리할 수 있도록 하였고, 트랜잭션의 처리율이 향상되도록 하였다. 그리고 트랜잭션의 동시성 제어를 효율적으로 하기 위해서 잠금을 기반으로 한 동시성제어 알고리즘을 제시하였다.

• 반도체디스플레이기술학회지
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• 제6권1호
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• 비파괴검사학회지
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• 제12권4호
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• pp.18-25
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• 1993

This paper is to aim the microdefect evaluation of If package into a quantitative from NDI's image processing of ultrasonic wave. (1) Automatically repeated discrimination analysis method can be devided in the category of all kind of defects on IC package, and also can be possible to have a sampling of partial delamination. (2) It is possible that the information of edge section in silicon chip surrounding can be extractor by the partial image processing of IC package. Also, the crack detection is possible between the resin part and lead frame.

• 한국정밀공학회지
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• 제1권3호
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• pp.52-70
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• 1984

This paper presents a micro-computer simulation package for the various vibratory systems. The Package consists of 10 programs which describe the dynamical characteristics of the vibratory system. The programs have been written in BASIC (Appoesoft) language and programmed on the 6502 CPU with 48 KRAM. This simulation package is stored in 5 $^1/_4$ inch floppy disk. The user requires no simulation expertise on the part of designer. Through a process of disk operation, the user can easily under- stand how to use this package.

• Journal of Mechanical Science and Technology
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• 제18권9호
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• pp.1572-1581
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• 2004

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 D
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• pp.2897-2899
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAR, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering Problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.49-55
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• 2016

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.