• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.3-7
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• 2000

In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.39 no.2 s.120
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• pp.68-77
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• 2007

It is necessary to recognize philosophical and scientific depth, contained in traditional culture in a correct fashion, in order to succeed and develop our excellent traditional culture. Some studies on storage, circulation, and package design of traditional food will multiple the added value of traditional culture. So this research was carried out for making packing cases of kinds of Korean dried confectionery using Hanji by traditional manufacturing method, Hanji textile, charcoal Hanji and jade Hanji, and for developing environmental-friendly Korean dried confectionery package as more luxurious packaging papers by putting an exterior design on the surface. The results measured physical properties, air permeability and anti-mold activity of Hanji, and designing Korean dried confectionery are as follows. The physical properties and air permeability used to manufacture Korean dried confectionery package, turned out to be no affection to the food packaging Hanji. In order to avoid the monotonousness of Korean dried confectionery package, it was designed with Hanji textile together with elegant traditional pattern. It is estimated to increase the value of Korean dried food and to make the anti-mold activity of Hanji added charcoal and jade effective. In conclusion, by developing individual properties of traditional food and proper packaging paper as well as packaging design according to circulating situation, it is considered that the taste and the fancy can be maximized. After all, by applying excellent traits contained in our race's culture, it is possible to develop the package cases into competitive ones. And it would be able to increase utilization of Hanji. Namely, production of high quality traditional food package with Hanji is expected for new valuable industry of Hanji.

• Journal of the Korea Convergence Society
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• v.13 no.4
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• pp.271-278
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• 2022

Carbonated drinks are a kind of drink that is popular in our daily lives and are sold mainly among young people. There are many brands of carbonated drinks currently on sale, and most of them emphasize the distinction of texture, and brand images and packages have further commercialized package design as a whole. It is necessary to increase the emotional experience of soda package design, which can increase the added value of the brand. Sensibility is the most common psychological experience in humans and is the subjective experience and feeling of things. By combining the emotional experience with the package design of carbonated drinks, it provides more emotional user experience while purchasing carbonated drinks, realizing diversification of product package designs and satisfying consumers' emotional needs. This paper first examines the package design of carbonated drinks, I hope it will be an implication if you increase the emotional experience of soda package design.

• The Transactions of the Korea Information Processing Society
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• v.7 no.9
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• pp.2783-2796
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• 2000

In electronic commerce systems, for the purchase of package goods to be processed in realtime, the stock of their components has to be

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.4
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• pp.18-25
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• 1993

This paper is to aim the microdefect evaluation of If package into a quantitative from NDI's image processing of ultrasonic wave. (1) Automatically repeated discrimination analysis method can be devided in the category of all kind of defects on IC package, and also can be possible to have a sampling of partial delamination. (2) It is possible that the information of edge section in silicon chip surrounding can be extractor by the partial image processing of IC package. Also, the crack detection is possible between the resin part and lead frame.

• Journal of the Korean Society for Precision Engineering
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• v.1 no.3
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• pp.52-70
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• 1984

This paper presents a micro-computer simulation package for the various vibratory systems. The Package consists of 10 programs which describe the dynamical characteristics of the vibratory system. The programs have been written in BASIC (Appoesoft) language and programmed on the 6502 CPU with 48 KRAM. This simulation package is stored in 5 $^1/_4$ inch floppy disk. The user requires no simulation expertise on the part of designer. Through a process of disk operation, the user can easily under- stand how to use this package.

• Journal of Mechanical Science and Technology
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• v.18 no.9
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• pp.1572-1581
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• 2004

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.2897-2899
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAR, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering Problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.49-55
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• 2016

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.