• Transactions on Electrical and Electronic Materials
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• 제2권3호
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• pp.28-32
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• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• 농촌계획
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• 제18권4호
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• pp.141-152
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• 2012

Recently the package design for agricultural product of farm stay is great interests for increasing the income of farmers and villages as it may fulfill the sensible needs of consumers who experience rural culture and farm stay. This paper presents the status of the package design for agricultural product of farm stay and proposed improvements to the package design as following; 1)to diversify the packaging capacity, 2)to develop the cultural products to applicate the traditional crafts technique, 3)to provide institutional strategies for presenting the identity of farm or village, 4)to develop the education program about package design. We sampled fifty pilot farms or villages, analyse the package design of them and questionnaire surveyed farmers and managers in order to find problems and suggest improvements.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 D
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• pp.2568-2570
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• 2004

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new FEM (Finite Element Method) package in CEMTool environment. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words. Also, we can control the mesh in a very effective way With the introduction of new mesh generation algorithm and NDM (Hosted Dissection Method), our FEM package can guarantee the shorter computational time than MATLAB PDE Toolbox. In addition, using the advanced electromagnetics library of CEMTool FEM package, we can analyze the practical problems such as the motor field analysis. Consequently, with our new FEM package, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• 전자공학회논문지D
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• 제35D권4호
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• pp.61-70
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• 1998

The electrical performance of a package is extremely important for high speed digital system operations. CSP(chip scale package) is known to have better electrical performance than the convnetional packages. In this paper, the electrical performance of the BLP(bottom leaded plastic) package, a kind of CSP, has been alayzed by both simulation and real measurement. The electrical perfdormance of a BLP was compared with that of the conventioanl TSOP(thin small outline package). The leadinductanceand lead capacitance were used for the comparison purposes. The new BLP design provides much better electrical performance that TSOP package. It has about 40% favorable parameter values.

• Journal of Mechanical Science and Technology
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• 제18권3호
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• 한국전기전자재료학회논문지
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• 제29권2호
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• 정보처리학회논문지:컴퓨터 및 통신 시스템
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• 제11권4호
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• pp.119-126
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• 2022

본 연구는 폐쇄망에서 효율적이고 안전하게 패키지 관리 시스템을 사용하기 위해서 고려해야 할 할 중요 요소들과 그 방법론 들을 제시하는 것을 목적으로 한다. 관련 선행 연구의 분석을 통해 기존 패키지 관리에서 보안성을 위해 고려해야 할 사항들을 살펴보고, 이를 바탕으로 폐쇄망이라는 특수한 상황에서 고려해야 할 세부 방법들을 제안한다. 구체적으로, 새로운 패키지 관리 도구의 개발, 물리적 저장매체 활용, 로컬 백업 저장소 활용, 패키지 업데이트 및 다운그레이드 일괄 처리의 방법을 제안한다.

• 대한본초학회지
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• 제24권1호
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• pp.9-14
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• 2009

Objectives : The purpose of this study is to investigate on storage characteristics of flavouring oriental medicine materials according to Packaging method(Aluminum package, PP). Methods : This experiments were carried out by field survey and storage characteristics were carried out by physicochemical determination. Results : Flavouring oriental medicine materials were used to in aluminum package to keep original flavour in Japan and Chinese by field and study survey. In view of this survey results, it is very desirable to use zipper Aluminum package in flavouring oriental medicine materials(Perilla perfrutescens var. acuta, Mentha arvensis L. var. piperascens malinvaud). Conclusions : This study results revealed that Aluminum package were superior to any other package method on the basis of keeping original flavour and to reduce microbial contamination in oriental medicine materials.

• 한국포장학회지
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• 제26권2호
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• pp.71-76
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• 2020

CO₂ concentration in kimchi package has emerged recently as a potential index of product ripening to be monitored or sensed in intelligent packaging. Considering that addition of CO₂ absorber into the flexible kimchi package changes behavior of its CO₂ concentration, ripening of kimchi in total acidity, package CO₂ concentration in partial pressure (P_CO2) and package volume at 10℃ were estimated by mathematical model for two size packages included with different CO₂ absorbers. In small size package containing 0.5 kg of kimchi, relatively less gas permeable low density polyethylene (LDPE) sachet of the absorber was found to give rise of P_CO2 linearly correlated with acidity at acceptable conditions of absorber amount and size. The levels of P_CO2 at optimum ripening were different with absorber amount. However, highly gas permeable microporous spunbonded film (Tyvek) sachet did not show the linear relationship except a condition of 1.5 g of CO₂ absorbent. In large size package containing 2.0 kg, absorber sachets of LDPE and Tyvek could give the linear relationship between product acidity and package P_CO2 but at different levels (P_CO2 of package with LDPE sachet: 0.46~0.79 bar, P_CO2 of package with Tyvek sachet: 0.00~0.75 bar). The P_CO2 at optimal ripening was found to be less variable with LDPE sachets than with Tyvek ones. Use of package CO₂ concentration as an indicator of kimchi ripening was shown to be possible on the limited conditions where the linear relationship between them is established or confirmed.

• 한국염색가공학회지
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• 제18권3호
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• pp.16-22
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• 2006

Process contract has received considerable attention in silk degumming processes because of its critical role in quality assurance. In degumming, process exhibits shrinkage of high twisted yarn and lot-varying behavior, thus increasing the difficulties of reduction by conventional means. This necessitates the application of a package that adapts to changing degumming process, and a new approach involving package degumming is proposed. The gains of this process are prevent of shrinkage by package winding, which is simplified by reduced soft-winding or re-twisting process. The approach is expected to achieve high quality results in conventional process due to its feature of demage by tension and rubbing. Therefore package degumming has many merits such as reduce of pilling and shrinkage, production expenses saving by process contract are expected of the simplified degumming process.