• 한국식품저장유통학회지
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• 제2권2호
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• pp.285-291
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• 1995

This study was performed to investigate the optimum moisture content and the best packaging method of dried persimmons for long term storage at room temperature. The package material to be used were 0.05mm polyethylene film, Wrap film, 0.08mm LDPE film exchanged nitrogen gas, and non package for untreated control. Before the storage, the initial moisture contents of dried persimmons were treated with 40%, 35% and 30%, respectively; 40% as traditional dryness, 35% as extending dry period one more week, and 30% as for two more weeks. The best package method was 0.08mm LDPE film exchanged nitrogen gas, and the optimum moisture control was 35%

• International journal of advanced smart convergence
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• 제9권3호
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• pp.145-152
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• 2020

When conducting a health screening, it is important to select the most appropriate hospitals for the screening items. There are various packages in the screening hospitals, and the screening items and price are very different for each package. In this paper, we provide a method of recommending the screening packages in consideration of the customer's preferences such as screening items and minimum matching ratio. First, after collecting package information of hospitals, information such as basic items and optional items in the package are extracted. Then, we determine whether the client's screening items exist in the basic item or optional item of the package and calculate the matching rate of the package. Finally, we recommend screening packages with the lowest price while meeting the minimum matching rate suggested by the client. For performance analysis, we implement a prototype for recommending screening packages and provide the experimental results. The performance analysis shows that the proposed approach provides a real-time response time and recommends appropriate packages.

• 대한전기학회논문지:전력기술부문A
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• 제53권2호
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• pp.111-120
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• 2004

This paper presents an application of Unified Modeling Language(UML) software technique for developing transmission pricing evaluation package. Also, this paper describes a transmission pricing algorithm applicable to a large-scale power system. The usage-based transmission pricing mechanism is very complex since it requires power flow analysis, fault current analysis, sensitivity evaluation of a transmission line, penalty factors calculation, transmission asset databases, and cost allocation rules, etc. For the efficient and flexible development of the transmission pricing package, a UML. approach is applied, which is composed of a use-case diagram, interaction diagram, class diagram, and package diagram using Rational Rose Unified Process(RUP). The designed transmission pricing package can be efficiently modified and reused as the market environments evolves since it is designed by Object-Oriented Programming(OOP).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 A
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• pp.441-443
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• 2002

This paper presents a window-based load management system (LMS) package developed as a decision-making tool in the competitive electricity market. The presented LMS package can help the users to monitor system load patterns, analyze their past energy consumption and schedule the future energy consumption. The LMS package can also provide the effective information on real-time energy/cost monitoring, consumed energy/cost analysis, demand schedule and cost-savings. The developed LMS package can be used to establish the optimal demand schedule and consumption strategy.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

• Journal of Mechanical Science and Technology
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• 제18권2호
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• pp.230-239
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• 2004

A compact model approach of a network of spring elements for elastic loading is presented for the thermal deformation analysis of BGA package assembly. High-sensitivity moire interferometry is applied to evaluate and calibrated the model quantitatively. Two ball grid array (BGA) package assemblies are employed for moire experiments. For a package assembly with a small global bending, the spring model can predict the boundary conditions of the critical solder ball excellently well. For a package assembly with a large global bending, however, the relative displacements determined by spring model agree well with that by experiment after accounting for the rigid-body rotation. The shear strain results of the FEM with the input from the calibrated compact spring model agree reasonably well with the experimental data. The results imply that the combined approach of the compact spring model and the local FE analysis is an effective way to predict strains and stresses and to determine solder damage of the critical solder ball.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.239-242
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• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• 한국전기전자재료학회논문지
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• 제18권6호
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• pp.506-509
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• 2005

This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.

• Food Science and Biotechnology
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• 제18권1호
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• pp.73-78
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• 2009

Processed meatball products were packaged in a passive package without oxygen scavenger as 1 control and 3 active packages of which have PP-based oxygen scavenger master batch materials (OSMB) of 40, 80, and 100%(w/w) in the middle layer and stored at 23 and $30^{\circ}C$ up to 9 months. Quality changes of packaged products were evaluated by measuring the oxygen concentration of the headspace in containers, thiobarbituric acid (TBA), color, and flavor. The oxygen concentration of the package having 100% OSMB was lower than those of 40 and 80%. The color changes and TBA values of the meat ball in the package containing 100% OSMB were the least among the treatments. Using principal component analysis (PCA), the control showed more flavor change than the packages containing oxygen scavenger. As a result, all active packages could extend the shelf life of the meatball products compared with that of the passive package.

• 천문학논총
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• 제30권2호
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• pp.675-677
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• 2015

A data simulator and reduction package for the Devasthal Optical Telescope Integral Field Spectrograph (DOTIFS) has been developed. Since data reduction for the Integral Field Spectrograph (IFS) requires complicated procedures due to the complex nature of the integral spectrograph, common reduction procedures are usually not directly applicable for such an instrument. Therefore, the development of an optimized package for the DOTIFS is required. The data simulator observes artificial object and simulates CCD images for the instrument considering various effects; e.g. atmosphere, sky background, transmission, spectrograph optics aberration, and detector noise. The data reduction package has been developed based on the outcomes from the DOTIFS data simulator. The reduction package includes the entire processes for the reduction; pre-processing, flat-fielding, and sky subtraction. It generates 3D data cubes as a final product, which users can use for science directly.