• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.123-127
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• 1997

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circles and medical world, An Ultrasonic wave transmitted from a focused beam transducer is being expected as a powerful tool for NDE of micro-defect. The ultrasonic NDE of the defect is based on the form of the wave reflected form the interface In this study, regarding to the thickness of film which is in opaque object and thickness measurement was done by MEM-cepstrum analysis of received ultrasonic wave. In measument results, film thickness which is beyond distance resolution capacity was measured accurately. Also, automatically repeated discrimination analysis method can be decided in the category of all kinds of defects on semiconductor package.

• Journal of Welding and Joining
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• 제9권3호
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• pp.41-51
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• 1991

The thermomechanical coupling phenomena in the resistance welding process is complicated due to interactions of mechanical, thermal and electrical factors. Although experimental investigations of resistance spot welding have been carried out, but there are a few by computer simulation. so the purpose of this research is to decrease the time and cost much required in experimental investigation by carrying out the analysis of the resistance spot welding process through computer simulation based on the finite element method. The tool used in the computer simulation is the commercial ANSYS program package. A two dimensional axisymetric model is used to simulate the resistance spot welding for two stainless steel sheets of equal thickness and parametric study is carried out for variable welding current, workpieces of unequal thickness and dissimilar materials. The results from the computer simulation are in good agreement with the experimental one. Through these results, such items as stress distribution, temperature profiles, thermal expansion and weld nugget formation are predicted. Reliability and applicability of finite element models have been demonstrated to simulate and to analyze the resistance spot welding process.

• 한국전기전자재료학회논문지
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• 제26권2호
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• 한국생산제조학회지
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• 제23권4호
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.

• 응용통계연구
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• 제23권5호
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• pp.933-941
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• 2010

행렬도는 고차원의 자료를 저차원 공간에 투영하여 자료를 시각화하는 비교적 현대적인 방법으로써, 자료의 산포도, 집단 구분, 변수사이의 상관관계 등 유용한 정보들을 제공한다. 본 연구에서는 이러한 행렬도를 간략하게 소개하고, 행렬도의 구현을 위해 대중성이 높아지고 있는 무료 소프트웨어인 R의 BiplotGUI 패키지를 사용하였다. 그리고 전북대학교에서 2009년도에 실시된 신입생의 진로의식 조사 자료를 이용하여, 신입생의 선호직업과 진로성숙도의 관계를 행렬도 분석방법으로 살펴보았다.

• Journal of Advanced Marine Engineering and Technology
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• 제40권2호
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• 한국멀티미디어학회논문지
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• 제19권4호
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• pp.747-755
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• 2016

Automated guided vehicles have been used for a long time to increase work efficiency in the logistics field, but it is difficult to apply to a variety of logistics sites due to either the restricted movement mechanism or expensive devices. In this paper, we present a flexible software architecture that is hardware-independent for a mobile power cart of the follow mode and implement it using a ROS software platform. Through the SCV analysis for the system functionalities, we design a package to track a user movement and a package to control a new hardware platform. It has an advantage to use a variety of movement algorithms and hardware platforms by applying the strategy pattern and the template method pattern for the design of a software architecture. Through the performance evaluation, we show that the proposed design is maintainable in terms of a software complexity and it detects a user's movement by obtaining a user skeleton information so that it can control a hardware platform to move at a certain distance.

• Composites Research
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• 제12권5호
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• pp.87-97
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• 1999

층상복합재료란 이종재료들을 적층하여 계면에서 확산에 의하여 새로운 금속조직을 제어하는 것으로 정의한다. 기계적 성질이 다른 금속이 결합하여 서로의 단점을 보완·개선함으로써 재료의 기계적 성질을 한층 더 향상시킬 뿐만 아니라, 동시에 전기적 성질도 향상시킬 수 있는 재료로 그 종류는 다양하며 용도도 광범위하다. 본 연구에서는 Al/Cu 피복이종복합재료를 직·간적압출하는데 필요한 성형 조건을 도출하기 위하여 유한요소 상용 package인 DEFORM을 이용하여 이종복합재료의 거동해석을 수행하였다. 압출해석에 필요한 물성치를 구하기 위하여 본 연구에서 제조한 재료를 이용하여 압축실험을 수행하였으며, 압출방법, 압출온도, 피복재의 두께 등의 변화에 다른 이종복합재료의 거동을 파악하였다. 또한 해석결과를 바탕으로 이종복합재료의 열간압출실험의 결과와 비교·검토하였다.

• 한국콘텐츠학회논문지
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• 제6권1호
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• pp.137-142
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• 2006

XML 문서가 웹 문서의 표준으로 자리 잡음에 따라 많은 정보들이 XML 문서 형식으로 표현되면서 XML 문서의 보안에 관한 요구도 커지고 있다. 현재까지의 XML 보안에 관한 연구는 암호화와 전자 서명 같은 통신상의 보안에 관한 연구가 중심이 되었으나 XML 문서가 방대해지고 복잡해짐에 따라 XML 문서에 대한 통신상의 보안뿐 아니라 관리적인 보안이 필요하게 되었다. 하지만 XML 문서의 암호화는 단순한 통신상의 보안만을 제공할 뿐 관리적 보안 요소인 다양한 사용자와 다양한 접근 권한 정책을 반영하지 못하고 있다. 본 논문에서는 XML 문서의 보안을 위해 주체별 권한 정책을 반영한 접근 제어를 보장하는 주체 기반 XML문서의 암호화 기법을 제안한다. 접근 제어를 보장하는 암호화를 수행함으로써 다양한 사용자의 다양한 권한 정책을 반영할 수 있다.