• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of $25{\mu}m$ and $3700{\mu}m$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Journal of Welding and Joining
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• 제16권4호
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
• /
• pp.205-208
• /
• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• 한국조리학회지
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• 제3권
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• pp.83-122
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• 1997

The purpose of this study is to inquire management satisfaction factors of cook, and to grope for the correlation of career, number of cook, income, and education. To attain the purpose of this study, questionnaire was developed through pilot test. Questionnaire scale was adopted 5 point. The SPSS package was utilized for the analyses of questionnaire. The method was Frequency analysis and Chi Square analysis. The results obtained from the above data-based analysis are concentrated on management satisfaction to cook, and management recruiting method.

• 소음진동
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• 제4권3호
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• pp.327-335
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• 1994

In this paper, to identify the dynamic characteristics of antenna system, the antenna is divided into 4 components and those were analyzed with a conventional FEM package MSC/NASTRAN. Using a Component Mode Synthesis Method, dynamic characteristics of total system is also identified. The Coherence of each component to total system is evaluated by using strain and kinetic component to total system is evaluated by using strain and kinetic energy. The improving strategy of dynamic characteristics is suggested by changing mass and stiffness of large coherence components.

• 한국자기공명학회논문지
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• 제10권1호
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• pp.1-37
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• 2006

General expressions for solid state NMR lines are described for transitions under static, magic angle spinning, and variable angle spinning conditions in the case where the principal axis system for the anisotropic chemical shift tensor is noncoincident with that of the quadrupole coupling tensor. It is demonstrated that solid state NMR powder pattern simulation program VMAS based on the conventional grid point method of integrating over the Euler angle space is fast enough in comparison with the POWDER simulation package and Gauss-point method.

• 오토저널
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• 제14권5호
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• pp.107-116
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• 1992

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circle and medical world. An Ultrasonic wave transmitted from a focused beam tranducer is being expected as a powerful tool for NDE of the delamination. The Ultrasonic NDE of the delamination is based on the form of the wave reflected from the interface. In this study results, automatically repeated discrimination analysis method can be devided in the category of all kinds of defects on semiconductor package, and also can be possible to have a sampling of partial delamination.

• Journal of applied mathematics & informatics
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• 제5권2호
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• pp.293-300
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• 1998

The numerical method is used to solve the Fredholm integral equation of the second kind with weak singular kernels using the Toeplitz matrices. The solution has a computing time requir-ment of O(N2) where 2N+1 is the number of discretization points used. Also the error estimate is computed. Some numerical Exam-ples are computed using the Mathcad package.

• 대한기계학회논문집A
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• 제20권11호
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• pp.3538-3548
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• 1996

In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2021년도 춘계학술대회
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• pp.463-465
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• 2021

현재 식품 포장 및 박스에 인쇄된 유통기한 검사 방법은 일부 제품만 샘플링하여 사람의 눈으로 검사하는 방법이다. 이러한 샘플링 검사는 극히 일부분의 제품만 검사 가능하다는 한계를 지니고 있다. 따라서 카메라를 활용한 정확한 검사가 요구된다. 본 논문에서는 제품 포장에 인쇄된 유통기한 결함 검출방법에 인공지능 기술인 딥 러닝 객체인식 기술 모델을 제안한다. 제안된 방법으로는 딥러닝 객체인식 모델 중에 Faster R-CNN 모델을 이용해 인쇄된 유통기한을 검출을 학습하고 Faster R-CNN 방법을 이용해서 수집된 칼라이미지를 그레이 이미지와 이진화 이미지로 변환한 이미지에 대해 각각 성능을 비교하고 검출 성능을 확인한다. 딥 러닝 기술에 적용한 박스에 인쇄된 유통기한 검출 성능은 기존 비전 검사기의 검출 성능과 비슷한 검출 성능을 보였다.