• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.63-67
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• 2021

In order to detect fires that may not be visible to the naked eye, an IoT module that uses changes in Carbon dioxide (CO₂) levels and temperature to effectively identify ambers (dying flames) was developed. Finite element analysis was then used to optimize the packaging for this module. Given the nature of ambers, the low power long range LoRa (Long Range) technology was used in the development of this module. To protect the module, a number of packages were designed, and comparative analysis performed on the stress generated when they fall. The results of which show that Model C showed the lowest stress. In addition, unlike other models in which stress concentration was predicted in the module mounting part of the package, in this model the stress concentration phenomenon was predicted in the wing part. It was therefore determined that this approach is ideal for protecting the internal module, and a package to which this was applied was manufactured.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Journal of the Society of Naval Architects of Korea
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• v.57 no.4
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• pp.182-190
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• 2020

This study reports a series of drop impact tests performed to generate denting damages on stiffened plates and their residual ultimate strength tests under axial compression. The models were fabricated of general structural steel, and each model has six longitudinal stiffeners and two transverse frames. Among six fabricated models, four were damaged, and two were left intact for reference. To investigate the effects of collision velocity and impact location on the extent of damage, the drop height and the impact location were changed in each impact test. After performing the collision tests, the ultimate axial compression tests were conducted to investigate the residual strengths of the damaged stiffened plates. Finite element analyses were also carried out using a commercial package Abaqus/Explicit. The material properties obtained from a quasi-static tensile tests were used, and the strain-rate sensitivity was considered. After importing the collision simulation results, the ultimate strength calculations were carried out and their results were compared with the test data for the validation of the finite element analysis method.

• Journal of the Korean Society of Clothing and Textiles
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• v.24 no.8
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• pp.1115-1124
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• 2000

The purpose of this study was 1) to determine physical properties, and subjective evaluation of sensation of sports socks with various type of fiber content and fabric structure, and 2) to develop regression equations for predicting each sensation from physical properties of socks. Thirty healthy male students participated in the wear test with ten replications. The ANOVA, Duncans multiple test, and multiple regression, and paired-t test were used in the statistical analysis, using an SAS package. The results of this study are as follows: 1. 100% cotton socks had higher absorbency and wickability among five different socks. Comfort sensation, tactile sensation and fit sensation of socks were significantly influenced by types of fiber content. People felt that polypropylene socks were less comfortable & slightly tighter, and cotton socks were drier than the other socks. Terry socks were warmer than single jersey socks. 2. The results of the regression analysis showed that tactile sensation of socks after exercise can be predicted from the cube of moisture permeability($R^2$=0.99), and fit sensation can be predicted from drop absorbency, moisture permeability, wickability in wale and weight($R^2$=-0.98).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.1-8
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• 2006

Higher density integration and adoption of new materials in advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, metal interconnects respond to applied voltages by electrochemical ionization and conductive filament formation, which leads to short-circuit failure of the electronic package. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in D.I. water and NaCl solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Pb was primarily ionized in both D.I. water and $Cl^{-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for ECM resistance of solder alloys.

• Journal of IKEEE
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• v.18 no.1
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• pp.152-158
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• 2014

It is very important to supply the diesel fuel from fuel tank to combustion chamber in case of cold start procedure. the paraffin hydrocarbons are easily solidified at low fuel temperature and it can be blocking the fuel supply to the high pressure fuel pump. In order to reduce the fuel crystallization (Waxing), it have been used to develop not only cold flow additives but also the proper mounting design of fuel filter. Block heater in the fuel filter assembly have been also contained to improve the cold start and prevent blocking the fuel supply in Common Rail Direct Injection System. we can obtain the fuel pressure drop and fuel flow rate, power consumption of fuel heater to have the cold flow evaluation test with the saperated and composited fuel heater at the low ambient temperature, Due to evaluating cold flow performance of two block heater, we knew that composited package fuel heater was the excellent cold flow performance compared to separated type and obtained the parameters of cold flow.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.10
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• pp.1644-1652
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• 2003

The monitor product is packed by cushioning materials because the monitor can be broken during transportation. However, the addition of the cushioning material increased the volume of the product. Therefore, it is required that the usage of cushioning material be minimized. In practice, design engineers have followed the ad hoc design with experiences of predecessors. Automation of the design process is very important for the reduction of engineering cost, and can be achieved by an excellent design process and software development. According to Axiomatic design, a design flow is defined and a software system is developed for automated design. At first, a basic model is defined. A user can modify the model from menus and design is carried out according to the input from the user. Finite element models are automatically generated based on the design. A nonlinear finite element analysis program called LS/DYNA3D is linked for the impact analysis. The process of Design of Experiments using orthogonal array is installed to minimize the maximum acceleration in drop test. Therefore, a new design can be proposed by the system. The program is designed according to the Independence Axiom of Axiomatic design. FRs and DPs of the software system are defined and decomposed by zigzagging process. Independent modules can be generated by analysis of the full design matrix and each module is coded as class in Object Oriented Programming (OOP). Design results are discussed.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.12
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• pp.123-128
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• 2021

Liquid dispensing systems are extensively used in various industries such as display, semiconductor, and battery manufacturing. Of the many types of dispensers, drop-on-demand piezoelectric jetting systems are widely used in semiconductor industries because of their ability to dispense minute volumes with high precision. However, due to the problems of nozzle clogging and undesirable dispensing behavior in these dispensers, which often result in device failure, the use of highly viscous fluids is limited. Accordingly, we studied the behaviors of droplet formation based on changes in viscosity. The effects of surface energy and the inner diameters of needle-type nozzles were also studied. Results showed that nozzles with lower surface energies reduced the ejection volume of droplets when a smaller nozzle diameter (0.21 mm in this study) was applied. These results indicate that the hydrophobic treatment of nozzle surfaces and the use of smaller nozzle diameters are critical factors enabling the use of highly viscous fluids in precision dispensing applications.