• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.49-55
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• 2016

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.

• Transactions on Electrical and Electronic Materials
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• v.2 no.3
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• pp.28-32
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• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Korean Management Science Review
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• v.10 no.2
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• pp.79-91
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• 1993

Strategic decisions related to the design of a physical distribution system can be classified into three basic components : facility location, transportation, inventory decisions. In this research the interdependence of those decisions are expressed in a mathematical model such that the total relevant cost of the system is minimized. We suggested a heuristic technique for solving the model. In broad terms, our solution technique combines a heuristic method for determining which candidate DCs to open and an exact method for minimizing costs given a set of open DCs. And we also developed a decision supporting package for the design of a physical distribution system.

• 제어로봇시스템학회:학술대회논문집
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• 1986.10a
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• pp.337-340
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• 1986

A software package CARDS for general purpose robot design, control, and simulation has been developed and is presented here. CARDS (Computer Aided Robot Design and Simulation) consists of a collection of standardized subroutine modules that carry out typical kineamatic, dynamic, and control computations so that the user only needs to write a main program that further defines a particular robot configuration and the task to be performed. It provides users a complete simulation environment, so that it will be a valuable engineering tool for mechanical designers as well as electric control designers.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.5
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• pp.536-543
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• 2009

Dynamic behaviour of a package of a microwave oven under the drop-impact conditions is evaluated by the finite element analysis and tests. PAM-CRASH software is used for the finite element analysis and the tests are performed according to the ISTA(International Safe Transit Association) specification. Results of the analyses are compared with those of the tests and accuracy is shown to be favourable. Under the drop-impact condition of the original design, severe deformation occurs and an improved design is proposed to reduce it. The approach presented in this research can be successfully applied to reduce costs and time required to develop new models of the microwave oven.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1286-1288
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• 1993

An analytical method for the optimum design of the minimum die size in power MOSFETs is presented. The proposed methodology considers the thermal resistance of the package and gives the minimum die area for desired drain current levels. The results are compared with experimental data and it is found that the die size mar be reduced if it is designed according to the proposed design procedure.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.4
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• pp.656-669
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• 2007

The RSS is a document format for syndicate a document maded by a WebSite. A document that made and syndicated to fit for this format is called a RSS feed or a feed. This paper presents the design of package for an RSS feed parser that analyzes an RSS feed and saves its informations. according to the RSS specification. This paper establishes an RSS grammar and an automata recognizing that grammar. Based on the automata, we design a package for classes that recognize elements of an RSS feed.

• Journal of the Korean Physical Society
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• v.73 no.11
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• pp.1750-1759
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• 2018

A complete code-package for gyrotron simulation to analyze its performance is under development in UNIST, Korea. We first time report the present status of the code-package named as UNIST Gyrotron Design Tool (UGDT). It can perform design simulations for gyrotron's interaction cavity, RF window, and the essential mode calculations including the study of mode competition. We will discuss about its salient features, theory, numerical implementation, and its calculation result for 95 GHz UNIST Gyrotron. Moreover, we will validate its capability to perform the mode competition calculation for fundamental and second harmonic modes.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.184-197
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• 1995

In this paper, high speed IC package-to-package interconnections are modeled as lossless multiconductor transmission lines operating in the TEM mode. And, three mathematical algorithms for computing electrical parameters of the lossless multiconductor transmission lines are described. A semi-analytic Green's function method is used in computing per unit length capacitance and inductance matrices, a matrix square root algorithm based on the QR algorithm is used in computing a characteristic impedance matrix, and a matrix algorithm based on the theory of M-matrix is used in computing a diagonally matched load impedance matrix. These algorithms are implemented in a computer program DIME (DIagonally Matched Load Impedance Extractor) which computes electrical parameters of the lossless multiconductor transmission lines. Also, to illustrate the concept of design database for high speed IC package-to-package interconnection, a database for the multi conductor strip transmission lines system is constructed. This database is constructed with a sufficiently small number of nodes using the multi-dimensional cubic spline interpolation algorithm. The maximum interpolation error for diagonally matched load impedance matrix extraction from the database is 1.3 %.